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A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu

https://doi.org/10.1016/j.jmrt.2021.06.099
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Outgoing claims: the papers this work cites, builds on, or argues with.

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Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
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Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented nanotwinned Cu bumps

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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Micro-Cones Cu Fabricated by Pulse Electrodeposition for Solderless Cu-Cu Direct Bonding
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Atomic mechanisms of Cu–Cu low-temperature bonding dominated by plastic deformation
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Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications
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Unidirectional cross-interface grain growth in Cu–Cu direct bonding
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Molecular dynamics simulation of the direct bonding of (111)-oriented nanotwinned Cu and its related mechanical behavior
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Optimization effect of intercolumnar nanoscale grains on (111) oriented nanotwinned copper direct bonding below 250 °C
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Investigation of modified polyethylene glycol with nitrogen-containing purine groups as leveler for copper electroplating of through-holes with high aspect ratio of 10:1
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Molecular dynamics simulation of effect of thermal annealing on mechanical behavior of Cu-Cu joints
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Atomistic simulations of effects of nanostructure on bonding mechanism and mechanical response of direct bonding of (111)-oriented nanotwinned Cu
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Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain
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Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD
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Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding
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Effect of Grain Size on Cu-Cu Bonding Quality for Fine-Pitch Hybrid Bonding Application
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Fabrication and Reliability Analysis of Quasi-single Crystalline Cu Joints Using Highly <111>-oriented Nanotwinned Cu
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An Intensive Study of Effects of Orientations of Cu Bumps on Cu-Cu Direct Bonding for 3D Integration by Molecular Dynamics Simulation
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Study on Microstructure and Mechanical Properties of Silver and Silver-Indium Solid Solution Films Using Magnetron Sputtering
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Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly <111>-oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength
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Effect of Grain Structure on the Failure Mechanism of Cu/Cu3Sn Investigated Via Molecular Dynamic Simulations
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Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling
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Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps
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Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism
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Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging
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Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper
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