On the public citation graph

Fast computation of the temperature distribution in VLSI chips using the discrete cosine transform and table look-up

https://doi.org/10.1145/1120725.1120753
0 signed · 64 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

Is this your work? Sign in with ORCID and put your name on the claims that are yours.
Claim with ORCID
Reference health. See whether every reference in this work resolves to a known work and none has been retracted — and get a dated CiteStamped badge you can embed.
See reference health

What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1016/s0079-8169(08)60769-2openalex-snapshot
Boundary Value Problems in Heat Conduction
inferredcites →https://doi.org/10.1109/16.52423openalex-snapshot
Peak temperature in high-power chips
inferredcites →https://doi.org/10.1109/4.494196openalex-snapshot
Modeling and analysis of substrate coupling in integrated circuits
inferredcites →https://doi.org/10.1109/43.703820openalex-snapshot
Numerically stable Green function for modeling and analysis of substrate coupling in integrated circuits
inferredcites →https://doi.org/10.1109/43.712099openalex-snapshot
ILLIADS-T: an electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips
inferredcites →https://doi.org/10.1109/43.828548openalex-snapshot
Interconnect thermal modeling for accurate simulation of circuit timing and reliability
inferredcites →https://doi.org/10.1109/43.828554openalex-snapshot
Cell-level placement for improving substrate thermal distribution
inferredcites →https://doi.org/10.1109/95.725203openalex-snapshot
Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation
inferredcites →https://doi.org/10.1109/iscas.2004.1329295openalex-snapshot
Fast thermal analysis for VLSI circuits via semi-analytical Green's function in multi-layer materials
inferredcites →https://doi.org/10.1109/t-ed.1974.17993openalex-snapshot
Thermal analysis of multiple-layer structures
inferredcites →https://doi.org/10.1109/tcad.2002.804385openalex-snapshot
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
inferredcites →https://doi.org/10.1145/859618.859620openalex-snapshot
Temperature-aware microarchitecture
inferredcites →https://doi.org/10.5555/339492.339603openalex-snapshot
An efficient method for hot-spot identification in ULSI circuits
inferredcites →https://doi.org/10.5555/996070.1009873openalex-snapshot
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4675756openalex-extracted
An Efficient Green's Function-Based Bayesian Optimization Method for the Thermal Optimization of Multi-Chips on a Silicon Interposer
inferred← citeshttps://doi.org/10.1007/978-1-4614-6759-5_2openalex-snapshot
Background and Related Works
inferred← citeshttps://doi.org/10.1007/978-3-319-77479-4_2openalex-snapshot
Background and Related Work
inferred← citeshttps://doi.org/10.1007/978-981-19-2860-4_2openalex-snapshot
Literature Review
inferred← citeshttps://doi.org/10.1007/978-981-19-2860-4_5openalex-snapshot
Development and Validation of a Riemann Solver in OpenFOAM for Non-ideal Compressible Fluid Dynamics
inferred← citeshttps://doi.org/10.1080/19942060.2021.2002723openalex-snapshot
Development and validation of a Riemann solver in OpenFOAM® for non-ideal compressible fluid dynamics
inferred← citeshttps://doi.org/10.1109/3dic.2009.5306529openalex-snapshot
Junction-level thermal extraction and simulation of 3DICs
inferred← citeshttps://doi.org/10.1109/aspdac.2006.1594700openalex-snapshot
Temperature-aware routing in 3D ICs
inferred← citeshttps://doi.org/10.1109/aspdac.2014.6742997openalex-snapshot
LightSim: A leakage aware ultrafast temperature simulator
inferred← citeshttps://doi.org/10.1109/date.2006.243966openalex-snapshot
A Logarithmic Full-Chip Thermal Analysis Algorithm Based on Multi-Layer Green's Function
inferred← citeshttps://doi.org/10.1109/ecctd.2011.6043836openalex-snapshot
A power grid optimization algorithm considering via reliability
inferred← citeshttps://doi.org/10.1109/iccad.2008.4681639openalex-snapshot
ThermalScope: Multi-Scale Thermal Analysis for Nanometer-Scale Integrated Circuits
inferred← citeshttps://doi.org/10.1109/iccad45719.2019.8942159openalex-snapshot
NanoTherm: An Analytical Fourier-Boltzmann Framework for Full Chip Thermal Simulations
inferred← citeshttps://doi.org/10.1109/iccd.2005.46openalex-snapshot
Efficient thermal simulation for run-time temperature tracking and management
inferred← citeshttps://doi.org/10.1109/iccd.2007.4601882openalex-snapshot
Analytical thermal placement for VLSI lifetime improvement and minimum performance variation
inferred← citeshttps://doi.org/10.1109/icgcs.2010.5542993openalex-snapshot
Thermal analysis experiences of a tri-core SoC system
inferred← citeshttps://doi.org/10.1109/igcc.2015.7393727openalex-snapshot
Thermal-aware power budgeting for dark silicon chips
inferred← citeshttps://doi.org/10.1109/impact.2013.6706658openalex-snapshot
IC-package co-design by computational thermographics
inferred← citeshttps://doi.org/10.1109/isqed.2006.86openalex-snapshot
METS: A Metric for Electro-Thermal Sensitivity, and Its Application To FinFETs
inferred← citeshttps://doi.org/10.1109/isqed.2007.1openalex-snapshot
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
inferred← citeshttps://doi.org/10.1109/isqed.2010.5450478openalex-snapshot
The compatibility analysis of thread migration and DVFS in multi-core processor
inferred← citeshttps://doi.org/10.1109/isvlsi.2009.25openalex-snapshot
Inducing Thermal-Awareness in Multicore Systems Using Networks-on-Chip
inferred← citeshttps://doi.org/10.1109/jproc.2006.879797openalex-snapshot
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods
inferred← citeshttps://doi.org/10.1109/jproc.2006.879804openalex-snapshot
Temperature-Aware Placement for SOCs
inferred← citeshttps://doi.org/10.1109/sasp.2008.4570787openalex-snapshot
Thermal-aware Design Considerations for Application-Specific Instruction Set Processor
inferred← citeshttps://doi.org/10.1109/tasc.2017.2769453openalex-snapshot
Full-Chip Thermal Simulation of Superconductor Transition-Edge Sensor Circuits
inferred← citeshttps://doi.org/10.1109/tcad.2006.882594openalex-snapshot
Fast Thermal Simulation for Runtime Temperature Tracking and Management
inferred← citeshttps://doi.org/10.1109/tcad.2006.883919openalex-snapshot
Accelerated Chip-Level Thermal Analysis Using Multilayer Green's Function
inferred← citeshttps://doi.org/10.1109/tcad.2008.923251openalex-snapshot
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
inferred← citeshttps://doi.org/10.1109/tcad.2009.2017428openalex-snapshot
Multiscale Thermal Analysis for Nanometer-Scale Integrated Circuits
inferred← citeshttps://doi.org/10.1109/tcad.2011.2180384openalex-snapshot
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring
inferred← citeshttps://doi.org/10.1109/tcad.2012.2196435openalex-snapshot
Efficient Thermal Simulation for 3-D IC With Thermal Through-Silicon Vias
inferred← citeshttps://doi.org/10.1109/tcpmt.2011.2178414openalex-snapshot
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
inferred← citeshttps://doi.org/10.1109/therminic.2007.4451740openalex-snapshot
Method of images for the fast calculation of temperature distributions in packaged VLSI chips
inferred← citeshttps://doi.org/10.1109/tvlsi.2008.2000455openalex-snapshot
Electro-Thermal Analysis of Multi-Fin Devices
inferred← citeshttps://doi.org/10.1109/vlsid2022.2022.00026openalex-snapshot
NanoLeak: A Fast Analytical Green’s Function-based Leakage-aware Thermal Simulator
inferred← citeshttps://doi.org/10.1109/vlsisoc.2009.6041332openalex-snapshot
Fast thermal-aware floorplanning using white-space optimization
inferred← citeshttps://doi.org/10.1109/vlsisoc.2009.6041344openalex-snapshot
Optimal multi-processor SoC thermal simulation via adaptive differential equation solvers
inferred← citeshttps://doi.org/10.1145/1118299.1118359openalex-snapshot
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
inferred← citeshttps://doi.org/10.1145/1289816.1289845openalex-snapshot
Temperature-aware processor frequency assignment for MPSoCs using convex optimization
inferred← citeshttps://doi.org/10.1145/1403375.1403405openalex-snapshot
Temperature control of high-performance multi-core platforms using convex optimization
inferred← citeshttps://doi.org/10.1145/3309544openalex-snapshot
A Survey of Chip-level Thermal Simulators
inferred← citeshttps://doi.org/10.1587/transele.e93.c.1679openalex-snapshot
Temperature-Aware Leakage Estimation Using Piecewise Linear Power Models
inferred← citeshttps://doi.org/10.26053/0h-fhz0-4bg0openalex-snapshot
Thermal characterization abstraction for integrated optoelectronics
inferred← citeshttps://doi.org/10.32657/10356/54996openalex-snapshot
High level thermal-aware scheduling for multiprocessors
inferred← citeshttps://doi.org/10.32657/10356/61034openalex-snapshot
Thermal management of 3D integrated circuits with microchannel-based liquid cooling
inferred← citeshttps://doi.org/10.48550/arxiv.0709.1850openalex-snapshot
Ultrafast Temperature Profile Calculation in Ic Chips
inferred← citeshttps://doi.org/10.5555/1129601.1129692openalex-snapshot
A high efficiency full-chip thermal simulation algorithm
inferred← citeshttps://doi.org/10.5555/1509633.1509645openalex-snapshot
A control theory approach for thermal balancing of MPSoC
inferred← citeshttps://doi.org/10.5555/2755753.2757162openalex-snapshot
MatEx: efficient transient and peak temperature computation for compact thermal models
Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.