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Monolithic 3D integration: A powerful alternative to classical 2D scaling

https://doi.org/10.1109/s3s.2014.7028194

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1109/essderc.2014.6948770openalex-snapshot

FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration

inferredcites →https://doi.org/10.1109/iedm.2008.4796670openalex-snapshot

Setting up 3D sequential integration for back-illuminated CMOS image sensors with highly miniaturized pixels with low temperature fully depleted SOI transistors

inferredcites →https://doi.org/10.1109/iedm.2013.6724540openalex-snapshot

Smart mobile SoCs driving the semiconductor industry: Technology trend, challenges and opportunities

inferredcites →https://doi.org/10.1109/iitc.2014.6831837openalex-snapshot

3D sequential integration opportunities and technology optimization

inferredcites →https://doi.org/10.1109/iwjt.2012.6212810openalex-snapshot

Laser Thermal Annealing: Enabling ultra-low thermal budget processes for 3D junctions formation and devices

inferredcites →https://doi.org/10.1109/iwjt.2014.6842057openalex-snapshot

Insights in accesses optimization for nFET low temperature Fully Depleted Silicon On Insulator devices

inferredcites →https://doi.org/10.1109/jetcas.2012.2223593openalex-snapshot

3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS

inferredcites →https://doi.org/10.1149/06405.0381ecstopenalex-snapshot

(Invited) Direct Bonding: A Key Enabler for 3D Monolithic Integration

inferredcites →https://doi.org/10.1149/1.2982853openalex-snapshot

Enabling 3D Monolithic Integration

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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Characteristics of High-Order Silane Based Si and Sige Epitaxial Growth Under 600°C

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Atomic Layer Deposition in Transistors and Monolithic 3D Integration

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Fundamental Challenges, Physical Implementations, and Integration Strategies for Ising Machines in Large‐Scale Optimization Tasks

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Memristive/CMOS Devices for Neuromorphic Applications

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Monolithic 3D Integration

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Conclusions

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Interconnect and Integration Technology

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