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Capability of biopolymers in electronics manufacturing

https://doi.org/10.1109/isse.2012.6273157
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Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1109/icmit.2010.5492715openalex-snapshot
Bio-based products: factors that influence their adoption
inferredcites →https://doi.org/10.1109/isee.1997.605221openalex-snapshot
Biobased epoxy resins for computer components and printed wiring boards
inferredcites →https://doi.org/10.1109/isse.2011.6053550openalex-snapshot
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
inferredcites →https://doi.org/10.1109/polytr.2007.4339141openalex-snapshot
Highly Functional Bioplastics (PLA compounds) Used for Electronic Products
inferredcites →https://doi.org/10.18419/opus-1520openalex-snapshot
Polylactide - Biologisch abbaubare Kunststoffe aus nachwachsenden Rohstoffen für neue Anwendungen

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4670837openalex-extracted
inferred← citeshttps://doi.org/10.1007/s10973-017-6382-5openalex-snapshot
Effect of metallization time on thermal stability of copper-plated polylactide
inferred← citeshttps://doi.org/10.1007/s12541-024-01027-2openalex-snapshot
Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
inferred← citeshttps://doi.org/10.1016/j.jclepro.2016.05.172openalex-snapshot
Life cycle assessment of flax-fibre reinforced epoxidized linseed oil composite with a flame retardant for electronic applications
inferred← citeshttps://doi.org/10.1016/j.procir.2014.07.059openalex-snapshot
A Lean Based Overview on Sustainability of Printed Circuit Board Production Assembly
inferred← citeshttps://doi.org/10.1016/j.surfcoat.2016.06.085openalex-snapshot
Laser modification of polylactide surface layer prior autocatalytic metallization
inferred← citeshttps://doi.org/10.1016/j.susmat.2024.e00902openalex-snapshot
Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
inferred← citeshttps://doi.org/10.1021/acsami.1c13787openalex-snapshot
Bioplastics and Carbon-Based Sustainable Materials, Components, and Devices: Toward Green Electronics
inferred← citeshttps://doi.org/10.1039/9781788018784-00033openalex-snapshot
Materials Used in Manufacturing Electrical and Electronic Products
inferred← citeshttps://doi.org/10.1088/1361-6528/ad66d3openalex-snapshot
Implementation of microcontroller board on a sustainable and degradable PLA/flax composite substrate: a case study
inferred← citeshttps://doi.org/10.1108/cw-07-2019-0074openalex-snapshot
Modelling of temperature distribution along PCB thickness in different substrates during reflow
inferred← citeshttps://doi.org/10.1109/iceice.2017.8192449openalex-snapshot
Development of printable electronic materials for low cost flexible sensor fabrication
inferred← citeshttps://doi.org/10.1109/icoei.2017.8300940openalex-snapshot
Flexible capacitive based printed sensor using different dielectrics for real time applications
inferred← citeshttps://doi.org/10.1109/isse.2014.6887557openalex-snapshot
Optimizing solder joints on biodegradable PCBs with vapour phase soldering
inferred← citeshttps://doi.org/10.1109/isse.2015.7247961openalex-snapshot
Experimental 13.56 MHz RFID cards on biodegradable substrates
inferred← citeshttps://doi.org/10.1109/isse.2016.7563157openalex-snapshot
Toward producing commercial electronics on biodegradable PCB substrates
inferred← citeshttps://doi.org/10.1109/isse.2017.8000884openalex-snapshot
Mechanical analysis of experimental sugar-based bioepoxy printed circuit boards
inferred← citeshttps://doi.org/10.1109/isse.2018.8443956openalex-snapshot
Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)
inferred← citeshttps://doi.org/10.1109/isse65583.2025.11121032openalex-snapshot
Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments
inferred← citeshttps://doi.org/10.1109/isse70010.2026.11600974openalex-snapshot
In Search of Appropriate Coatings on Biodegradable PLA/Flax PCB Substrates
inferred← citeshttps://doi.org/10.1109/ojnano.2022.3221273openalex-snapshot
Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review
inferred← citeshttps://doi.org/10.1109/sec62691.2024.00050openalex-snapshot
Tiny, Distributed, and Eco-Optimized: Proposal of Design Guidelines for Environmentally Friendly ML Devices
inferred← citeshttps://doi.org/10.1109/siitme.2013.6743641openalex-snapshot
Soldering tests with biodegradable printed circuit boards
inferred← citeshttps://doi.org/10.1109/siitme.2015.7342293openalex-snapshot
Investigating mechanical performance of PLA and CA biodegradable printed circuit boards
inferred← citeshttps://doi.org/10.1109/siitme63973.2024.10814873openalex-snapshot
Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates
inferred← citeshttps://doi.org/10.14314/polimery.2015.492openalex-snapshot
Autocatalytic metallization of polylactide
inferred← citeshttps://doi.org/10.14314/polimery.2017.457openalex-snapshot
Influence of the method of polylactide surface preparation for metallization process on the structure of deposited copper layer
inferred← citeshttps://doi.org/10.14314/polimery.2017.750openalex-snapshot
Effect of surface layer modification method on thermal stability of electroless metallized polylactide
inferred← citeshttps://doi.org/10.2166/wh.2023.141openalex-snapshot
Multidimensional applications and potential health implications of nanocomposites
inferred← citeshttps://doi.org/10.23919/empc44848.2019.8951848openalex-snapshot
Challenges of SMT assembling on biodegradable PCB substrates
inferred← citeshttps://doi.org/10.3311/ppee.9690openalex-snapshot
Advances in Producing Functional Circuits on Biodegradable PCBs
inferred← citeshttps://doi.org/10.3390/polym18020301openalex-snapshot
Biobased Polymers in Printed Electronics: From Renewable Resources to Functional Devices
inferred← citeshttps://doi.org/10.3390/pr13051360openalex-snapshot
Polylactic Acid and Polyhydroxybutyrate as Printed Circuit Board Substrates: A Novel Approach
inferred← citeshttps://doi.org/10.9790/019x-04032532openalex-snapshot
Investigating the Thermal and Mechanical Performance of Polylactic Acid (PLA) Reinforced with cellulose, wood fibers and Copolymer
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