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Plasma Enhanced Atomic Layer Deposition of Tio2 Using Tdmat and O2 Plasma

https://doi.org/10.2139/ssrn.4807508
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Outgoing claims: the papers this work cites, builds on, or argues with.

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Auger electron spectroscopy
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EUV lithography process challenges
inferredcites →https://doi.org/10.1016/j.matlet.2013.02.116openalex-extracted
The role of oxygen vacancy-Ti3+ states on TiO2 nanotubes' surface in dye-sensitized solar cells
inferredcites →https://doi.org/10.1016/j.mattod.2014.04.026openalex-extracted
A brief review of atomic layer deposition: from fundamentals to applications
inferredcites →https://doi.org/10.1038/srep32355openalex-extracted
Formation of oxygen vacancies and Ti3+ state in TiO2 thin film and enhanced optical properties by air plasma treatment
inferredcites →https://doi.org/10.1063/1.4765357openalex-extracted
Optical emission diagnostics with electric probe measurements of inductively coupled Ar/O2/Ar-O2 plasmas
inferredcites →https://doi.org/10.1088/0022-3727/47/8/085401openalex-extracted
Investigation of antibacterial and wettability behaviours of plasma-modified PMMA films for application in ophthalmology
inferredcites →https://doi.org/10.1103/physrevb.87.085206openalex-extracted
Role of oxygen vacancies on the structure and density of states of iron-doped zirconia
inferredcites →https://doi.org/10.1109/16.987114openalex-extracted
A spacer patterning technology for nanoscale CMOS
inferredcites →https://doi.org/10.1109/iitc.2001.929999openalex-extracted
From PVD to CVD to ALD for interconnects and related applications
inferredcites →https://doi.org/10.1109/iitc51362.2021.9537517openalex-extracted
Atomic Layer Deposition of Titanium Silicate for Multi-Patterning Process
inferredcites →https://doi.org/10.1109/led.2010.2049978openalex-extracted
High-Quality Low-Temperature Silicon Oxide by Plasma-Enhanced Atomic Layer Deposition Using a Metal–Organic Silicon Precursor and Oxygen Radical
inferredcites →https://doi.org/10.1116/1.4772664openalex-extracted
Characterization of low temperature deposited atomic layer deposition TiO2 for MEMS applications
inferredcites →https://doi.org/10.1117/12.20180openalex-extracted
Deep-ultraviolet lithography for 500-nm devices
inferredcites →https://doi.org/10.1117/12.2046135openalex-extracted
Recent progress on multiple-patterning process
inferredcites →https://doi.org/10.1117/12.2297183openalex-extracted
Exploration of BEOL line-space patterning options at 12 nm half-pitch and below
inferredcites →https://doi.org/10.1117/12.2502791openalex-extracted
Current challenges and opportunities for EUV lithography
inferredcites →https://doi.org/10.1117/12.467849openalex-extracted
Study of the Role of Cl 2 , O 2 , and He in the Chrome Etch Process with Optical Emission Spectroscopy
inferredcites →https://doi.org/10.1117/12.772865openalex-extracted
Multi-patterning overlay control
inferredcites →https://doi.org/10.1117/12.804709openalex-extracted
Immersion lithography: its history, current status and future prospects
inferredcites →https://doi.org/10.1117/12.839826openalex-extracted
Implementation of double patterning process toward 22-nm node
inferredcites →https://doi.org/10.1145/2744769openalex-extracted
Proceedings of the 52nd Annual Design Automation Conference
inferredcites →https://doi.org/10.1149/05013.0023ecstopenalex-extracted
Ion Bombardment during Plasma-Assisted Atomic Layer Deposition
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