On the public citation graph

THE CURRENT DISTRIBUTION IN THROUGH-HOLE ELECTRODEPOSITION.I:MASS TRANSFER

https://doi.org/10.1080/00986440490276010
0 signed · 16 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

Is this your work? Sign in with ORCID and put your name on the claims that are yours.
Claim with ORCID
Reference health. See whether every reference in this work resolves to a known work and none has been retracted — and get a dated CiteStamped badge you can embed.
See reference health

What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1002/9783527613069.ch03openalex-snapshot
Electrochemical Systems
inferredcites →https://doi.org/10.1023/a:1003847219784openalex-snapshot
Copper deposition on micropatterned electrodes from an industrial acid copper plating bath
inferredcites →https://doi.org/10.1023/a:1017546028138openalex-snapshot
Modelling of through-hole electrodeposition Part I: Effect of electrical migration
inferredcites →https://doi.org/10.1023/a:1017550129955openalex-snapshot
Modelling of through-hole electrodeposition Part II: Experimental study
inferredcites →https://doi.org/10.1023/a:1018490410509openalex-snapshot
Cathodic polarization of copper electrode in CuCN–KCN solutions and the current distribution for copper deposition on grooved substrates
inferredcites →https://doi.org/10.1063/1.1761998openalex-snapshot
Pressure, Bernoulli Sum, and Momentum and Energy Relations in a Laminar Zone of Separation
inferredcites →https://doi.org/10.1080/00986440490276029openalex-snapshot
THE CURRENT DISTRIBUTION IN THROUGH-HOLE ELECTRODEPOSITION.II: TERTIARY CURRENT DISTRIBUTION
inferredcites →https://doi.org/10.1080/00986449208936022openalex-snapshot
MATHEMATICAL MODELING OF THROUGH-HOLE-PLATING IN ELECTROCHEMICAL MICROFABRICATION I. AXISYMMETRIC TWO-DIMENSIONAL FLUID FLOW
inferredcites →https://doi.org/10.1149/1.1837176openalex-snapshot
Modeling of Plated Through‐Hole Processes: I. Current Distribution
inferredcites →https://doi.org/10.1149/1.1837888openalex-snapshot
Finite‐Difference Simulation of Multi‐Ion Electrochemical Systems Governed by Diffusion, Migration, and Convection: Implementation in Parallel‐Plate Electrochemical Reactor and Backward‐Facing Step Geometries
inferredcites →https://doi.org/10.1149/1.2086349openalex-snapshot
Analysis of Convective Mass Transfer by Potential Relaxation: II . Transient Natural Convection Copper Deposition

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4065458openalex-extracted
inferred← citeshttps://doi.org/10.1016/j.colsurfa.2022.130238openalex-snapshot
Electrochemical behavior of through-hole electrodeposition inhibitor EO-PO under periodic pulse reverse
inferred← citeshttps://doi.org/10.1016/j.electacta.2025.146338openalex-snapshot
A novel inorganic leveler of sodium azide for high aspect ratio through-holes uniform Cu thickening with high throwing power by electronic plating
inferred← citeshttps://doi.org/10.1080/00986440490276029openalex-snapshot
THE CURRENT DISTRIBUTION IN THROUGH-HOLE ELECTRODEPOSITION.II: TERTIARY CURRENT DISTRIBUTION
inferred← citeshttps://doi.org/10.1149/2.0761512jesopenalex-snapshot
Improved Uniformity of Conformal Through-Hole Copper Electrodeposition by Revision of Plating Cell Configuration
Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.