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Static recrystallization simulations starting from predicted deformation microstructure by coupling multi-phase-field method and finite element method based on crystal plasticity
Modeling of Temperature- and Strain-Driven Intermetallic Compound Evolution in an Al-Mg System Via a Multiphase-Field Approach with Application to Refill Friction Stir Spot Welding
Physically Informed Data-Driven Approach to Unravel the Orientation Influenced Growth Behaviour of Interfacial Cu6sn5 Intermetallics Under Electric Current Stressing
Modeling of temperature- and strain-driven intermetallic compound evolution in an Al–Mg system via a multiphase-field approach with application to refill friction stir spot welding
Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation
Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing
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