On the public citation graph

Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

https://doi.org/10.1021/acs.nanolett.7b03930
0 signed · 131 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

Is this your work? Sign in with ORCID and put your name on the claims that are yours.
Claim with ORCID
Reference health. See whether every reference in this work resolves to a known work and none has been retracted — and get a dated CiteStamped badge you can embed.
See reference health

What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1002/adem.200600129openalex-snapshot
Determination of Mechanical Properties of Copper at the Micron Scale
inferredcites →https://doi.org/10.1002/adma.200400835openalex-snapshot
Patterning: Principles and Some New Developments
inferredcites →https://doi.org/10.1002/adma.201502092openalex-snapshot
High‐Resolution Printing of 3D Structures Using an Electrohydrodynamic Inkjet with Multiple Functional Inks
inferredcites →https://doi.org/10.1002/adma.201504967openalex-snapshot
Template‐Free 3D Microprinting of Metals Using a Force‐Controlled Nanopipette for Layer‐by‐Layer Electrodeposition
inferredcites →https://doi.org/10.1002/adma.201604211openalex-snapshot
Additive Manufacturing of Metal Structures at the Micrometer Scale
inferredcites →https://doi.org/10.1002/smll.201302856openalex-snapshot
Hybrid Helical Magnetic Microrobots Obtained by 3D Template‐Assisted Electrodeposition
inferredcites →https://doi.org/10.1002/smll.201500177openalex-snapshot
Electrodeposition‐based 3D Printing of Metallic Microarchitectures with Controlled Internal Structures
inferredcites →https://doi.org/10.1016/j.actamat.2003.08.032openalex-snapshot
Mechanical behavior of nanocrystalline metals and alloys11The Golden Jubilee Issue—Selected topics in Materials Science and Engineering: Past, Present and Future, edited by S. Suresh
inferredcites →https://doi.org/10.1016/j.actamat.2004.12.031openalex-snapshot
Size dependence of mechanical properties of gold at the micron scale in the absence of strain gradients
inferredcites →https://doi.org/10.1016/j.actamat.2008.09.033openalex-snapshot
Effects of focused ion beam milling on the compressive behavior of directionally solidified micropillars and the nanoindentation response of an electropolished surface
inferredcites →https://doi.org/10.1016/j.actamat.2011.05.038openalex-snapshot
Emergence of strain-rate sensitivity in Cu nanopillars: Transition from dislocation multiplication to dislocation nucleation
inferredcites →https://doi.org/10.1016/j.actamat.2012.11.053openalex-snapshot
Nanostructure and surface effects on yield in Cu nanowires
inferredcites →https://doi.org/10.1016/j.biomaterials.2010.04.050openalex-snapshot
A review on stereolithography and its applications in biomedical engineering
inferredcites →https://doi.org/10.1016/j.electacta.2007.11.054openalex-snapshot
Pulse and pulse reverse plating—Conceptual, advantages and applications
inferredcites →https://doi.org/10.1016/j.electacta.2015.08.022openalex-snapshot
Orientation-controlled nanotwinned copper prepared by electrodeposition
inferredcites →https://doi.org/10.1016/j.msea.2007.01.046openalex-snapshot
FIB damage of Cu and possible consequences for miniaturized mechanical tests
inferredcites →https://doi.org/10.1021/acsnano.6b04761openalex-snapshot
Write–Read 3D Patterning with a Dual-Channel Nanopipette
inferredcites →https://doi.org/10.1021/nl2003076openalex-snapshot
Influence of Homogeneous Interfaces on the Strength of 500 nm Diameter Cu Nanopillars
inferredcites →https://doi.org/10.1021/nl902872wopenalex-snapshot
Fabrication and Microstructure Control of Nanoscale Mechanical Testing Specimens via Electron Beam Lithography and Electroplating
inferredcites →https://doi.org/10.1038/natrevmats.2016.19openalex-snapshot
Stabilizing nanostructures in metals using grain and twin boundary architectures
inferredcites →https://doi.org/10.1038/nature08929openalex-snapshot
Dislocation nucleation governed softening and maximum strength in nano-twinned metals
inferredcites →https://doi.org/10.1038/ncomms2768openalex-snapshot
Near-ideal theoretical strength in gold nanowires containing angstrom scale twins
inferredcites →https://doi.org/10.1038/nmat3646openalex-snapshot
Defective twin boundaries in nanotwinned metals
inferredcites →https://doi.org/10.1038/nnano.2012.116openalex-snapshot
Deformation mechanisms in nanotwinned metal nanopillars
inferredcites →https://doi.org/10.1039/c6nr05116bopenalex-snapshot
Orientation-dependent mechanical behaviour of electrodeposited copper with nanoscale twins
inferredcites →https://doi.org/10.1063/1.2177538openalex-snapshot
Probe-based electrochemical fabrication of freestanding Cu nanowire array
inferredcites →https://doi.org/10.1063/1.3068191openalex-snapshot
In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper
inferredcites →https://doi.org/10.1063/1.3489689openalex-snapshot
Erratum: “Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition” [Appl. Phys. Lett. 91, 254105 (2007)]
inferredcites →https://doi.org/10.1063/1.4973622openalex-snapshot
Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of environmental humidity
inferredcites →https://doi.org/10.1063/1.4984910openalex-snapshot
Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of nozzle speed and diameter
inferredcites →https://doi.org/10.1080/00202967.1991.11870897openalex-snapshot
Facts and Fiction about Pulse Plating
inferredcites →https://doi.org/10.1103/physrevb.80.104104openalex-snapshot
Effects of focused ion beam induced damage on the plasticity of micropillars
inferredcites →https://doi.org/10.1126/science.1081042openalex-snapshot
Near-Perfect Elastoplasticity in Pure Nanocrystalline Copper
inferredcites →https://doi.org/10.1126/science.1092905openalex-snapshot
Ultrahigh Strength and High Electrical Conductivity in Copper
inferredcites →https://doi.org/10.1126/science.1159610openalex-snapshot
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
inferredcites →https://doi.org/10.1126/science.1160777openalex-snapshot
Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper
inferredcites →https://doi.org/10.1126/science.1167641openalex-snapshot
Revealing the Maximum Strength in Nanotwinned Copper
inferredcites →https://doi.org/10.1126/science.1168375openalex-snapshot
Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes
inferredcites →https://doi.org/10.1126/science.1190496openalex-snapshot
Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds
inferredcites →https://doi.org/10.1126/science.aaf2093openalex-snapshot
Multiprocess 3D printing for increasing component functionality
inferredcites →https://doi.org/10.1146/annurev-matsci-070813-113304openalex-snapshot
Growth Twins and Deformation Twins in Metals
inferredcites →https://doi.org/10.1146/annurev-matsci-082908-145422openalex-snapshot
Plasticity of Micrometer-Scale Single Crystals in Compression
inferredcites →https://doi.org/10.1557/mrs.2016.60openalex-snapshot
Strengthening and plasticity in nanotwinned metals
inferredcites →https://doi.org/10.1557/mrs.2016.62openalex-snapshot
Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4046832openalex-extracted
Fabrication of Ag Complexes Based on Multidentate Ligands Toward High-Efficient and Facile Electroless Plating
inferred← citeshttps://doi.org/10.2139/ssrn.4496071openalex-extracted
inferred← citeshttps://doi.org/10.1002/adem.201800946openalex-snapshot
Toward Control of Microstructure in Microscale Additive Manufacturing of Copper Using Localized Electrodeposition
inferred← citeshttps://doi.org/10.1002/adem.201900961openalex-snapshot
Multiscale Additive Manufacturing of Metal Microstructures
inferred← citeshttps://doi.org/10.1002/adem.202200654openalex-snapshot
Simulation and Experimental Study on Metal Microstructure of Meniscus‐Confined Electrodeposition
inferred← citeshttps://doi.org/10.1002/adem.202301497openalex-snapshot
Localized Electrochemical Repair (LER) of Conductive Materials
inferred← citeshttps://doi.org/10.1002/adfm.201910491openalex-snapshot
Metals by Micro‐Scale Additive Manufacturing: Comparison of Microstructure and Mechanical Properties
inferred← citeshttps://doi.org/10.1002/celc.202201162openalex-snapshot
Optical Super‐Localisation of Single Nanoparticle Nucleation and Growth in Nanodroplets
inferred← citeshttps://doi.org/10.1002/smll.202205302openalex-snapshot
Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing
inferred← citeshttps://doi.org/10.1002/smll.202501320openalex-snapshot
Multiscale Microstructural and Mechanical Characterization of Cu–Ni Binary Alloys Reduced During Hydrogel Infusion‐Based Additive Manufacturing (HIAM)
inferred← citeshttps://doi.org/10.1002/smtd.202301341openalex-snapshot
Exploring the Potentials of Chitin and Chitosan‐Based Bioinks for 3D‐Printing of Flexible Electronics: The Future of Sustainable Bioelectronics
inferred← citeshttps://doi.org/10.1007/978-981-32-9433-2_9openalex-snapshot
Study of Residual Stress in Nickel Micro Parts Made by Electrochemical Additive Manufacturing
inferred← citeshttps://doi.org/10.1007/s00170-019-03292-2openalex-snapshot
A mathematical model of the deposition rate and layer height during electrochemical additive manufacturing
inferred← citeshttps://doi.org/10.1007/s00170-020-05799-5openalex-snapshot
A review: development of the maskless localized electrochemical deposition technology
inferred← citeshttps://doi.org/10.1007/s10008-025-06441-8openalex-snapshot
Electrochemical 3D printing: influence of slicing on the morphology and structure of deposited copper
inferred← citeshttps://doi.org/10.1007/s11665-025-11511-zopenalex-snapshot
Characterizations, Residual Stress and Corrosion Resistance of Nickel Coatings Printed by Meniscus-Confined Electrochemical Additive Manufacturing Process
inferred← citeshttps://doi.org/10.1007/s12206-026-0917-2openalex-snapshot
Microstructural refinement and fatigue crack healing in metals using high-density pulsed electric current
inferred← citeshttps://doi.org/10.1007/s41871-020-00058-3openalex-snapshot
A Method for Micropipette-Based Meniscus-Confined Electrodeposition of Microstructures Without Nozzle Clogging
inferred← citeshttps://doi.org/10.1016/b978-0-12-803581-8.11750-3openalex-snapshot
Composite Metamaterials: Types and Synthesis
inferred← citeshttps://doi.org/10.1016/j.addma.2021.102582openalex-snapshot
Additive manufacturing of three-dimensional intricate microfeatures by electrolyte-column localized electrochemical deposition
inferred← citeshttps://doi.org/10.1016/j.addma.2023.103796openalex-snapshot
A critical review of additive material manufacturing through electrochemical deposition techniques
inferred← citeshttps://doi.org/10.1016/j.apmt.2021.101085openalex-snapshot
Self-regulated parallel process 3-D array microfabrication with metal direct-write
inferred← citeshttps://doi.org/10.1016/j.apmt.2021.101138openalex-snapshot
Electrochemical gradients driven 3D printing of nano-twinned copper structures by direct current dynamic meniscus confined electrodeposition
inferred← citeshttps://doi.org/10.1016/j.apmt.2022.101415openalex-snapshot
Anomalous high strain rate compressive behavior of additively manufactured copper micropillars
inferred← citeshttps://doi.org/10.1016/j.cej.2026.175186openalex-snapshot
Angle controlled Laser-Meniscus confined electrodeposition: Multi-energy field coupling and microstructure forming mechanism
inferred← citeshttps://doi.org/10.1016/j.coelec.2020.05.007openalex-snapshot
Electrochemical nanomachining
inferred← citeshttps://doi.org/10.1016/j.elecom.2025.107997openalex-snapshot
Process compatibility analysis for hybrid electrochemical removal and accretion towards a multifunctional machine-tool: An application-oriented approach
inferred← citeshttps://doi.org/10.1016/j.eujim.2024.102337openalex-snapshot
Phytochemical profile by LC-MS/MS analysis and evaluation of antioxidant, antidiabetic, anti-Alzheimer, and anticancer activity of Onobrychis argyrea leaf extracts
inferred← citeshttps://doi.org/10.1016/j.ijmachtools.2021.103848openalex-snapshot
Review of additive electrochemical micro-manufacturing technology
inferred← citeshttps://doi.org/10.1016/j.ijmachtools.2025.104319openalex-snapshot
A novel strategy for electrochemical additive manufacturing: Femtosecond laser-assisted localized electrochemical deposition
inferred← citeshttps://doi.org/10.1016/j.jcat.2020.05.027openalex-snapshot
A gradient reduction strategy to produce defects-rich nano-twin Cu particles for targeting activation of carbon-carbon or carbon-oxygen in furfural conversion
inferred← citeshttps://doi.org/10.1016/j.jmapro.2025.01.048openalex-snapshot
A comprehensive research on polyethylene glycol assisted localized electrodeposition micro additive manufacturing method for fabricating high-quality 3D structures
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2025.118832openalex-snapshot
Influence of electrolyte pressure on localised electrochemical deposition quality
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2026.119267openalex-snapshot
Towards micro/nano-electrochemical additive manufacturing: A critical review
inferred← citeshttps://doi.org/10.1016/j.matdes.2023.111717openalex-snapshot
Strengthening of 3D printed Cu micropillar in Cu-Ni core-shell structure
inferred← citeshttps://doi.org/10.1016/j.matdes.2025.114310openalex-snapshot
Investigation of atom arrangement and defects evolution in Ni–Co alloy atomic-precision electrochemical 3D printing using molecular dynamics
inferred← citeshttps://doi.org/10.1016/j.matdes.2026.116361openalex-snapshot
Localized electrodeposition process and mechanical properties of complex structures
inferred← citeshttps://doi.org/10.1016/j.matlet.2020.128584openalex-snapshot
Thermal stability of microscale additively manufactured copper using pulsed electrodeposition
inferred← citeshttps://doi.org/10.1016/j.matlet.2022.133364openalex-snapshot
Electrical property-microstructure of copper interconnects printed by localized pulsed electrodeposition (l-PED)
inferred← citeshttps://doi.org/10.1016/j.mattod.2023.10.008openalex-snapshot
Emerging electrochemical additive manufacturing technology for advanced materials: Structures and applications
inferred← citeshttps://doi.org/10.1016/j.micron.2019.102738openalex-snapshot
A circuit model for SECCM and topographic imaging method in AC mode
inferred← citeshttps://doi.org/10.1016/j.msea.2019.138441openalex-snapshot
A microscale additive manufacturing approach for in situ nanomechanics
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2021.102053openalex-snapshot
High throughput electrochemically driven metal microprinting with multicapillary droplet cell
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2023.105796openalex-snapshot
Meniscus-confined electrochemical additive manufacturing of copper microstructures: Design, fabrication, characterization, and decorative art technology
inferred← citeshttps://doi.org/10.1016/j.mtsust.2024.100793openalex-snapshot
Electrochemical additive manufacturing of micro/nano functional metals
inferred← citeshttps://doi.org/10.1016/j.ohx.2026.e00831openalex-snapshot
A low-cost arduino-based pulsed constant-current platform for electrochemical nanostructure synthesis
inferred← citeshttps://doi.org/10.1016/j.optlastec.2026.115895openalex-snapshot
Frontier exploration of laser-assisted electrochemical deposition: from multidimensional optical-field control to multifunctional device integration
inferred← citeshttps://doi.org/10.1016/j.orgel.2021.106221openalex-snapshot
Maskless metal patterning by meniscus-confined electrochemical etching and its application in organic field-effect transistors
inferred← citeshttps://doi.org/10.1016/j.precisioneng.2021.01.011openalex-snapshot
Meniscus-confined electrodeposition of metallic microstructures with in-process monitoring of surface qualities
inferred← citeshttps://doi.org/10.1016/j.promfg.2019.06.139openalex-snapshot
Localized Electrochemical Deposition Using Ultra-High Frequency Pulsed Power
inferred← citeshttps://doi.org/10.1016/j.surfcoat.2023.129923openalex-snapshot
High-efficiency localized electrochemical deposition based on ultrafast laser surface modification
inferred← citeshttps://doi.org/10.1021/acs.analchem.5c04214openalex-snapshot
Study of the Mechanical Stability of Glass Nanopipettes under Force Loads
inferred← citeshttps://doi.org/10.1021/acs.cgd.6c00165openalex-snapshot
Recent Advances in Nanostructured Copper: From Fabrication to Applications
inferred← citeshttps://doi.org/10.1021/acs.jpcc.3c02985openalex-snapshot
Confined Etchant Layer Technique: An Electrochemical Approach to Micro-/Nanomachining
inferred← citeshttps://doi.org/10.1021/acs.langmuir.2c03239openalex-snapshot
Filament Growth and Related Instabilities during Adsorbate Suppressed Electrodeposition
inferred← citeshttps://doi.org/10.1021/acs.nanolett.1c02847openalex-snapshot
Bringing Electrochemical Three-Dimensional Printing to the Nanoscale
inferred← citeshttps://doi.org/10.1021/acsaelm.0c00570openalex-snapshot
Three-Dimensional Amorphous Ni–Cr Alloy Printing by Electrochemical Additive Manufacturing
inferred← citeshttps://doi.org/10.1021/acsami.0c01100openalex-snapshot
Direct-Write Printing Copper–Nickel (Cu/Ni) Alloy with Controlled Composition from a Single Electrolyte Using Co-Electrodeposition
inferred← citeshttps://doi.org/10.1021/acsami.1c01890openalex-snapshot
Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns
inferred← citeshttps://doi.org/10.1021/acsami.8b18730openalex-snapshot
Low-Cost Manufacturing of Metal–Ceramic Composites through Electrodeposition of Metal into Ceramic Scaffold
inferred← citeshttps://doi.org/10.1021/acsami.9b20911openalex-snapshot
Two-Photon-Assisted Polymerization and Reduction: Emerging Formulations and Applications
inferred← citeshttps://doi.org/10.1021/acssuschemeng.2c02241openalex-snapshot
Fabrication of Ag Complexes Based on Multidentate Ligands toward High-Efficient and Facile Electroless Plating
inferred← citeshttps://doi.org/10.1038/s41598-019-55640-7openalex-snapshot
A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates
inferred← citeshttps://doi.org/10.1039/c9na00166bopenalex-snapshot
Patterning Cu nanostructures tailored for CO 2 reduction to electrooxidizable fuels and oxygen reduction in alkaline media
inferred← citeshttps://doi.org/10.1039/c9nr05574fopenalex-snapshot
Directed nanoscale metal deposition by the local perturbation of charge screening at the solid–liquid interface
inferred← citeshttps://doi.org/10.1039/d0nr07076aopenalex-snapshot
Selective deposition of metal oxide nanoflakes on graphene electrodes to obtain high-performance asymmetric micro-supercapacitors
inferred← citeshttps://doi.org/10.1039/d0nr07236bopenalex-snapshot
Pulse electrodeposited, morphology controlled organic–inorganic nanohybrids as bifunctional electrocatalysts for urea oxidation
inferred← citeshttps://doi.org/10.1039/d1ce00143dopenalex-snapshot
Investigation of copper nanoscale electro-crystallization under directed and non-directed electrodeposition from dilute electrolytes
inferred← citeshttps://doi.org/10.1039/d1ta05581jopenalex-snapshot
High resolution electrochemical additive manufacturing of microstructured active materials: case study of MoS x as a catalyst for the hydrogen evolution reaction
inferred← citeshttps://doi.org/10.1039/d2ma00268jopenalex-snapshot
Towards three-dimensional nanoarchitectures: highly ordered bi-layer assembly of tailored magnetic nanowire arrays via template-assisted electrodeposition
inferred← citeshttps://doi.org/10.1063/1.5133878openalex-snapshot
A closed-loop constant deposition current control method based on MCED circuit model
inferred← citeshttps://doi.org/10.1063/5.0086665openalex-snapshot
Computational analysis of copper electrodeposition into a porous preform
inferred← citeshttps://doi.org/10.1080/10426914.2023.2190383openalex-snapshot
Experimental investigation of localized electrochemical deposition-based micro-additive manufacturing process
inferred← citeshttps://doi.org/10.1080/17452759.2021.1989751openalex-snapshot
A flow-rate-controlled double-nozzles approach for electrochemical additive manufacturing
inferred← citeshttps://doi.org/10.1088/2631-7990/ac3963openalex-snapshot
Localized electrodeposition micro additive manufacturing of pure copper microstructures
inferred← citeshttps://doi.org/10.1088/2631-7990/ad8733openalex-snapshot
Self-adjusting voxelated electrochemical three-dimensional printing of metallic microstructures
inferred← citeshttps://doi.org/10.1089/3dp.2022.0238openalex-snapshot
The Roles of Microprobe in Localized Electrodeposition: Electrolyte Localized Transport and Force-Displacement Sensitivity
inferred← citeshttps://doi.org/10.1109/3m-nano65639.2025.11261204openalex-snapshot
Meniscus-Confined Electrodeposition of Noncircular Structures: Control of Deposition Morphology by Liquid Surface Confinement
inferred← citeshttps://doi.org/10.1109/pvsc.2018.8548051openalex-snapshot
Morphology Modification of Sn and Zn Metal Thin Films Applied for CZTSe Solar Cell: the Effect of Pulse Current Electrodeposition
inferred← citeshttps://doi.org/10.1146/annurev-anchem-091522-122334openalex-snapshot
Beginner's Guide to Micro- and Nanoscale Electrochemical Additive Manufacturing
inferred← citeshttps://doi.org/10.1149/1945-7111/ab897copenalex-snapshot
The Ultrahigh-Rate Growth of Nanotwinned Copper Induced by Thiol Organic Additives
inferred← citeshttps://doi.org/10.1149/1945-7111/ac9e20openalex-snapshot
Electrodeposition of Nano-Twinned Cu and their Applications in Electronics
inferred← citeshttps://doi.org/10.1149/2.0051910jesopenalex-snapshot
Mechanisms of Localized Pulsed Electrodeposition (L-PED) for Microscale 3D Printing of Nanotwinned Metals
inferred← citeshttps://doi.org/10.1149/2.1291913jesopenalex-snapshot
Bipolar Electrochemistry Regulation for Dynamic Meniscus Confined Electrodeposition of Copper Micro-Structures by a Double-Anode System
inferred← citeshttps://doi.org/10.26434/chemrxiv-2024-9jpn4openalex-snapshot
Quality Assessment of Metal Traces Manufactured by Localized Electrochemical Deposition Printing and Electroless Plating
inferred← citeshttps://doi.org/10.26434/chemrxiv.8246897.v1openalex-snapshot
Dynamic Perturbation of the Electrical Double Layer with an Electrochemical AFM for Confined Metal Electrodeposition
inferred← citeshttps://doi.org/10.3390/met14091060openalex-snapshot
Morphological and Doping Effects on Electrical Conductivity of Aluminum Metal Substrate through Pulsed Electrodeposition Coating of Cu-MWCNT
Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.