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Fractional moiré strain analysis using digital imaging techniques

https://doi.org/10.1007/bf02320050

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/bf02319257openalex-snapshot

Half-fringe photoelasticity: A new approach to whole-field stress analysis

inferredcites →https://doi.org/10.1007/bf02324049openalex-snapshot

Basic optical law in the interpretation of moiré patterns applied to the analysis of strains—part 1

inferredcites →https://doi.org/10.1007/bf02326267openalex-snapshot

Techniques of fringe interpolation in moiré patterns

inferredcites →https://doi.org/10.1007/bf02326400openalex-snapshot

Sharpening and multiplication of moiré fringes

inferredcites →https://doi.org/10.1007/bf02328422openalex-snapshot

Basic optical law in the interpretation of moiré patterns applied to the analysis of strains—Part 2

inferredcites →https://doi.org/10.1007/bf02328534openalex-snapshot

Full-field displacement and strain rosettes by moiré interferometry

inferredcites →https://doi.org/10.1016/0008-8846(72)90064-6openalex-snapshot

Advanced strength of materials

inferredcites →https://doi.org/10.1016/b978-0-08-012974-7.50006-xopenalex-snapshot

Moiré Patterns formed by Line Gratings

inferredcites →https://doi.org/10.1016/c2013-0-05523-5openalex-snapshot

Moiré Fringes in Strain Analysis

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.1002/9780470827826.ch6openalex-snapshot

Modeling Validation Tools

inferred← citeshttps://doi.org/10.1007/0-387-32989-7_13openalex-snapshot

Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures

inferred← citeshttps://doi.org/10.1007/978-1-4684-7767-2_8openalex-snapshot

Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry

inferred← citeshttps://doi.org/10.1007/bf01349626openalex-snapshot

Strain measurement of structures with curved surface by means of personal computer-based picture processing

inferred← citeshttps://doi.org/10.1007/bf02322818openalex-snapshot

Constructing pure digital secondary moiré patterns

inferred← citeshttps://doi.org/10.1007/bf02325184openalex-snapshot

Exact interpretation of moiré fringe patterns in digital images

inferred← citeshttps://doi.org/10.1007/bf02325996openalex-snapshot

Phase-stepped fractional moiré

inferred← citeshttps://doi.org/10.1007/bf02326066openalex-snapshot

Logical moiré and its application

inferred← citeshttps://doi.org/10.1007/s11340-008-9167-8openalex-snapshot

Time Average Geometric Moiré—Back to the Basics

inferred← citeshttps://doi.org/10.1016/0143-8166(90)90018-5openalex-snapshot

Optical strain analysis of composite and monolithic materials

inferred← citeshttps://doi.org/10.1109/33.62535openalex-snapshot

In situ calibration of stress chips

inferred← citeshttps://doi.org/10.1109/33.62569openalex-snapshot

Transient thermal strain measurements in electronic packages

inferred← citeshttps://doi.org/10.1109/95.370756openalex-snapshot

Manufacturing stresses in the die due to the die-attach process

inferred← citeshttps://doi.org/10.1109/ecc.1989.77846openalex-snapshot

Determination of thermally induced deformations in electronic packages by Moire interferometry

inferred← citeshttps://doi.org/10.1109/ectc.1990.122280openalex-snapshot

In-situ calibration of stress chips

inferred← citeshttps://doi.org/10.1109/ectc.1993.346778openalex-snapshot

Analysis of the stresses in the chip's coating

inferred← citeshttps://doi.org/10.1109/ectc.1994.367623openalex-snapshot

Manufacturing stresses in die due to die attach process

inferred← citeshttps://doi.org/10.1109/iemt.1997.626939openalex-snapshot

Thermo-mechanical deformation of underfilled flip-chip packaging

inferred← citeshttps://doi.org/10.1109/itherm.1990.113312openalex-snapshot

Transient thermal strain measurements in electronic packages

inferred← citeshttps://doi.org/10.1109/stherm.1990.68485openalex-snapshot

Direct thermal strain measurements in electronic packages

inferred← citeshttps://doi.org/10.1109/ugim.1991.148159openalex-snapshot

Effect of geometry on the strain in electronic packages

inferred← citeshttps://doi.org/10.1111/j.1747-1567.1992.tb01267.xopenalex-snapshot

COLOR DIGITAL IMAGING SYSTEM FOR RICOLOR MOIRÉ ANALYSIS

inferred← citeshttps://doi.org/10.1111/j.1747-1567.1993.tb00271.xopenalex-snapshot

SOME IMPROVEMENT ON DIGITAL FRINGE-MULTIPLICATION METHODS

inferred← citeshttps://doi.org/10.1115/1.2792639openalex-snapshot

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

inferred← citeshttps://doi.org/10.1115/1.2905683openalex-snapshot

Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain

inferred← citeshttps://doi.org/10.1201/9781420034219.ch4openalex-snapshot

Electronic Packaging

inferred← citeshttps://doi.org/10.1299/jsmea1988.31.2_233openalex-snapshot

Development of a Strain Measurement Method for Non-Plane Specimens by Means of Computer Picture Processing

inferred← citeshttps://doi.org/10.1364/ao.28.004323openalex-snapshot

Fringe multiplication methods for digital interferometric fringes

inferred← citeshttps://doi.org/10.1364/ao.31.001813openalex-snapshot

Digital pure shear-strain moiré patterns

inferred← citeshttps://doi.org/10.1364/ao.32.004713openalex-snapshot

Interferometric methods with enhanced sensitivity by optical/digital fringe multiplication

inferred← citeshttps://doi.org/10.1364/ao.33.003705openalex-snapshot

New spin filters for interferometric fringe patterns and grating patterns

inferred← citeshttps://doi.org/10.1364/josaa.8.001591openalex-snapshot

Phase-shifting and logical moiré

inferred← citeshttps://doi.org/10.1557/proc-445-167openalex-snapshot

In‐Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip‐Chip Packaging Using Moiré Interferometry

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