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Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

https://doi.org/10.1021/acsapm.2c01415
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1002/adma.201807738openalex-snapshot
Advances in Polyimide‐Based Materials for Space Applications
inferredcites →https://doi.org/10.1002/aelm.202101029openalex-snapshot
Ultra‐Thin Chips with Printed Interconnects on Flexible Foils
inferredcites →https://doi.org/10.1002/anie.202110057openalex-snapshot
A Solid Transformation into Carboxyl Dimers Based on a Robust Hydrogen‐Bonded Organic Framework for Propyne/Propylene Separation
inferredcites →https://doi.org/10.1002/app.1986.070310110openalex-snapshot
Thermal expansion behavior of various aromatic polyimides
inferredcites →https://doi.org/10.1007/s10544-007-9059-1openalex-snapshot
Applying Taguchi methods for solvent-assisted PMMA bonding technique for static and dynamic μ-TAS devices
inferredcites →https://doi.org/10.1016/0032-3861(96)82914-4openalex-snapshot
Miscibility and phase properties of poly(aryl ether ketone)s with three high temperature all-aromatic thermoplastic polyimides
inferredcites →https://doi.org/10.1016/j.carbon.2017.12.023openalex-snapshot
Direct formation of wafer-scale single-layer graphene films on the rough surface substrate by PECVD
inferredcites →https://doi.org/10.1016/j.catcom.2016.03.019openalex-snapshot
Aerobic oxidation of amines to imines catalyzed by a ruthenium complex under solvent-free conditions
inferredcites →https://doi.org/10.1016/j.compositesb.2021.109412openalex-snapshot
Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets
inferredcites →https://doi.org/10.1016/j.ijadhadh.2014.09.002openalex-snapshot
The effect of laser irradiation on peel strength of temporary adhesives for wafer bonding
inferredcites →https://doi.org/10.1016/j.ijheatmasstransfer.2019.118896openalex-snapshot
Ablation of polyimide thin-film on carrier glass using 355 nm and 37 ns laser pulses
inferredcites →https://doi.org/10.1016/j.jechem.2020.09.043openalex-snapshot
Polyimide separators for rechargeable batteries
inferredcites →https://doi.org/10.1016/j.mser.2006.01.001openalex-snapshot
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
inferredcites →https://doi.org/10.1016/j.polymer.2015.08.054openalex-snapshot
High performance co-polyimide nanofiber reinforced composites
inferredcites →https://doi.org/10.1016/j.polymer.2021.123963openalex-snapshot
A comprehensive study of pyrazine-contained and low-temperature curable polyimide
inferredcites →https://doi.org/10.1016/j.polymer.2022.124660openalex-snapshot
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package
inferredcites →https://doi.org/10.1016/j.progpolymsci.2012.02.005openalex-snapshot
Advanced polyimide materials: Syntheses, physical properties and applications
inferredcites →https://doi.org/10.1016/j.progpolymsci.2019.01.004openalex-snapshot
Polyimides containing aliphatic/alicyclic segments in the main chains
inferredcites →https://doi.org/10.1016/s0924-0136(00)00467-2openalex-snapshot
355nm Nd:YAG laser ablation of polyimide and its thermal effect
inferredcites →https://doi.org/10.1021/ma5007073openalex-snapshot
Intrinsically Microporous Soluble Polyimides Incorporating Tröger’s Base for Membrane Gas Separation
inferredcites →https://doi.org/10.1038/nature12314openalex-snapshot
An ultra-lightweight design for imperceptible plastic electronics
inferredcites →https://doi.org/10.1038/pj.2012.222openalex-snapshot
Preparation of novel polyimide hybrid materials by multi-layered charge-transfer complex formation
inferredcites →https://doi.org/10.1039/c2cc35694eopenalex-snapshot
Solvent-assisted mechanochemistry
inferredcites →https://doi.org/10.1039/c4tc02854fopenalex-snapshot
Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity
inferredcites →https://doi.org/10.1039/c5nr07091kopenalex-snapshot
Using a low-temperature carbon electrode for preparing hole-conductor-free perovskite heterojunction solar cells under high relative humidity
inferredcites →https://doi.org/10.1039/c5tc02432copenalex-snapshot
A unique “cage–cage” shaped hydrophobic fluoropolymer film derived from a novel double-decker structural POSS with a low dielectric constant
inferredcites →https://doi.org/10.1039/c6ta02851aopenalex-snapshot
Enhanced photovoltaic performance and stability of carbon counter electrode based perovskite solar cells encapsulated by PDMS
inferredcites →https://doi.org/10.1063/1.1569657openalex-snapshot
Low-temperature thermal oxide to plasma-enhanced chemical vapor deposition oxide wafer bonding for thin-film transfer application
inferredcites →https://doi.org/10.1063/1.3517145openalex-snapshot
Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance
inferredcites →https://doi.org/10.1063/1.4903924openalex-snapshot
The soft-landing features of a micro-magnetorheological fluid damper
inferredcites →https://doi.org/10.1109/3dic.2009.5306550openalex-snapshot
Thin wafer handling — Study of temporary wafer bonding materials and processes
inferredcites →https://doi.org/10.1109/ectc.2011.5898650openalex-snapshot
Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications
inferredcites →https://doi.org/10.1109/ectc.2012.6248966openalex-snapshot
Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
inferredcites →https://doi.org/10.1109/ectc.2012.6249109openalex-snapshot
Microfluidic chips fabrication from UV curable adhesives for heterogeneous integration
inferredcites →https://doi.org/10.1109/ectc.2013.6575556openalex-snapshot
Analyzing the behavior and shear strength of common adhesives used in temporary wafer bonding
inferredcites →https://doi.org/10.1109/ectc.2013.6575558openalex-snapshot
Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging
inferredcites →https://doi.org/10.1109/ectc.2013.6575559openalex-snapshot
Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications
inferredcites →https://doi.org/10.1109/ectc32862.2020.00024openalex-snapshot
A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly
inferredcites →https://doi.org/10.1109/tcpmt.2016.2642208openalex-snapshot
Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications
inferredcites →https://doi.org/10.1109/tcpmt.2018.2871764openalex-snapshot
High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs
inferredcites →https://doi.org/10.1109/tepm.2008.2010776openalex-snapshot
Application of a Genetic Algorithm to the Design Optimization of a Multilayer Probe Card for Wafer-Level Testing
inferredcites →https://doi.org/10.1109/tii.2015.2413353openalex-snapshot
Structural Design and Control of a Small-MRF Damper Under 50 N Soft-Landing Applications
inferredcites →https://doi.org/10.1109/tii.2016.2518484openalex-snapshot
Multiobjective Dynamic Optimal Power Flow Considering Fuzzy-Based Smart Utilization of Mobile Electric Vehicles
inferredcites →https://doi.org/10.1109/tii.2016.2518643openalex-snapshot
Control of Wind-Diesel Microgrid Using Affine Projection-Like Algorithm
inferredcites →https://doi.org/10.1109/tpel.2013.2288334openalex-snapshot
State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography
inferredcites →https://doi.org/10.1116/1.1852467openalex-snapshot
Solvent-assisted polymer-bonding lithography
inferredcites →https://doi.org/10.3144/expresspolymlett.2020.62openalex-snapshot
Synthesis and characterization of a novel quaternary copolymerized thermoplastic copolyimide with excellent heat resistance, thermoplasticity, and solubility
inferredcites →https://doi.org/10.4071/2012dpc-wa15openalex-snapshot
Temporary Wafer Bonding Materials and Processes
inferredcites →https://doi.org/10.4071/imaps.260openalex-snapshot
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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Uv-Curable Naphthalene Resins Via Regulating Different Sites
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Uv-Curable Naphthalene Resins Via Regulating Different Sites
inferred← citeshttps://doi.org/10.1002/pc.28072openalex-snapshot
Construction of sandwich‐layered polyimide hybrid films containing double core–shell structured fillers for high energy storage density
inferred← citeshttps://doi.org/10.1002/slct.202506323openalex-snapshot
High‐Performance Polymers: Synthetic Strategies and Pendant Group Engineering for Advanced Electronic, Membrane, and Functional Material Applications
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Controlled interfacial debonding based on laser induced deformation-impact coupling effect for advanced packaging
inferred← citeshttps://doi.org/10.1016/j.memori.2025.100124openalex-snapshot
The application of organic materials used in IC advanced packaging:A review
inferred← citeshttps://doi.org/10.1016/j.memsci.2024.123338openalex-snapshot
Facile fabrication of robust and tight PIMs-based TFC hollow fiber membranes with a semi-interpenetrating polymer network via liquid phase cross-linking for organic solvent nanofiltration
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A strategy for the preparation of low dielectric FGQD/PSPI composite films in wafer-level packaging
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2025.114011openalex-snapshot
Novel aqueous development of polyimide patterning based on tert-ammonium side chains
inferred← citeshttps://doi.org/10.1016/j.optlastec.2023.110169openalex-snapshot
Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices
inferred← citeshttps://doi.org/10.1016/j.polymer.2024.127017openalex-snapshot
Preparation and characterization of thermo-processable poly(benzimidazole imide)s with soluble and high heat-resistance containing N-phenyl-benzimidazole
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New type of UV cured low dielectric naphthalene resin: Structure-activity relationship of different substitution sites
inferred← citeshttps://doi.org/10.1016/j.reactfunctpolym.2025.106230openalex-snapshot
High-performance thermoplastic polyimide enabled by ketone-based diamine monomer
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Construction of benzoheterocycle polyimides for improving the environmental weatherability of aluminum-plastic films in battery packs
inferred← citeshttps://doi.org/10.1021/acsapm.4c04026openalex-snapshot
Laser Debonding Induces the Carbonization of Polyimide: Carbonization Mechanism and Wettability Change under High-Pressure Conditions
inferred← citeshttps://doi.org/10.1021/acsapm.5c04614openalex-snapshot
Photo-Cross-Linkable Unsaturated Polyesters as Aqueous Depolymerizable Adhesives
inferred← citeshttps://doi.org/10.1021/acsmacrolett.5c00513openalex-snapshot
Water-Debondable Adhesive Polymer Networks Using Hyperbranched Polyglycerols
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Research on the Patterning Polyimide Layer Based on Laser Ablation Technology
inferred← citeshttps://doi.org/10.1021/acssuschemeng.3c01197openalex-snapshot
Green, Removable Adhesive Based on Graft Copolymers of Aliphatic Polyesters for Multiple Types of Substrates
inferred← citeshttps://doi.org/10.1038/s41598-025-22235-4openalex-snapshot
Design and thermal imidization of new 1,3-thiazine-based polyimides and copolyimides for high-performance corrosion inhibition
inferred← citeshttps://doi.org/10.1039/d4ra01408aopenalex-snapshot
Progress of research on the bonding-strength improvement of two-layer adhesive-free flexible copper-clad laminates
inferred← citeshttps://doi.org/10.1039/d5ra05693dopenalex-snapshot
Tailoring substrate adhesion via flexible chain architecture design in benzoheterocycle polyimide protective coatings
inferred← citeshttps://doi.org/10.1088/2631-7990/ad8a26openalex-snapshot
Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips
inferred← citeshttps://doi.org/10.1088/2631-7990/ae1db8openalex-snapshot
Laser-induced broad-spectrum strong absorption multiscale carbon-based nanofilms for photonic debonding based on the spatial confinement effect
inferred← citeshttps://doi.org/10.1109/3m-nano58613.2023.10305341openalex-snapshot
A Highly Compatible and Step-by-step Temporary Bonding and Debonding Strategy for Ultra-thin Wafer Level Package
inferred← citeshttps://doi.org/10.1109/icept67137.2025.11157372openalex-snapshot
High-temperature Resistant Wafer-level Temporary Bonding by W Release Layer for Diamond Growth
inferred← citeshttps://doi.org/10.1109/icept71373.2026.11690037openalex-snapshot
Mechanism of Adhesive Residue Formation in Laser Debonding and Development of a Plasma-Assisted Cleaning Process for Temporary Bonding Adhesives
inferred← citeshttps://doi.org/10.1109/icept71373.2026.11690389openalex-snapshot
Morphology and Wettability Evolution of Laser-Induced Carbon Residues during UV Laser Debonding
inferred← citeshttps://doi.org/10.3390/jcs8100436openalex-snapshot
Semi-Alicyclic Thermoplastic Polyimide Matrixes Based on Hydrogenated Pyromellitic Dianhydride and Asymmetrical 3,4′-Oxydianiline with Good Thermal Stability and Improved Optical Transparency
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