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The mechanical, electronic, optical and thermoelectric properties of two-dimensional honeycomb-like of XSb (X = Si, Ge, Sn) monolayers: a first-principles calculations
Influence behavior and mechanism of double-layer Gr stacking configuration on mechanical strength and thermoelectric transport properties of Cu/Gr composites
Comprehensive Enhancement of Mechanical Strength, Thermal Conductivity, and Oxidation Resistance of W/Cu Diffusion Bonding Joint Via Heterogeneous Interface Configuration Design
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