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Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging
Investigation of modified polyethylene glycol with nitrogen-containing purine groups as leveler for copper electroplating of through-holes with high aspect ratio of 10:1
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
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