Reference health
Contact resistivity and adhesion of copper alloy seed layer for copper-plated silicon heterojunction solar cells
24/24 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
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The 24 checked references that resolve
resolves10.1143/JJAP.31.3518
Development of New a-Si/c-Si Heterojunction Solar Cells: ACJ-HIT (Artificially Constructed Junction-Heterojunction with Intrinsic Thin-Layer)
resolves10.4229/28thEUPVSEC2013-2DV.3.51
Heterojunction Solar Cells with Electroplated Ni/Cu Front Electrode
resolves10.1109/JPHOTOV.2014.2321663
Silicon Heterojunction Solar Cells With Copper-Plated Grid Electrodes: Status and Comparison With Silver Thick-Film Techniques
resolves10.4229/EUPVSEC20142014-2CO.1.2
>23.1% High Efficiency Tunnel Oxide Junction Bifacial Solar Cell with Electroplated Cu Gridlines
resolves10.1016/j.solmat.2015.09.033
Tungsten doped indium oxide film: Ready for bifacial copper metallization of silicon heterojunction solar cell
resolves10.1109/PVSC.2013.6745109
Strategies of cost reduction and high performance on a-Si:H/c-Si heterojunction solar cells: 21% efficiency on monolike substrate
resolves10.1016/j.apsusc.2015.05.085
Screen-printed masking of transparent conductive oxide layers for copper plating of silicon heterojunction cells
resolves10.1063/1.4937224
Impact of carrier recombination on fill factor for large area heterojunction crystalline silicon solar cell with 25.1% efficiency
resolves10.3390/ma7021318
Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells
resolves10.1016/j.mseb.2006.06.023
Control of metal impurities in “dirty” multicrystalline silicon for solar cells
resolves10.1016/S0169-4332(00)00015-5
Electroplating of copper films on steel substrates from acidic gluconate baths
resolves10.1080/00218464.2015.1136929
Microstructural surface analysis of Ni/Cu front contact after peel force test to improve contact adhesion
resolves10.1109/JPHOTOV.2016.2576683
Study of Annealing Temperature for Ni/Cu/Ag Plated Front Contact Single Crystalline Solar Cells
resolves10.1016/j.matlet.2015.08.063
Improved adhesion of Ni/Cu/Ag plated contacts with thermally formed nickel silicon interface for C-SI solar cells
The 1 reference without a DOI — listed, not checked
no DOI — not checkedr11
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