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Silicon wafer dicing: dynamic force model and force-based fracture detection

https://doi.org/10.2139/ssrn.5984745
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Surface damage and mechanical strength of silicon wafers
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Studies of chipping mechanisms for dicing silicon wafers
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A theoretical and experimental study of forced spindle vibration under unbalanced magnetic forces in ultra-precision machining
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Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength
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Improving the Surface Passivation and Cleaning Quality of c-Si Wafers for the Application of TOPCon Solar Cells
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Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics
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Grinding force modelling for ductile-brittle transition in laser macro-micro-structured grinding of zirconia ceramics
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Grinding surface roughness prediction for silicon nitride ceramics: A dynamic grinding force and frequency domain approach
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Dynamic characteristics of an aerostatic bearing spindle and its influence on surface topography in ultra-precision diamond turning
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A theoretical and experimental investigation into five-DOF dynamic characteristics of an aerostatic bearing spindle in ultra-precision diamond turning
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A theoretical and experimental study of surface generation under spindle vibration in ultra-precision raster milling
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Investigation of the effects of spindle unbalance induced error motion on machining accuracy in ultra-precision diamond turning
inferredcites →https://doi.org/10.1016/j.ijmachtools.2016.07.009openalex-snapshot
A predictive model of grinding force in silicon wafer self-rotating grinding
inferredcites →https://doi.org/10.1016/j.ijmachtools.2016.10.004openalex-snapshot
Grinding forces in micro slot-grinding (MSG) of single crystal sapphire
inferredcites →https://doi.org/10.1016/j.ijmachtools.2017.06.002openalex-snapshot
Analysis of grinding mechanics and improved predictive force model based on material-removal and plastic-stacking mechanisms
inferredcites →https://doi.org/10.1016/j.ijmachtools.2018.06.002openalex-snapshot
A theoretical and experimental study of spindle imbalance induced forced vibration and its effect on surface generation in diamond turning
inferredcites →https://doi.org/10.1016/j.ijmachtools.2019.05.003openalex-snapshot
Deformation mechanism and force modelling of the grinding of YAG single crystals
inferredcites →https://doi.org/10.1016/j.ijmecsci.2025.109982openalex-snapshot
Prediction model for surface shape of YAG wafers in wafer rotational grinding
inferredcites →https://doi.org/10.1016/j.jmapro.2014.04.002openalex-snapshot
Investigation of chipping and wear of silicon wafer dicing
inferredcites →https://doi.org/10.1016/j.jmapro.2020.08.050openalex-snapshot
Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
inferredcites →https://doi.org/10.1016/j.jmapro.2020.09.029openalex-snapshot
Dynamic grinding force model for carbide insert peripheral grinding based on grain element method
inferredcites →https://doi.org/10.1016/j.jmapro.2022.09.058openalex-snapshot
Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method
inferredcites →https://doi.org/10.1016/j.jmatprotec.2015.04.005openalex-snapshot
Study on grinding force modelling and ductile regime propelling technology in micro drill-grinding of hard-brittle materials
inferredcites →https://doi.org/10.1016/j.jmatprotec.2021.117415openalex-snapshot
Investigations on the micro-interactions of grit-workpiece and forces prediction in ultrasonic vibration side grinding of optical glass
inferredcites →https://doi.org/10.1016/j.matlet.2009.05.015openalex-snapshot
Friction effect on contact pressure during indentation and scratch into amorphous polymers
inferredcites →https://doi.org/10.1016/j.measurement.2023.112557openalex-snapshot
Monitoring of ductile–brittle transition mechanisms in sapphire ultra-precision grinding used small grit size grinding wheel through force and acoustic emission signals
inferredcites →https://doi.org/10.1016/j.measurement.2024.116118openalex-snapshot
A grinding force prediction model and experimental validation for ultrasonic-assisted end grinding of 2.5D C/SiC composites
inferredcites →https://doi.org/10.1016/j.measurement.2025.116835openalex-snapshot
Anisotropy monitoring of ultra-precision grinding force and acoustic emission signal of monocrystalline sapphire
inferredcites →https://doi.org/10.1016/j.msea.2019.04.103openalex-snapshot
Fracture strength and microstructural study of ultrathin Si die with Cu backside layer diced with picosecond laser
inferredcites →https://doi.org/10.1016/j.precisioneng.2021.10.001openalex-snapshot
A review of laser ablation and dicing of Si wafers
inferredcites →https://doi.org/10.1016/j.precisioneng.2024.05.010openalex-snapshot
Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel
inferredcites →https://doi.org/10.1016/j.solmat.2024.112999openalex-snapshot
A critical review on the fracture of ultra-thin photovoltaics silicon wafers
inferredcites →https://doi.org/10.1016/s0007-8506(07)60511-3openalex-snapshot
Grinding Mechanisms for Ceramics
inferredcites →https://doi.org/10.1021/acs.jpcc.5c00007openalex-snapshot
Silicon Wafers Exhibiting Highly Surface-Related Thermoelectric Properties
inferredcites →https://doi.org/10.1038/s41586-024-07983-zopenalex-snapshot
Using both faces of polar semiconductor wafers for functional devices
inferredcites →https://doi.org/10.1038/s41928-020-0461-5openalex-snapshot
Opportunities and challenges for spintronics in the microelectronics industry
inferredcites →https://doi.org/10.1039/c2ee03489aopenalex-snapshot
Crystalline silicon photovoltaics: a cost analysis framework for determining technology pathways to reach baseload electricity costs
inferredcites →https://doi.org/10.1039/c9ee02452bopenalex-snapshot
Revisiting thin silicon for photovoltaics: a technoeconomic perspective
inferredcites →https://doi.org/10.1039/d4nr04439hopenalex-snapshot
Demonstration of 300 mm RF-SOI wafers fabricated by layer transfer technology
inferredcites →https://doi.org/10.1063/10.0005152openalex-snapshot
Study on precision dicing process of SiC wafer with diamond dicing blades
inferredcites →https://doi.org/10.1080/10940349708945637openalex-snapshot
EFFECT OF GRINDING ON STRENGTH OF TETRAGONAL ZIRCONIA AND ZIRCONIA-TOUGHENED ALUMINA
inferredcites →https://doi.org/10.1109/tepm.2005.862625openalex-snapshot
Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping
inferredcites →https://doi.org/10.1115/1.2899676openalex-snapshot
Ductile-Regime Grinding: A New Technology for Machining Brittle Materials
inferredcites →https://doi.org/10.3390/ma15228083openalex-snapshot
High-Speed Dicing of SiC Wafers with 0.048 mm Diamond Blades via Rolling-Slitting
inferredcites →https://doi.org/10.3390/ma17225529openalex-snapshot
Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package Integration
inferredcites →https://doi.org/10.3390/machines11020259openalex-snapshot
Precision Machining by Dicing Blades: A Systematic Review
inferredcites →https://doi.org/10.3390/mi10090616openalex-snapshot
Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon
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