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Thermal analysis and optimization of 2.5-D integrated voltage regulator
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1109/edaps.2010.5683029openalex-snapshot
A new methodology for IC-package thermal co-analysis in 3D IC environment
inferredcites →https://doi.org/10.1109/hpca.2008.4658633openalex-snapshot
System level analysis of fast, per-core DVFS using on-chip switching regulators
inferredcites →https://doi.org/10.1109/iccad.2008.4681639openalex-snapshot
ThermalScope: Multi-Scale Thermal Analysis for Nanometer-Scale Integrated Circuits
inferredcites →https://doi.org/10.1109/isscc.2006.1696189openalex-snapshot
A Multi-Stage Interleaved Synchronous Buck Converter with Integrated Output Filter in a 0.18/spl mu/ SiGe process
inferredcites →https://doi.org/10.1109/jssc.2004.842837openalex-snapshot
A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package
inferredcites →https://doi.org/10.1109/stherm.2010.5444314openalex-snapshot
Thermo-mechanical simulative study for 3D vertical stacked IC packages with spacer structures
inferredcites →https://doi.org/10.1145/1687399.1687521openalex-snapshot
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
inferred← citeshttps://doi.org/10.5281/zenodo.1253592openalex-extracted
Hipdn: A Power Distribution Network For Efficient On-Chip Power Delivery And Finegrain Low-Power Applications
inferred← citeshttps://doi.org/10.1007/978-3-319-19872-9_6openalex-snapshot
Automatic Layout Optimizations for Integrated MOSFET Power Stages
inferred← citeshttps://doi.org/10.1109/eit.2019.8833756openalex-snapshot
Voltage Regulator Thermal Matrix based Thread Allocation Optimization for a Multi-Core Processor
inferred← citeshttps://doi.org/10.1109/epeps.2016.7835419openalex-snapshot
Modeling and design of system-in-package integrated voltage regulator with thermal effects
inferred← citeshttps://doi.org/10.1109/ojpel.2020.3025658openalex-snapshot
Electrical and Thermal Characterization of an Inductor-Based ANPC-Type Buck Converter in 14 nm CMOS Technology for Microprocessor Applications
inferred← citeshttps://doi.org/10.1109/tcpmt.2016.2582904openalex-snapshot
Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs
inferred← citeshttps://doi.org/10.1109/tcpmt.2018.2856882openalex-snapshot
Design Exploration of Package-Embedded Inductors for High-Efficiency Integrated Voltage Regulators
inferred← citeshttps://doi.org/10.1109/tcpmt.2021.3124248openalex-snapshot
Multiphysics Challenges and Opportunities for Integrated Voltage Regulators in Power Delivery Architectures
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