On the public citation graph
Performance-cost optimization of a diamond heat spreader
0 signed · 19 inferred · view as graph
Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1016/s0038-1101(98)00216-0openalex-snapshot
Multilayer diamond heat spreaders for electronic power devices
inferredcites →https://doi.org/10.1063/1.356480openalex-snapshot
Temperature distributions in a heat dissipation system using a cylindrical diamond heat spreader on a copper heat sink
inferredcites →https://doi.org/10.1109/tcapt.2003.815088openalex-snapshot
Maximum thermal spreading resistance for rectangular sources and plates with nonunity aspect ratios
inferredcites →https://doi.org/10.1143/jjap.35.4852openalex-snapshot
Three-Dimensional Analysis of a Thermal Dissipation System with a Rectangular Diamond Heat Spreader on a Semi-infinite Copper Heat Sink
inferredcites →https://doi.org/10.1143/jjap.35.5796openalex-snapshot
A Rigorous Series Solution for Diamond Heat Spreaders with Temperature-Dependent Thermal Conductivity Used in Microwave Power Devices
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
inferred← citeshttps://doi.org/10.1016/j.icheatmasstransfer.2022.106193openalex-snapshot
Reduced graphene oxide films for reducing hotspot temperatures of electronic devices
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2022.105230openalex-snapshot
Mechanical properties and microstructure of large-area diamond/silicon bonds formed by pressure-assisted silver sintering for thermal management
inferred← citeshttps://doi.org/10.1080/10789669.2010.10390900openalex-snapshot
Review of Modern Spacecraft Thermal Control Technologies
inferred← citeshttps://doi.org/10.1109/edssc.2015.7285187openalex-snapshot
Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices
inferred← citeshttps://doi.org/10.1109/isse.2010.5547295openalex-snapshot
Characterization of the thermal impedance of high–power LED assembly based on innovative printed circuit board technology
inferred← citeshttps://doi.org/10.1109/tcpmt.2014.2315234openalex-snapshot
Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device
inferred← citeshttps://doi.org/10.1109/tcpmt.2014.2335203openalex-snapshot
Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
inferred← citeshttps://doi.org/10.1109/tcpmt.2015.2480077openalex-snapshot
Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices
inferred← citeshttps://doi.org/10.1115/1.4024594openalex-snapshot
Thermal Analysis of AlGaN/GaN HEMTs Using Angular Fourier-Series Expansion
inferred← citeshttps://doi.org/10.1115/imece2008-67068openalex-snapshot
Lead-Free, Fluxless Solder Joints to Synthetic Diamond
inferred← citeshttps://doi.org/10.2298/pac1402069mopenalex-snapshot
Characterizations of microwave plasma CVD grown polycrystalline diamond coatings for advanced technological applications
inferred← citeshttps://doi.org/10.31979/etd.3mq6-m6ajopenalex-snapshot
Optimal micro heat pipe configuration on high performance heat spreaders
inferred← citeshttps://doi.org/10.70675/caa011b1z6479z41f2zaa40z03da62d1d677openalex-snapshot
High-performance cooling of power semiconductor devices embedded in a printed circuit board
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