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Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study
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Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1002/jrs.822openalex-snapshot
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Incoming claims: where this work appears in other papers’ reference lists and arguments.
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inferred← citeshttps://doi.org/10.1016/j.tsf.2021.138671openalex-snapshot
Interface adhesion enhancement by condensed aromatic ring expansion of naphthalene imide derivatives for microvia metallization by copper electroplating
inferred← citeshttps://doi.org/10.1016/j.watres.2025.124097openalex-snapshot
Cooperating oxidative half-reaction deactivate electrocatalyst for nitrate reduction in real wastewater
inferred← citeshttps://doi.org/10.1016/s1452-3981(23)18261-7openalex-snapshot
Copper Underpotential Deposition on Gold in the Presence of Polyethylene Glycol and Chloride
inferred← citeshttps://doi.org/10.1021/acs.cgd.8b00916openalex-snapshot
Growth of Highly (111)-Oriented Nanotwinned Cu with the Addition of Sulfuric Acid in CuSO 4 Based Electrolyte
inferred← citeshttps://doi.org/10.1021/acs.jpcc.3c04286openalex-snapshot
Revisiting the Polyethylene Glycol-Chloride Adsorption Structure on Cu Electrode in Sulfuric Acid Solution by Wide-Frequency ATR-SEIRAS
inferred← citeshttps://doi.org/10.1021/acs.jpcc.5b06274openalex-snapshot
3-Mercapto-1-Propanesulfonate for Cu Electrodeposition Studied by in Situ Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy, Density Functional Theory Calculations, and Cyclic Voltammetry
inferred← citeshttps://doi.org/10.1021/acs.jpcc.5c04984openalex-snapshot
Synthesis and Evaluation of Novel Nitrogen-Containing Aromatic Heterocyclic Compounds as Levelers for Copper Electroplating
inferred← citeshttps://doi.org/10.1021/acs.jpcc.8b06644openalex-snapshot
SEIRAS Study of Chloride-Mediated Polyether Adsorption on Cu
inferred← citeshttps://doi.org/10.1021/acs.jpclett.2c02541openalex-snapshot
In Situ Wide-Frequency Surface-Enhanced Infrared Absorption Spectroscopy Enables One to Decipher the Interfacial Structure of a Cu Plating Additive
inferred← citeshttps://doi.org/10.1021/acs.langmuir.1c01595openalex-snapshot
Suppressing Sulfite Dimerization at a Polarized Gold Electrode/Water Solution Interface for High-Quality Gold Electrodeposition
inferred← citeshttps://doi.org/10.1021/acsanm.5c03288openalex-snapshot
Molecular-Weight-Directed Confinement Growth of CsCu2I3@PEG Nanocrystals: Morphology Control, Ultrastable Luminescence, and Multilevel Thermal Encryption for High-Efficiency LEDs
inferred← citeshttps://doi.org/10.1021/acsomega.4c01707openalex-snapshot
Electroplated Copper Additives for Advanced Packaging: A Review
inferred← citeshttps://doi.org/10.1021/jacs.5b10987openalex-snapshot
The Interplay of Al and Mg Speciation in Advanced Mg Battery Electrolyte Solutions
inferred← citeshttps://doi.org/10.1021/jp075358xopenalex-snapshot
Nanosized Cu2O/PEG400 Composite Hollow Spheres with Mesoporous Shells
inferred← citeshttps://doi.org/10.1021/jp1068522openalex-snapshot
Highly Sensitive and Selective “Turn-on” Calcium Cation Sensing from a Dendronic Terthiophene Tetraethylene Glycol (TEG) Molecule
inferred← citeshttps://doi.org/10.1021/jp2096086openalex-snapshot
Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives
inferred← citeshttps://doi.org/10.1021/jp8058933openalex-snapshot
PEG-Assisted Preparation of Single-Crystalline Cu2O Hollow Nanocubes
inferred← citeshttps://doi.org/10.1021/la3011508openalex-snapshot
Electrodeposition of Copper on a Pt(111) Electrode in Sulfuric Acid Containing Poly(ethylene glycol) and Chloride Ions as Probed by in Situ STM
inferred← citeshttps://doi.org/10.1021/la3025183openalex-snapshot
Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes
inferred← citeshttps://doi.org/10.1021/la302939fopenalex-snapshot
In Situ Video-STM Studies of Methyl Thiolate Surface Dynamics and Self-Assembly on Cu(100) Electrodes
inferred← citeshttps://doi.org/10.1038/s41598-024-68840-7openalex-snapshot
Novel 3D composite for efficient photocatalysis in environmental remediation
inferred← citeshttps://doi.org/10.1039/c1sm05568bopenalex-snapshot
F−- and H+-triggered reversible supramolecular self-assembly/disassembly probed by a fluorescent Ru2+ complex
inferred← citeshttps://doi.org/10.1039/c7ra06857copenalex-snapshot
4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper
inferred← citeshttps://doi.org/10.1039/c9ra10072eopenalex-snapshot
First-principles study of coadsorption of Cu 2+ and Cl − ions on the Cu (110) surface
inferred← citeshttps://doi.org/10.1039/d4nj05470aopenalex-snapshot
Filling performance of an Acid Blue 1 leveler on blind microvias
inferred← citeshttps://doi.org/10.1039/d4ra06688jopenalex-snapshot
Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives
inferred← citeshttps://doi.org/10.1039/d5im00073dopenalex-snapshot
On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation
inferred← citeshttps://doi.org/10.1080/00202967.2017.1256103openalex-snapshot
Electrochemical effect of Copper Gleam additives during copper electrodeposition
inferred← citeshttps://doi.org/10.1088/0960-1317/25/4/045005openalex-snapshot
A novel bottom–up copper filling of blind silicon vias in 3D electronic packaging
inferred← citeshttps://doi.org/10.1088/1757-899x/746/1/012002openalex-snapshot
Effect of Polyethylene Glycol and Chloride Ions on Local Electrochemical Deposition of Micro Copper Columns
inferred← citeshttps://doi.org/10.1088/2053-1591/aa52d0openalex-snapshot
Interaction of CuCl2 with poly(ethylene glycol) under microwave radiation
inferred← citeshttps://doi.org/10.1108/cw-05-2014-0019openalex-snapshot
Factors governing filling of blind via and through hole in electroplating
inferred← citeshttps://doi.org/10.1108/cw-09-2014-0037openalex-snapshot
Multiphysics coupling simulation of RDE for PCB manufacturing
inferred← citeshttps://doi.org/10.1109/ectc.2009.5074046openalex-snapshot
Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn
inferred← citeshttps://doi.org/10.1109/ectc.2018.00188openalex-snapshot
Optimization of Electrodeposited Copper for Sub 5 µm L/S Redistribution Layer Lines by Plating Additives
inferred← citeshttps://doi.org/10.1109/icept.2011.6066787openalex-snapshot
The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes
inferred← citeshttps://doi.org/10.1109/icept59018.2023.10492293openalex-snapshot
Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplating
inferred← citeshttps://doi.org/10.1109/icept59018.2023.10492348openalex-snapshot
Computational and experimental study of a novel L-Cysteine hydrochloride leveler for copper electroplated via fill in redistribution layers
inferred← citeshttps://doi.org/10.1116/1.2731341openalex-snapshot
Virtual integrated processing for integrated circuit manufacturing
inferred← citeshttps://doi.org/10.1116/1.2949233openalex-snapshot
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
inferred← citeshttps://doi.org/10.1134/s0040579518060064openalex-snapshot
Role of Macro- and Microdistribution in the Formation of Metal and Alloy Layers in the Production of Printed Circuits and Other Components of Electronic Devices
inferred← citeshttps://doi.org/10.1134/s1023193518140045openalex-snapshot
Predicting Microdistribution of Metal Electrodeposition Rate from Electrolytes with Positive and Negative Leveling Power
inferred← citeshttps://doi.org/10.1134/s1023193523020076openalex-snapshot
Capping Agents Effect Conducted Electrochemical Synthesis of NiMoCu Nanomushroom Catalyst for Hydrogen Evolution Reaction
inferred← citeshttps://doi.org/10.1143/jjap.45.3976openalex-snapshot
Aging Influence of Poly(ethylene glycol) Suppressors of Cu Electrolytes on Gaps Filling
inferred← citeshttps://doi.org/10.1143/jjap.51.05ea03openalex-snapshot
Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device
inferred← citeshttps://doi.org/10.1149/1.1814451openalex-snapshot
Adsorption of PEG on Au(111) Single-Crystal Electrodes and Its Influence on Copper Deposition
inferred← citeshttps://doi.org/10.1149/1.1849934openalex-snapshot
Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition
inferred← citeshttps://doi.org/10.1149/1.1849935openalex-snapshot
Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition
inferred← citeshttps://doi.org/10.1149/1.1867672openalex-snapshot
Effects of Additives on Copper Electrodeposition in Submicrometer Trenches
inferred← citeshttps://doi.org/10.1149/1.1878372openalex-snapshot
Role of Chloride Ions in Suppression of Copper Electrodeposition by Polyethylene Glycol
inferred← citeshttps://doi.org/10.1149/1.1882112openalex-snapshot
Chemical Mechanism of Suppression of Copper Electrodeposition by Poly(ethylene glycol)
inferred← citeshttps://doi.org/10.1149/1.1901670openalex-snapshot
Influence of Convection-Dependent Adsorption of Additives on Microvia Filling by Copper Electroplating
inferred← citeshttps://doi.org/10.1149/1.1915271openalex-snapshot
In Situ Ellipsometric Study of PEG∕Cl[sup −] Coadsorption on Cu, Ag, and Au
inferred← citeshttps://doi.org/10.1149/1.2035701openalex-snapshot
Electrochemical Nucleation of Copper on Ruthenium
inferred← citeshttps://doi.org/10.1149/1.2052019openalex-snapshot
Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating
inferred← citeshttps://doi.org/10.1149/1.2139952openalex-snapshot
Vibrational Spectroscopic and Mass Spectrometric Studies of the Interaction of Bis(3-sulfopropyl)-disulfide with Cu Surfaces
inferred← citeshttps://doi.org/10.1149/1.2168050openalex-snapshot
Electrochemical Characterization of Adsorption-Desorption of the Cuprous-Suppressor-Chloride Complex during Electrodeposition of Copper
inferred← citeshttps://doi.org/10.1149/1.2170587openalex-snapshot
An In Situ Ellipsometric Study of Cl[sup −]-Induced Adsorption of PEG on Ru and on Underpotential Deposited Cu on Ru
inferred← citeshttps://doi.org/10.1149/1.2206999openalex-snapshot
Competitive Adsorption of PEG, Cl[sup −], and SPS/MPS on Cu: An In Situ Ellipsometric Study
inferred← citeshttps://doi.org/10.1149/1.2335587openalex-snapshot
Microfluidic Studies of Adsorption and Desorption of Polyethylene Glycol during Copper Electrodeposition
inferred← citeshttps://doi.org/10.1149/1.2354456openalex-snapshot
Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling
inferred← citeshttps://doi.org/10.1149/1.2393013openalex-snapshot
Anion Effects on Cu–benzotriazole Film Formation
inferred← citeshttps://doi.org/10.1149/1.2431320openalex-snapshot
SPS Adsorption and Desorption during Copper Electrodeposition and Its Impact on PEG Adsorption
inferred← citeshttps://doi.org/10.1149/1.2434686openalex-snapshot
Effect of Additives on Shape Evolution during Electrodeposition
inferred← citeshttps://doi.org/10.1149/1.2710200openalex-snapshot
Potential Dependence of Competitive Adsorption of PEG, Cl[sup −], and SPS/MPS on Cu
inferred← citeshttps://doi.org/10.1149/1.2761461openalex-snapshot
In Situ Monitoring of Additives in Copper Plating Baths by Cyclic Voltammetric Stripping with a Microelectrode
inferred← citeshttps://doi.org/10.1149/1.2772425openalex-snapshot
Effect of Additives on Shape Evolution during Electrodeposition
inferred← citeshttps://doi.org/10.1149/1.2773629openalex-snapshot
SERS Examination of Saccharin Adsorption on Ni Electrodes
inferred← citeshttps://doi.org/10.1149/1.2834907openalex-snapshot
Effect of Cl[sup −] on the Adsorption–Desorption Behavior of PEG
inferred← citeshttps://doi.org/10.1149/1.2837874openalex-snapshot
Voltammetric Study of the Inhibition Effect of Polyethylene Glycol and Chloride Ions on Copper Deposition
inferred← citeshttps://doi.org/10.1149/1.2844391openalex-snapshot
Interactions of Chloride and Polyethylene Glycol in Acidic Copper Sulfate Electrolyte
inferred← citeshttps://doi.org/10.1149/1.2949091openalex-snapshot
Competitive Adsorption Between Bis(3-sodiumsulfopropyl disulfide) and Polyalkylene Glycols on Copper Electroplating
inferred← citeshttps://doi.org/10.1149/1.2953583openalex-snapshot
Relationship Between Molecular Structure and Removal Rates during Chemical Mechanical Planarization: Comparison of Benzotriazole and 1,2,4-Triazole
inferred← citeshttps://doi.org/10.1149/1.2958309openalex-snapshot
PEG, PPG, and Their Triblock Copolymers as Suppressors in Copper Electroplating
inferred← citeshttps://doi.org/10.1149/1.3010384openalex-snapshot
Inhibition of Copper Deposition by Polyethylene Glycol and Chloride
inferred← citeshttps://doi.org/10.1149/1.3058600openalex-snapshot
Adsorption and Desorption Kinetics of a Block Copolymer Wetting Agent Used in Copper Electroplating
inferred← citeshttps://doi.org/10.1149/1.3078405openalex-snapshot
Acceleration Kinetics of PEG, PPG, and a Triblock Copolymer by SPS during Copper Electroplating
inferred← citeshttps://doi.org/10.1149/1.3078407openalex-snapshot
Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide
inferred← citeshttps://doi.org/10.1149/1.3121212openalex-snapshot
Influence of Additives and the Effect of Aging in Modifying Surface Topography of Electrodeposited Copper
inferred← citeshttps://doi.org/10.1149/1.3211849openalex-snapshot
Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects
inferred← citeshttps://doi.org/10.1149/1.3239995openalex-snapshot
Influence of Additive Coadsorption on Copper Superfill Behavior
inferred← citeshttps://doi.org/10.1149/1.3298852openalex-snapshot
Accelerator Surface Phase Associated with Superconformal Cu Electrodeposition
inferred← citeshttps://doi.org/10.1149/1.3298890openalex-snapshot
The Influence of Specific Anion Adsorption on the Surface Roughness of Electrodeposited Polycrystalline Cu Films
inferred← citeshttps://doi.org/10.1149/1.3557758openalex-snapshot
MSA as a Supporting Electrolyte in Copper Electroplating for Filling of Damascene Trenches and Through Silicon Vias
inferred← citeshttps://doi.org/10.1149/1.3560479openalex-snapshot
Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions
inferred← citeshttps://doi.org/10.1149/1.3575636openalex-snapshot
Influence of Aromatic Functionality on Quaternary Ammonium Levelers for Cu Plating
inferred← citeshttps://doi.org/10.1149/1945-7111/ab8e86openalex-snapshot
Microelectrode Studies of S-NDR Copper Electrodeposition: Potentiodynamic and Galvanodynamic Measurements and Simulations
inferred← citeshttps://doi.org/10.1149/1945-7111/ab98a9openalex-snapshot
Structural Influence of Terminal Functional Groups on TEG-Based Leveler in Microvia Filling
inferred← citeshttps://doi.org/10.1149/1945-7111/ab9a05openalex-snapshot
Fabrication of CNT/Cu Composite Yarn via Single-Step Electrodeposition
inferred← citeshttps://doi.org/10.1149/1945-7111/abee5dopenalex-snapshot
Interfacial Leveler-Accelerator Interactions in Cu Electrodeposition
inferred← citeshttps://doi.org/10.1149/1945-7111/ac2beaopenalex-snapshot
Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias
inferred← citeshttps://doi.org/10.1149/1945-7111/ac4845openalex-snapshot
Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias
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