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Change of viscoelastic properties of epoxy resin in the curing process

https://doi.org/10.1002/app.1977.070211215
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inferred← citeshttps://doi.org/10.2139/ssrn.4612929openalex-extracted
inferred← citeshttps://doi.org/10.5281/zenodo.15433549openalex-extracted
EFFECT OF DEGREE OF CURE AND TIME ON VISCOELASTIC POISSONS RATIO
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Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation
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Adhesive Network Formation: Continuum Mechanical Modelling and Simulation
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Analysis of the development of isotropic residual stresses in a bismaleimide/spiro orthocarbonate thermosetting resin for composite materials
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The curing behavior of resol. III. Effect of alkali metal hydroxides and alkaline earth metal hydroxides as catalyst for the cure of resol
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Anomalous behavior of cured epoxy resins: Density at room temperature versus time and temperature of cure
inferred← citeshttps://doi.org/10.1002/app.1989.070381113openalex-snapshot
Annealing studies on a fully cured epoxy resin: Effect of thermal prehistory, and time and temperature of physical annealing
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Competition between cure and thermal degradation in a high Tg epoxy system: Effect of time and temperature of isothermal cure on the glass transition temperature
inferred← citeshttps://doi.org/10.1002/pamm.201210192openalex-snapshot
A three‐phase model for polymer curing including diffusive motion and agglomeration of inclusions.
inferred← citeshttps://doi.org/10.1002/pc.29067openalex-snapshot
The effect of aging on the mechanical properties of bulk molding compound with different fiber lengths
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The disk cure test—an evaluation method for flow and curing characteristics of thermosetting molding compounds
inferred← citeshttps://doi.org/10.1002/pen.760210508openalex-snapshot
Monohole flow test with high‐frequency preheating for evaluating flowability of thermosetting compounds
inferred← citeshttps://doi.org/10.1007/3-540-48836-7_3openalex-snapshot
Viscoelastic Behavior of Epoxy Resins Before Crosslinking
inferred← citeshttps://doi.org/10.1007/978-3-030-81576-9_15openalex-snapshot
Degradation of Cure-Induced Stress Levels in Micro-electronics
inferred← citeshttps://doi.org/10.1007/978-3-319-22443-5_6openalex-snapshot
Characterisation of Viscoelastic Material Properties During Curing Processes
inferred← citeshttps://doi.org/10.1007/bf00611947openalex-snapshot
Deformation properties of polymeric composite materials during thermal aging
inferred← citeshttps://doi.org/10.1007/s00466-008-0344-5openalex-snapshot
A small-strain model to simulate the curing of thermosets
inferred← citeshttps://doi.org/10.1007/s00466-013-0929-5openalex-snapshot
Degree of cure-dependent modelling for polymer curing processes at small-strain. Part I: consistent reformulation
inferred← citeshttps://doi.org/10.1007/s11029-008-9009-xopenalex-snapshot
Thermomechanical analysis of a toughened thermosetting system
inferred← citeshttps://doi.org/10.1016/0015-0568(83)90051-9openalex-snapshot
Time and temperature dependence of flexural strength in transversal direction of fibres in CFRP
inferred← citeshttps://doi.org/10.1016/b978-0-08-101973-3.00009-2openalex-snapshot
Quantum-Dot-Filled Epoxy Nanocomposites With Enhanced Thermal, Mechanical, and Optical Properties
inferred← citeshttps://doi.org/10.1016/bs.aams.2015.10.003openalex-snapshot
Continuum Physics of Materials with Time-Dependent Properties
inferred← citeshttps://doi.org/10.1016/j.commatsci.2011.09.013openalex-snapshot
Modelling and computation of curing and damage of thermosets
inferred← citeshttps://doi.org/10.1016/j.eurpolymj.2010.06.002openalex-snapshot
Toward a constitutive model for cure-dependent modulus of a high temperature epoxy during the cure
inferred← citeshttps://doi.org/10.1016/j.ijmecsci.2025.110832openalex-snapshot
A statistically-based viscoelastic model for glass-forming polymers during cure
inferred← citeshttps://doi.org/10.1016/j.ijsolstr.2012.04.034openalex-snapshot
Modeling of curing processes based on a multi-field potential. Single- and multiscale aspects
inferred← citeshttps://doi.org/10.1016/j.ijsolstr.2015.01.010openalex-snapshot
Modelling the mechanical aspects of the curing process of magneto-sensitive elastomeric materials
inferred← citeshttps://doi.org/10.1016/j.mechmat.2024.105172openalex-snapshot
A cooperative relaxation model with two physical parameters for investigating the temperature and cure dependence of relaxation mechanisms in resins
inferred← citeshttps://doi.org/10.1016/j.polymertesting.2022.107701openalex-snapshot
Measuring and understanding cure-dependent viscoelastic properties of epoxy resin: A review
inferred← citeshttps://doi.org/10.1021/ma0624144openalex-snapshot
Viscoelastic Shear Response and Network Structure in Polycyanurates
inferred← citeshttps://doi.org/10.1080/09243046.2017.1310076openalex-snapshot
Evolution of viscoelastic behaviour of a curing LY5052 epoxy resin in the rubbery state
inferred← citeshttps://doi.org/10.1080/20550340.2016.1236223openalex-snapshot
Evolution of viscoelastic behavior of a curing LY5052 epoxy resin in the glassy state
inferred← citeshttps://doi.org/10.1080/20550340.2017.1348002openalex-snapshot
Cure-state dependent viscoelastic Poisson’s ratio of LY5052 epoxy resin
inferred← citeshttps://doi.org/10.1106/hlym-5cm7-bp9n-l1y1openalex-snapshot
Viscoelastic Properties of an Epoxy Resin during Cure
inferred← citeshttps://doi.org/10.1109/eptc.2003.1298698openalex-snapshot
Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm
inferred← citeshttps://doi.org/10.1115/1.2812254openalex-snapshot
Effect of Cure State on Stress Relaxation in 3501-6 Epoxy Resin
inferred← citeshttps://doi.org/10.1163/156855194x00187openalex-snapshot
Estimation of the flexural creep fracture strength of satin woven CFRP laminates1
inferred← citeshttps://doi.org/10.1177/00219983221115850openalex-snapshot
Does the viscoelastic behavior of fully cured epoxy depend on the thermal history during curing?
inferred← citeshttps://doi.org/10.1177/0361198119835530openalex-snapshot
Kinetic Viscoelasticity of Crosslinking Epoxy Asphalt
inferred← citeshttps://doi.org/10.1177/147776060201800301openalex-snapshot
Dielectric Cure Analysis of Epoxy Resins before Gelation
inferred← citeshttps://doi.org/10.19080/ajop.2021.05.555657openalex-snapshot
Study on Epoxy Nanocomposites Viscoelastic Properties through Dynamic Shear Rheological Analysis Method
inferred← citeshttps://doi.org/10.24423/aom.234openalex-snapshot
On the phenomenological representation of curing phenomena in continuum mechanics
inferred← citeshttps://doi.org/10.3390/polym15193856openalex-snapshot
Role of Bio-Based and Fossil-Based Reactive Diluents in Epoxy Coatings with Amine and Phenalkamine Crosslinker
inferred← citeshttps://doi.org/10.4325/seikeikakou.2.277openalex-snapshot
熱硬化性樹脂の残留応力発生機構とその定量化
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