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Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC

https://doi.org/10.1007/s10836-020-05916-y

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/s10836-017-5675-8openalex-snapshot

Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure

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Driver ECG Measuring System With a Conductive Fabric-Based Dry Electrode

inferredcites →https://doi.org/10.1109/access.2018.2879640openalex-snapshot

TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement

inferredcites →https://doi.org/10.1109/jsen.2015.2485258openalex-snapshot

Temperature Compensation for a Six-Axis Force/Torque Sensor Based on the Particle Swarm Optimization Least Square Support Vector Machine for Space Manipulator

inferredcites →https://doi.org/10.1109/mhs.1995.494215openalex-snapshot

A new optimizer using particle swarm theory

inferredcites →https://doi.org/10.1109/tcad.2012.2236837openalex-snapshot

Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis

inferredcites →https://doi.org/10.1109/tcad.2014.2298198openalex-snapshot

Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels

inferredcites →https://doi.org/10.1109/tcad.2015.2474411openalex-snapshot

TSV Extracted Equivalent Circuit Model and an On-Chip Test Solution

inferredcites →https://doi.org/10.1109/tcpmt.2016.2631731openalex-snapshot

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

inferredcites →https://doi.org/10.1109/tcpmt.2017.2788896openalex-snapshot

Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC

inferredcites →https://doi.org/10.1109/test.2015.7342389openalex-snapshot

Contactless pre-bond TSV fault diagnosis using duty-cycle detectors and ring oscillators

inferredcites →https://doi.org/10.1109/tim.2015.2477240openalex-snapshot

Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing Capacitive Coupling

inferredcites →https://doi.org/10.1109/tnnls.2015.2424684openalex-snapshot

Sparse LSSVM in Primal Using Cholesky Factorization for Large-Scale Problems

inferredcites →https://doi.org/10.1109/tpel.2020.2967053openalex-snapshot

Local Demagnetization Fault Recognition of Permanent Magnet Synchronous Linear Motor Based on S-Transform and PSO–LSSVM

inferredcites →https://doi.org/10.1587/elex.14.20170590openalex-snapshot

Vernier ring based pre-bond through silicon vias test in 3D ICs

inferredcites →https://doi.org/10.20965/jaciii.2019.p0042openalex-snapshot

TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither

What points at this work

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inferred← citeshttps://doi.org/10.2139/ssrn.4111805openalex-extracted

Arctangent-Based Inertia Weight for Particle Swarm Optimization

inferred← citeshttps://doi.org/10.1109/tcpmt.2024.3456228openalex-snapshot

A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure

inferred← citeshttps://doi.org/10.1109/tcpmt.2025.3530519openalex-snapshot

Research on Multifault Testing Method for MIV Based on Grid Search and Random Forest

inferred← citeshttps://doi.org/10.1109/tvlsi.2025.3530526openalex-snapshot

An XGBoost-Based Method for Predicting the Location of MIV Open Fault

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