On the public citation graph

Formation of Cu3Si and its catalytic effect on silicon oxidation at room temperature

0 signed · 67 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

Is this your work? Sign in with ORCID and put your name on the claims that are yours.
Claim with ORCID
Reference health. See whether every reference in this work resolves to a known work and none has been retracted — and get a dated CiteStamped badge you can embed.
See reference health

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4823058openalex-extracted
Si-P-Cu Internally Bonded Anode for Low-Cost and High-Performance Pseudocapacitive Li-Ion Storage
inferred← citeshttps://doi.org/10.1002/9783527610426.bard050003openalex-snapshot
Electrochemical Deposition
inferred← citeshttps://doi.org/10.1002/adfm.200902072openalex-snapshot
Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2‐Derived Self‐Assembled Monolayers
inferred← citeshttps://doi.org/10.1002/pssa.202100409openalex-snapshot
Room Temperature Growth of Silica Nanowires on Top of Ultrathin Si Nanowires Synthesized with Sn‐Cu Bimetallic Seeds
inferred← citeshttps://doi.org/10.1007/978-0-387-95868-2_7openalex-snapshot
Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization
inferred← citeshttps://doi.org/10.1007/bf01209244openalex-snapshot
Cu-Ni and Ni-Cu bilayers on silicon: reduction of formation temperature and phase separation
inferred← citeshttps://doi.org/10.1007/bf02655467openalex-snapshot
Effects of barrier layer and processing conditions on thin film Cu microstructure
inferred← citeshttps://doi.org/10.1007/s10562-009-0172-zopenalex-snapshot
Effects of Multiple Promotion of the Direct Synthesis Contact Mass with P, Zn, and Sn on the Synthesis of Methylchlorosilanes
inferred← citeshttps://doi.org/10.1007/s11595-016-1325-8openalex-snapshot
Effects of annealing processes on Cu x Si1-x thin films
inferred← citeshttps://doi.org/10.1016/0040-6090(94)05807-5openalex-snapshot
Copper interconnection integration and reliability
inferred← citeshttps://doi.org/10.1016/0920-2307(92)90011-oopenalex-snapshot
Copper deposition and thermal stability issues in copper-based metallization for ULSI technology
inferred← citeshttps://doi.org/10.1016/0921-4526(96)86775-5openalex-snapshot
Electronic structure of Cu3Si
inferred← citeshttps://doi.org/10.1016/0956-716x(94)90520-7openalex-snapshot
WSi, FeSi, and CuSi interfaces
inferred← citeshttps://doi.org/10.1016/j.carbon.2014.06.022openalex-snapshot
Multi layered Si–CuO quantum dots wrapped by graphene for high-performance anode material in lithium-ion battery
inferred← citeshttps://doi.org/10.1016/j.est.2024.113513openalex-snapshot
Si-P-Cu internally bonded anode: An innovative strategy for low-cost and high-performance pseudocapacitive Li-ion storage
inferred← citeshttps://doi.org/10.1016/j.matchar.2015.01.010openalex-snapshot
Synthesis and characterization in AuCu–Si nanostructures
inferred← citeshttps://doi.org/10.1016/j.matchemphys.2005.08.079openalex-snapshot
Electroless copper deposition on silicon with titanium seed layer
inferred← citeshttps://doi.org/10.1016/j.matchemphys.2026.132445openalex-snapshot
Studies of phase formation, electronic structure, and electrical properties of the ion-beam sputtered CuxSi1-x (x=9 – 53 at.%) films
inferred← citeshttps://doi.org/10.1016/j.mee.2008.12.011openalex-snapshot
TaNx thin films as copper barriers sputter-deposited at various NH3-to-Ar flow ratios
inferred← citeshttps://doi.org/10.1016/j.nxmate.2024.100218openalex-snapshot
A healable amino silane self-assembled monolayer incorporating polymer capped palladium nanoclusters and its application as the copper diffusion barrier layer on silicon wafer
inferred← citeshttps://doi.org/10.1016/j.tsf.2006.02.014openalex-snapshot
Effects of thermal treatment on structures of Cu/atomic-layer-deposited TaN films/Si stacks
inferred← citeshttps://doi.org/10.1016/j.vacuum.2024.113975openalex-snapshot
Tungsten-based thin film metallic glass as diffusion barrier between copper and silicon
inferred← citeshttps://doi.org/10.1016/s0040-6090(01)00780-5openalex-snapshot
The effect of oxygen in the annealing ambient on interfacial reactions of Cu/Ta/Si multilayers
inferred← citeshttps://doi.org/10.1016/s0040-6090(03)01384-1openalex-snapshot
Investigation on diffusion barrier properties of reactive sputter deposited TiAl N O thin films for Cu metallization
inferred← citeshttps://doi.org/10.1016/s0167-9317(96)00056-1openalex-snapshot
Investigation of copper metallization induced failure of diode structures with and without a barrier layer
inferred← citeshttps://doi.org/10.1016/s0167-9317(97)00115-9openalex-snapshot
TiN diffusion barriers for copper metallization
inferred← citeshttps://doi.org/10.1016/s0167-9317(97)00116-0openalex-snapshot
W/TiN double layers as barrier system for use in Cu metallization
inferred← citeshttps://doi.org/10.1016/s0167-9317(99)00303-2openalex-snapshot
Application of equilibrium thermodynamics to the development of diffusion barriers for copper metallization (invited)
inferred← citeshttps://doi.org/10.1016/s0254-0584(03)00219-0openalex-snapshot
Preparation of Cu1−xTax films and the material interaction in the Si/Cu1−xTax/Cu structure
inferred← citeshttps://doi.org/10.1016/s0254-0584(98)80000-xopenalex-snapshot
Copper interconnections and reliability
inferred← citeshttps://doi.org/10.1021/acs.chemmater.0c01895openalex-snapshot
Design of a Sample Transfer Holder to Enable Air-Free X-ray Photoelectron Spectroscopy
inferred← citeshttps://doi.org/10.1021/acs.chemmater.4c01638openalex-snapshot
Exploring the Solution-Based Metathesis Reaction Pathway Toward Cu3Si Formation
inferred← citeshttps://doi.org/10.1021/acs.langmuir.2c02467openalex-snapshot
Study on Room-Temperature Wet Oxidation of Silicon Catalyzed by Copper
inferred← citeshttps://doi.org/10.1021/cg1000232openalex-snapshot
Controlled Synthesis of Copper-Silicide Nanostructures
inferred← citeshttps://doi.org/10.1021/ic200102zopenalex-snapshot
An Incommensurately Modulated Structure of η′-Phase of Cu3+xSi Determined by Quantitative Electron Diffraction Tomography
inferred← citeshttps://doi.org/10.1021/jp9829997openalex-snapshot
A Surface Science Study of Model Catalysts. 2. Metal−Support Interactions in Cu/SiO2Model Catalysts
inferred← citeshttps://doi.org/10.1038/s41598-017-01755-8openalex-snapshot
Epitaxial growth of Cu(001) thin films onto Si(001) using a single-step HiPIMS process
inferred← citeshttps://doi.org/10.1039/c3nr06771hopenalex-snapshot
Graphene as an atomically thin barrier to Cu diffusion into Si
inferred← citeshttps://doi.org/10.1039/d4cc01870bopenalex-snapshot
Facile synthesis of Cu-based catalysts from Cu 3 Si and their catalysis properties study
inferred← citeshttps://doi.org/10.1063/1.1609646openalex-snapshot
Improvement of the thermal stability of silver metallization
inferred← citeshttps://doi.org/10.1063/1.353904openalex-snapshot
Comparison of high vacuum and ultra-high-vacuum tantalum diffusion barrier performance against copper penetration
inferred← citeshttps://doi.org/10.1063/1.371357openalex-snapshot
Thermodynamic and kinetic study of solid state reactions in the Cu–Si system
inferred← citeshttps://doi.org/10.1063/1.4821337openalex-snapshot
Carbon mediated reduction of silicon dioxide and growth of copper silicide particles in uniform width channels
inferred← citeshttps://doi.org/10.1063/1.4948976openalex-snapshot
Fabrication and characterization of CuxSi1−x films on Si (111) and Si (100) by pulsed laser deposition
inferred← citeshttps://doi.org/10.1088/0022-3727/41/15/155306openalex-snapshot
Texture and surface morphology evolution of Ag(Cu) layers on indium tin oxide thin films
inferred← citeshttps://doi.org/10.1103/physrevstab.15.062002openalex-snapshot
Niobium thin film deposition studies on copper surfaces for superconducting radio frequency cavity applications
inferred← citeshttps://doi.org/10.1109/nano.2014.6968103openalex-snapshot
Electric field and surface step assisted Cu3Si nanowire growth by reactive deposition epitaxy
inferred← citeshttps://doi.org/10.1116/1.1409375openalex-snapshot
Study on the characteristics of TiAlN thin film deposited by atomic layer deposition method
inferred← citeshttps://doi.org/10.1116/1.4948399openalex-snapshot
Study of copper diffusion in RF magnetron sputtered boron carbon nitride thin films
inferred← citeshttps://doi.org/10.1116/1.4975805openalex-snapshot
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
inferred← citeshttps://doi.org/10.1134/s1027451025700296openalex-snapshot
The Effect of Copper Content on the Formation of Silicon Suboxides Phases in Cu–Si Films Obtained by Ion-Beam Sputtering
inferred← citeshttps://doi.org/10.1134/s1063784214070238openalex-snapshot
Influence of the thermal power of a Fe atomic flux on the formation of Cu/Fe nanofilms on a Si(001) substrate
inferred← citeshttps://doi.org/10.1149/1.1421348openalex-snapshot
Physics of Copper in Silicon
inferred← citeshttps://doi.org/10.1149/1.2969916openalex-snapshot
TaN[sub x] Thin Films Deposited Through Various Flow Ratios of N[sub 2]∕Ar for Copper Barrier Properties
inferred← citeshttps://doi.org/10.1155/2017/2079204openalex-snapshot
Surface Morphology and Electrical Resistivity in Polycrystalline Au/Cu/Si(100) System
inferred← citeshttps://doi.org/10.1557/jmr.1992.2424openalex-snapshot
Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems
inferred← citeshttps://doi.org/10.1557/proc-318-307openalex-snapshot
Rapid Evaluation of Thin Film Interfacial Reactions Using Temperature-Ramped Measurements
inferred← citeshttps://doi.org/10.1557/proc-391-303openalex-snapshot
The Effects of Processing on the Microstructure of Copper Thin Films on Tantalum Barrier Layers
inferred← citeshttps://doi.org/10.1557/proc-511-305openalex-snapshot
Reliability and Copper Interconnections with Low Dielectric Constant Materials
inferred← citeshttps://doi.org/10.1557/proc-564-299openalex-snapshot
Diffusion Barriers for Copper Metallization: Predicting Phase Stability and Reactivity using Equilibrium Thermodynamics
inferred← citeshttps://doi.org/10.1557/s0883769400047709openalex-snapshot
Materials Issues in Copper Interconnections
inferred← citeshttps://doi.org/10.2139/ssrn.5280492openalex-snapshot
Features of the Formation of the Phase Composition, Electronic Structure, and Electrical Properties of Cuxsi1-X (X=9 – 53 At.%) Films During Ion-Beam Sputtering
inferred← citeshttps://doi.org/10.2139/ssrn.6043345openalex-snapshot
Features of the formation of the phase composition, electronic structure, and electrical properties of CuxSi1-x (x=9 – 53 at.%) films during ion-beam sputtering
inferred← citeshttps://doi.org/10.2320/matertrans.mt-m2021237openalex-snapshot
Newly-Developed Cu(NbZrNx) Copper-Alloy Films for Microelectronic Manufacture Advancement
inferred← citeshttps://doi.org/10.32657/10356/14244openalex-snapshot
Dielectric failure mechanisms in advanced Cu/low-k interconnect architecture
inferred← citeshttps://doi.org/10.70675/3ebb8ccaz2262z4d16za4c2z6a580b4db944openalex-snapshot
Tailoring Structural and Energy-related Properties of Thin Films Using HiPIMS
inferred← citeshttps://doi.org/10.70675/67d1977az3b63z4797za9f5zdb7c8b2f17c9openalex-snapshot
Plasma-enhanced CVD growth of cubic and hexagonal diamond silicon nanowires with liquid-solid mixed catalysts for photovoltaic applications
Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.