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Application of Finite-Part Integrals to Planar Interfacial Fracture Problems in Three-Dimensional Bimaterials
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1007/bf00034743openalex-snapshot
Finite-part integral and boundary element method to solve embedded planar crack problems
inferredcites →https://doi.org/10.1007/bf02457547openalex-snapshot
An explicit tensor expression for the fundamental solutions of a bimaterial space problem
inferredcites →https://doi.org/10.1016/0020-7225(72)90010-9openalex-snapshot
Penny-shaped interface crack between an elastic layer and a half space
inferredcites →https://doi.org/10.1016/0020-7683(72)90053-4openalex-snapshot
The torsion problem of a disk bonded to a dissimilar shaft
inferredcites →https://doi.org/10.1016/0378-4754(82)90032-5openalex-snapshot
Progress in boundary element methods
inferredcites →https://doi.org/10.1093/qjmam/25.3.367openalex-snapshot
THE PENNY-SHAPED CRACK ON AN INTERFACE
inferredcites →https://doi.org/10.1115/1.2897711openalex-snapshot
Three-Dimensional Stress Fields of Elastic Interface Cracks
inferredcites →https://doi.org/10.1115/1.3173124openalex-snapshot
Crack Paralleling an Interface Between Dissimilar Materials
inferredcites →https://doi.org/10.1115/1.3173668openalex-snapshot
Elastic Fracture Mechanics Concepts for Interfacial Cracks
inferredcites →https://doi.org/10.1115/1.3422648openalex-snapshot
The Stress-Intensity Factor for a Penny-Shaped Crack Between Two Dissimilar Materials
inferredcites →https://doi.org/10.1115/1.3630064openalex-snapshot
Crack Point Stress Singularities at a Bi-Material Interface
inferredcites →https://doi.org/10.1299/jsme1958.28.217openalex-snapshot
On Integral Equation Methods for the Crack Problems
inferredcites →https://doi.org/10.1299/jsmea1988.32.4_485openalex-snapshot
Stress Analysis of the Vicinity of an Elliptical Crack at the Interface of Two Bonded Elastic Half Spaces
inferredcites →https://doi.org/10.1299/kikaia.58.39openalex-snapshot
Three-Dimensional BEM Analyses of Dissimilar Material Joints and Interface Cracks.
inferredcites →https://doi.org/10.1785/bssa0490020199openalex-snapshot
The stresses around a fault or crack in dissimilar media
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
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Experimental and Numerical Simulation Study of the Dynamic Crack Propagation and Fracture Properties of Bedding Shale Using Notched Semi-Circular Bend
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Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction
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Thermal stresses in a periodic two-layer space with an interface rigid inclusion under uniform heat flow
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Numerical solutions of singular integral equations for planar rectangular interfacial crack in three dimensional bimaterials
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Solution of nonstationary problems for composite bodies with cracks by the method of integral equations
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3D mode I crack analysis of piezoelectrics
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Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings
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Analyzing the interaction between collinear interfacial cracks by an efficient boundary element-free method
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Controlling parameter of the stress intensity factors for a planar interfacial crack in three-dimensional bimaterials
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Analysis of an arbitrarily shaped interface cracks in a three-dimensional isotropic thermoelastic bi-material. Part 1: Theoretical solution
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Extended displacement discontinuity method for an interface crack in a three-dimensional transversely isotropic piezothermoelastic bi-material. Part 2: Numerical method
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Extended displacement discontinuity method for an interface crack in a three-dimensional transversely isotropic piezothermoelastic bi-material. Part 1: Theoretical solution
inferred← citeshttps://doi.org/10.1016/j.ijsolstr.2019.10.020openalex-snapshot
Analysis of 3D planar crack problems of one-dimensional hexagonal piezoelectric quasicrystals with thermal effect. part II: Numerical approach
inferred← citeshttps://doi.org/10.1016/j.ijsolstr.2020.06.014openalex-snapshot
Numerical solutions of hypersingular integral equations for stress intensity factors of planar embedded interface cracks and their correlations with bimaterial parameters
inferred← citeshttps://doi.org/10.1016/j.mechmat.2004.06.005openalex-snapshot
Analysis of an elliptical crack parallel to graded interfacial zone of bonded bi-materials
inferred← citeshttps://doi.org/10.1016/j.tafmec.2024.104407openalex-snapshot
Dynamic impact experimental and global cohesive element method to shale fracture characterization
inferred← citeshttps://doi.org/10.1016/s0013-7944(01)00015-7openalex-snapshot
A novel hybrid finite element analysis of bimaterial wedge problems
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The role of flaw geometry in thin film delamination from two-dimensional interface flaws along free edges
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Analysis of stress intensity factors of a ring-shaped interface crack
inferred← citeshttps://doi.org/10.1016/s0167-6636(02)00327-7openalex-snapshot
Analysis of an elliptical crack parallel to a bimaterial interface under tension
inferred← citeshttps://doi.org/10.1016/s0307-904x(02)00126-9openalex-snapshot
Three-dimensional interfacial Green’s functions in anisotropic bimaterials
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Generalized Kelvin solution based boundary element method for crack problems in multilayered solids
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Application of finite-part integrals to three-dimensional fracture problems for piezoelectric media Part II: Numerical analysis
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Application of finite-part integrals to three-dimensional fracture problems for piezoelectric media Part I: Hypersingular integral equation and theoretical analysis
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On the three-dimensional problem of an interface crack under uniform heat flow in a bimaterial periodically-layered space
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Stress Concentration Near an Elliptic Crack in the Interface Between Elastic Bodies under Steady-State Vibrations
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Numerical Solution of Singular Integral Equations for Planar Rectangular Interfacial Crack in Three Dimensional Bimaterials
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Displacement discontinuity method for interfacial cracks in one-dimensional hexagonal quasi-crystal coating under thermal-mechanical loading
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A novel finite element analysis of three-dimensional circular crack
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Analysis of interfacial crack problems in three-dimensional magneto-electro-elastic bimaterials using hypersingular integral-differential equation method
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3D FRACTURE MECHANICS FOR A MODE I CRACK IN PIEZOELECTRIC MEDIA
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THREE-DIMENSIONAL ANALYSIS OF ARBITRARY-SHAPED CRACKS IN PIEZOELECTRIC SOLIDS UNDER SHEAR LOADING
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Variations of the stress intensity factors for a planar crack parallel to a bimaterial interface
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Stress Intensity Factor for a Planar Interfacial Crack in Three Dimensional Bimaterials
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Stress Intensity Factor for a Rectangular Interface Crack in Three Dimensional Bimaterials
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Variations of Stress Intensity Factors of a Planar Interfacial Crack Subjected to Mixed Mode Loading
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Stress intensity factors for interface elliptical cracks under uniform shear loadings
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Analysis of Stress Intensity Factors of a Planar Rectangular Interfacial Crack in Three Dimensional Bimaterials
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