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A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages
Investigations on elastic properties and electronic structures of α-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements
Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys
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