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The Effect of Cu CMP Pad Clean on Defectivity and Reliability

https://doi.org/10.1109/tsm.2013.2271385
0 signed · 12 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1016/0040-6090(95)06649-7openalex-snapshot
Initial study on copper CMP slurry chemistries
inferredcites →https://doi.org/10.1109/relphy.2006.251190openalex-snapshot
A Comprehensive Study of Low-k SiCOH TDDB Phenomena and Its Reliability Lifetime Model Development
inferredcites →https://doi.org/10.1116/1.1634958openalex-snapshot
Characterization of scratches generated by a multiplaten copper chemical–mechanical polishing process
inferredcites →https://doi.org/10.1117/12.485223openalex-snapshot
Characterization and reduction of copper chemical-mechanical-polishing-induced scratches
inferredcites →https://doi.org/10.1149/1.3694370openalex-snapshot
Development of Post-CMP Cleaners for Better Defect Performance
inferredcites →https://doi.org/10.5006/0010-9312-32.6.216openalex-snapshot
Topographies of Thick Cu-Benzotriazolate Films on Copper

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4067126openalex-extracted
inferred← citeshttps://doi.org/10.1016/b978-0-08-100165-3.00017-6openalex-snapshot
Approaches to defect characterization, mitigation, and reduction
inferred← citeshttps://doi.org/10.1016/b978-0-12-821791-7.00006-xopenalex-snapshot
Approaches to defect characterization, mitigation and reduction
inferred← citeshttps://doi.org/10.1016/j.mee.2022.111808openalex-snapshot
Effect of brush cleaning on defect generation in post copper CMP
inferred← citeshttps://doi.org/10.1149/2.006401jssopenalex-snapshot
Post Cu CMP Cleaning of Polyurethane Pad Debris
inferred← citeshttps://doi.org/10.1149/2162-8777/acfc64openalex-snapshot
Review—Post-Chemical Mechanical Planarization Cleaning Technology
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