Every reference with a DOI in the deposited reference list resolved to a known
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The 34 checked references that resolve
resolves10.1063/1.111832Candela-class high-brightness InGaN/AlGaN double-heterostructure blue-light-emitting diodes
resolves10.1002/adv.20018Comparison of epoxy resins for applications in light‐emitting diodes
resolves10.1002/app.21896Cationic polymerization of hydrogenated bisphenol‐A glycidyl ether with cycloaliphatic epoxy resin and its thermal discoloration
resolves10.1021/ma9817572Percolational Effect of Siloxane Content in Poly(amideimide siloxane) on the Gas Permeation Behavior
resolves10.1002/pola.1990.080280303The synthesis, characterization, and photoinitiated cationic polymerization of silicon‐containing epoxy resins
resolves10.1021/cm040057aSynthesis of Epoxy-Functional Microspheres by Cationic Suspension Photopolymerization
resolves10.1002/app.22603Thermally initiated cationic polymerization and properties of epoxy siloxane
resolves10.1002/app.31702Thermal resistance of cycloaliphatic epoxy hybrimer based on sol‐gel derived oligosiloxane for LED encapsulation
resolves10.1016/j.matchemphys.2012.03.070Effect of thermal aging on the optical, dynamic mechanical, and morphological properties of phenylmethylsiloxane-modified epoxy for use as an LED encapsulant
resolves10.1021/nn4024587Multifunctional Graphene Sheets Embedded in Silicone Encapsulant for Superior Performance of Light-Emitting Diodes
resolves10.1016/j.polymdegradstab.2017.06.013Applications of polymer nanocomposites as encapsulants for solar cells and LEDs: Impact of photodegradation on barrier and optical properties
resolves10.1039/C7RA07195GStudy on the preparation and performance of low gas permeability trifluoropropyl phenyl silicone rubber
resolves10.1016/j.porgcoat.2006.08.008Synthesis of hybrid methacrylate-silicone-cyclohexanepoxide monomers and the study of their UV induced polymerization
resolves10.1016/j.optmat.2012.10.023Synthesis and properties of transparent cycloaliphatic epoxy–silicone resins for opto-electronic devices packaging
resolves10.1016/S0032-3861(00)00164-6Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins
resolves10.1002/app.33108Synthesis, characterization, and properties of silicone–epoxy resins
resolves10.1002/pat.1882Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application
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