On the public citation graph

Effects of Ga on Mechanical Properties and Microstructure of Cu–Sn–Ti Filler

https://doi.org/10.1002/pssa.202100203
0 signed · 31 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

Is this your work? Sign in with ORCID and put your name on the claims that are yours.
Claim with ORCID
Reference health. See whether every reference in this work resolves to a known work and none has been retracted — and get a dated CiteStamped badge you can embed.
See reference health

What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1002/adem.201400101openalex-snapshot
Phase Field Modeling of Microstructure Formation, DSC Curves, and Thermal Expansion for AgCu Brazing Fillers Under Reactive Air Brazing Conditions
inferredcites →https://doi.org/10.1007/bf02658305openalex-snapshot
The influence of the lath morphology on the yield stress and transition temperature of martensitic- bainitic steels
inferredcites →https://doi.org/10.1007/s10853-015-8859-6openalex-snapshot
Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates
inferredcites →https://doi.org/10.1007/s10854-009-0025-yopenalex-snapshot
Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder
inferredcites →https://doi.org/10.1007/s10854-015-3325-4openalex-snapshot
Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates
inferredcites →https://doi.org/10.1007/s11664-011-1639-4openalex-snapshot
Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates
inferredcites →https://doi.org/10.1016/j.actamat.2007.12.006openalex-snapshot
Application of single pan thermal analysis to Cu–Sn peritectic alloys
inferredcites →https://doi.org/10.1016/j.actamat.2016.06.009openalex-snapshot
Simultaneous enhancements of strength and toughness in an Al-12Si alloy synthesized using selective laser melting
inferredcites →https://doi.org/10.1016/j.actamat.2016.07.019openalex-snapshot
Additive manufacturing of metals
inferredcites →https://doi.org/10.1016/j.calphad.2010.12.006openalex-snapshot
Experimental investigation and thermodynamic assessment of the Cu–Sn–Ti ternary system
inferredcites →https://doi.org/10.1016/j.intermet.2012.10.004openalex-snapshot
The Cu–Sn phase diagram, Part I: New experimental results
inferredcites →https://doi.org/10.1016/j.intermet.2012.10.010openalex-snapshot
The Cu–Sn phase diagram part II: New thermodynamic assessment
inferredcites →https://doi.org/10.1016/j.jallcom.2010.05.129openalex-snapshot
Investigation of gap filling ability of Ag–Cu–In brazing filler metals
inferredcites →https://doi.org/10.1016/j.jallcom.2014.11.030openalex-snapshot
Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints
inferredcites →https://doi.org/10.1016/j.jallcom.2016.07.255openalex-snapshot
Study on novel Ag-Cu-Zn-Sn brazing filler metal bearing Ga
inferredcites →https://doi.org/10.1016/j.matchemphys.2010.07.001openalex-snapshot
Wetting of porous graphite by Cu–Ti alloys at 1373 K
inferredcites →https://doi.org/10.1016/j.matdes.2014.08.058openalex-snapshot
Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy
inferredcites →https://doi.org/10.1016/j.matlet.2015.05.076openalex-snapshot
Additive manufacturing of Cu–10Sn bronze
inferredcites →https://doi.org/10.1016/j.msea.2012.08.031openalex-snapshot
Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder
inferredcites →https://doi.org/10.1016/s1003-6326(07)60023-5openalex-snapshot
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad
inferredcites →https://doi.org/10.1016/s1875-5372(10)60087-2openalex-snapshot
Study on Microstructure and Property of Brazed Joint of AgCuZn-X(Ga, Sn, In, Ni) Brazing Alloy
inferredcites →https://doi.org/10.1179/1743280411y.0000000014openalex-snapshot
Laser additive manufacturing of metallic components: materials, processes and mechanisms
inferredcites →https://doi.org/10.1179/msc.1979.13.6.341openalex-snapshot
Effect of microstructure on cleavage fracture toughness of quenched and tempered steels

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4474427openalex-extracted
Exploring the Trace Rare Earth Sm on the Microstructure and Mechanical Performance of Brazed Diamonds by Ni-Cr Filler Metal
inferred← citeshttps://doi.org/10.2139/ssrn.4758042openalex-extracted
Promoting the Grinding Performance and Interfacial Characteristics of Brazed Diamond Using Ni-Cr Amorphous Filler Alloy Reinforced with Gd
inferred← citeshttps://doi.org/10.1007/s11837-025-07219-zopenalex-snapshot
Interfacial Characteristics and Wear Performance of Brazed Diamond Using Ni-Cr Amorphous Filler Alloy Reinforced with Gd
inferred← citeshttps://doi.org/10.1007/s40194-023-01467-wopenalex-snapshot
Effects of Ge on microstructure evolution of the Cu-based filler metal and the Cu-20Sn-10Ti-1Ga/diamond brazing mechanism
inferred← citeshttps://doi.org/10.1016/j.diamond.2022.109645openalex-snapshot
Effect of Y on interface characteristics and mechanical properties of brazed diamond with Ni Cr filler alloy
inferred← citeshttps://doi.org/10.1016/j.diamond.2023.110068openalex-snapshot
Exploring the role of indium on the microstructure evolution and interface bonding behavior of brazing diamond abrasive with modified Cu–Sn–Ti
inferred← citeshttps://doi.org/10.1016/j.jmrt.2023.07.201openalex-snapshot
Exploring the trace rare earth Sm on the microstructure and mechanical performance of brazed diamonds by Ni–Cr filler alloy
inferred← citeshttps://doi.org/10.1016/j.jmrt.2024.12.077openalex-snapshot
Control of peritectic phase content and its effect on properties of CuSn20P1 alloy by semi-solid rheological forming
Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.