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Anisotropic etching of Si

https://doi.org/10.1088/1361-6439/ab2b8d

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/bf00353993openalex-snapshot

Anisotropic etching of silicon crystals in KOH solution

inferredcites →https://doi.org/10.1007/bf00366880openalex-snapshot

Anisotropic etching of silicon crystals in KOH solution

inferredcites →https://doi.org/10.1007/s00542-012-1675-xopenalex-snapshot

Impact of alcohol additives concentration on etch rate and surface morphology of (100) and (110) Si substrates etched in KOH solutions

inferredcites →https://doi.org/10.1016/0040-6090(92)90701-copenalex-snapshot

High index plane selectivity of silicon anisotropic etching in aqueous potassium hydroxide and cesium hydroxide

inferredcites →https://doi.org/10.1016/0924-4247(92)80166-zopenalex-snapshot

Measurements of the anisotropic etching of a single-crystal silicon sphere in aqueous cesium hydroxide

inferredcites →https://doi.org/10.1016/b978-0-8155-1594-4.00024-3openalex-snapshot

Wet Etching of Silicon

inferredcites →https://doi.org/10.1016/c2013-0-19270-7openalex-snapshot

Handbook of Silicon Based MEMS Materials and Technologies

inferredcites →https://doi.org/10.1016/j.jcis.2004.09.059openalex-snapshot

Correlation between surface and bulk structures of alcohol–water mixtures

inferredcites →https://doi.org/10.1016/j.sna.2003.11.010openalex-snapshot

Etch rates and morphology of silicon (h k l) surfaces etched in KOH and KOH saturated with isopropanol solutions

inferredcites →https://doi.org/10.1016/j.sna.2004.09.017openalex-snapshot

Effects of various ion-typed surfactants on silicon anisotropic etching properties in KOH and TMAH solutions

inferredcites →https://doi.org/10.1016/j.sna.2005.08.022openalex-snapshot

Improvement in smoothness of anisotropically etched silicon surfaces: Effects of surfactant and TMAH concentrations

inferredcites →https://doi.org/10.1016/j.sna.2009.10.017openalex-snapshot

Ellipsometry study of the adsorbed surfactant thickness on Si{110} and Si{100} and the effect of pre-adsorbed surfactant layer on etching characteristics in TMAH

inferredcites →https://doi.org/10.1016/j.sna.2011.09.005openalex-snapshot

The effect of isopropyl alcohol concentration on the etching process of Si-substrates in KOH solutions

inferredcites →https://doi.org/10.1016/j.sna.2012.02.018openalex-snapshot

Silicon anisotropic etching in TMAH solutions containing alcohol and surfactant additives

inferredcites →https://doi.org/10.1016/j.sna.2017.09.022openalex-snapshot

The effect of monohydric and polyhydric alcohols on silicon anisotropic etching in KOH solutions

inferredcites →https://doi.org/10.1016/j.susc.2008.03.010openalex-snapshot

Development of etch hillocks on different Si(hkl) planes in silicon anisotropic etching

inferredcites →https://doi.org/10.1016/s0039-6028(00)00479-9openalex-snapshot

Macroscopic etch anisotropies and microscopic reaction mechanisms: a micromachined structure for the rapid assay of etchant anisotropy

inferredcites →https://doi.org/10.1016/s0924-4247(01)00639-2openalex-snapshot

The characteristic behavior of TMAH water solution for anisotropic etching on both Silicon substrate and SiO2 layer

inferredcites →https://doi.org/10.1016/s0924-4247(02)00265-0openalex-snapshot

The effect of alcohol additives on etching characteristics in KOH solutions

inferredcites →https://doi.org/10.1016/s0924-4247(03)00064-5openalex-snapshot

Characterization of the anisotropic chemical attack of (hhl) silicon plates in a TMAH 25 wt.% solution: micromachining and adequacy of the dissolution slowness surface

inferredcites →https://doi.org/10.1016/s0924-4247(97)01658-0openalex-snapshot

Characterization of orientation-dependent etching properties of single-crystal silicon: effects of KOH concentration

inferredcites →https://doi.org/10.1016/s0924-4247(99)00020-5openalex-snapshot

Characterization of the anisotropic chemical attack of {hk0} silicon plates in a T.M.A.H. solution

inferredcites →https://doi.org/10.1016/s0924-4247(99)00264-2openalex-snapshot

Differences in anisotropic etching properties of KOH and TMAH solutions

inferredcites →https://doi.org/10.1021/j100203a080openalex-snapshot

Excess partial molar free energies, enthalpies, and entropies in 2-butanone-water mixtures: solute-solute interactions

inferredcites →https://doi.org/10.1021/j100382a070openalex-snapshot

Excess partial molar free energies and entropies in aqueous tert-butyl alcohol solutions at 25.degree.C

inferredcites →https://doi.org/10.1021/jp0312722openalex-snapshot

“Icebergs” or No “Icebergs” in Aqueous Alcohols?: Composition-Dependent Mixing Schemes

inferredcites →https://doi.org/10.1063/1.1465409openalex-snapshot

Surface structure of aqueous 2-butoxyethanol mixtures studied by x-ray reflection

inferredcites →https://doi.org/10.1063/1.321787openalex-snapshot

Correlation of the anisotropic etching of single−crystal silicon spheres and wafers

inferredcites →https://doi.org/10.1088/0960-1317/15/3/008openalex-snapshot

Possibilities of extension of 3D shapes by bulk micromachining of different Si (h k l) substrates

inferredcites →https://doi.org/10.1088/0960-1317/15/6/007openalex-snapshot

The role of Triton surfactant in anisotropic etching of {1 1 0} reflective planes on (1 0 0) silicon

inferredcites →https://doi.org/10.1088/0960-1317/19/12/125011openalex-snapshot

Orientation- and concentration-dependent surfactant adsorption on silicon in aqueous alkaline solutions: explaining the changes in the etch rate, roughness and undercutting for MEMS applications

inferredcites →https://doi.org/10.1088/0960-1317/20/1/015019openalex-snapshot

Orientation-dependent surface morphology of crystalline silicon during anisotropic etching using a continuous cellular automaton

inferredcites →https://doi.org/10.1088/0960-1317/21/1/015008openalex-snapshot

Fabrication of novel microstructures based on orientation-dependent adsorption of surfactant molecules in a TMAH solution

inferredcites →https://doi.org/10.1088/0960-1317/21/11/115026openalex-snapshot

Investigation of Si(h k l) surfaces etched in KOH solutions saturated withtertiary-butyl alcohol

inferredcites →https://doi.org/10.1088/0960-1317/21/12/125007openalex-snapshot

Experimental procurement of the complete 3D etch rate distribution of Si in anisotropic etchants based on vertically micromachined wagon wheel samples

inferredcites →https://doi.org/10.1088/0960-1317/21/12/125008openalex-snapshot

Reliability assessment of the complete 3D etch rate distribution of Si in anisotropic etchants based on vertically micromachined wagon wheel samples

inferredcites →https://doi.org/10.1088/0960-1317/21/2/025021openalex-snapshot

Faster and exact implementation of the continuous cellular automaton for anisotropic etching simulations

inferredcites →https://doi.org/10.1088/0960-1317/22/6/065013openalex-snapshot

Etched profile control in anisotropic etching of silicon by TMAH+Triton

inferredcites →https://doi.org/10.1088/0960-1317/22/8/085020openalex-snapshot

Evolutionary determination of kinetic Monte Carlo rates for the simulation of evolving surfaces in anisotropic etching of silicon

inferredcites →https://doi.org/10.1088/0960-1317/24/9/095026openalex-snapshot

A detailed investigation and explanation of the appearance of different undercut profiles in KOH and TMAH

inferredcites →https://doi.org/10.1088/0960-1317/26/4/045013openalex-snapshot

Evidence for faster etching at the mask-substrate interface: atomistic simulation of complex cavities at the micron-/submicron-scale by the continuous cellular automaton

inferredcites →https://doi.org/10.1109/jmems.2008.916339openalex-snapshot

Analytical Solution of the Continuous Cellular Automaton for Anisotropic Etching

inferredcites →https://doi.org/10.1109/jmems.2013.2262590openalex-snapshot

Triton Surfactant as an Additive to KOH Silicon Etchant

inferredcites →https://doi.org/10.1117/12.2031165openalex-snapshot

Behavior of tensioactive compounds in the solutions for silicon anisotropic etching

inferredcites →https://doi.org/10.1143/jjap.49.056702openalex-snapshot

Silicon Micromachining Based on Surfactant-Added Tetramethyl Ammonium Hydroxide: Etching Mechanism and Advanced Applications

inferredcites →https://doi.org/10.1146/annurev.physchem.54.011002.103849openalex-snapshot

In Search of Perfection: Understanding the Highly Defect-Selective Chemistry of Anisotropic Etching

inferredcites →https://doi.org/10.1149/1.1568940openalex-snapshot

The Model of Etching of (hkl) Planes in Monocrystalline Silicon

inferredcites →https://doi.org/10.1149/1.1838668openalex-snapshot

Aqueous KOH Etching of Silicon (110): Etch Characteristics and Compensation Methods for Convex Corners

inferredcites →https://doi.org/10.1149/1.2056201openalex-snapshot

Surface Free Energy Model of Silicon Anisotropic Etching

inferredcites →https://doi.org/10.1149/1.2086277openalex-snapshot

Anisotropic Etching of Crystalline Silicon in Alkaline Solutions: I . Orientation Dependence and Behavior of Passivation Layers

inferredcites →https://doi.org/10.1149/1.2220767openalex-snapshot

On the Mechanism of Anisotropic Etching of Silicon

inferredcites →https://doi.org/10.1186/s40486-015-0012-4openalex-snapshot

A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching

inferredcites →https://doi.org/10.1186/s40486-017-0057-7openalex-snapshot

Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

inferredcites →https://doi.org/10.1201/9781315364926openalex-snapshot

Silicon Wet Bulk Micromachining for MEMS

inferredcites →https://doi.org/10.5281/zenodo.1314659openalex-snapshot

Study Of Fast Etching Of Silicon For The Fabrication Of Bulk Micromachined Mems Structures

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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inferred← citeshttps://doi.org/10.1007/978-3-031-20353-4_22openalex-snapshot

Etching Characteristics of Si{110} in NaOH Based Solution

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Effect of IPA on Micromachining Characteristics of Silicon in KOH-Based Solution

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inferred← citeshttps://doi.org/10.1016/j.sna.2020.111829openalex-snapshot

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inferred← citeshttps://doi.org/10.1016/j.sna.2022.113705openalex-snapshot

Polymer tunneling vibration sensors using hot embossing technique

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inferred← citeshttps://doi.org/10.1088/1361-6439/abcb67openalex-snapshot

Silicon Y-bifurcated microchannels etched in 25 wt% TMAH water solution

inferred← citeshttps://doi.org/10.1088/1361-6439/ac9b64openalex-snapshot

Wet bulk micromachining characteristics of Si{110} in NaOH-based solution

inferred← citeshttps://doi.org/10.1088/1361-6528/acc039openalex-snapshot

CuSCN/Si heterojunction near-infrared photodetector based on micro/nano light-trapping structure

inferred← citeshttps://doi.org/10.1088/1361-6641/ab5159openalex-snapshot

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Continuum level-set model for anisotropic wet etching of patterned sapphire substrates

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Silicon flow stop frame for encapsulation of CMOS microsensor chips by wet anisotropic etching in KOH

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inferred← citeshttps://doi.org/10.1109/dtip51112.2020.9139140openalex-snapshot

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微转印技术在光子器件异质集成中的应用(特邀)

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