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Effects of Multi-Component Additive Systems on Microstructure and Properties of Electrolytic Copper Foil

https://doi.org/10.2139/ssrn.7010496
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Computational Investigation of the Adsorption of Polyalkylene Glycols on Copper Surfaces for Copper Electrodeposition
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High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS
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Advances in electrolytic copper foils: fabrication, microstructure, and mechanical properties
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Effect of H3PO4 content and processing temperature on the structure and mechanical properties of porous Si3N4
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Copper foils for high-energy-density lithium batteries: Composite vs. ultrathin
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Microstructural evolution and mechanical properties of bulk and porous low-cost Ti–Mo–Fe alloys produced by powder metallurgy
inferredcites →https://doi.org/10.1016/j.jelechem.2018.03.048openalex-snapshot
Thermodynamic aspects of bis(3‑sulfopropyl) disulfide and 3‑mercapto‑1‑propanesulfonic acid in Cu electrodeposition
inferredcites →https://doi.org/10.1016/j.jmrt.2025.09.173openalex-snapshot
Novel composite additives to prepare ultra-thin nanotwin copper foil with high toughness
inferredcites →https://doi.org/10.1016/j.msea.2025.148850openalex-snapshot
Scalable production of electrodeposited ultra-thin copper foils with high strength and ductility as a current collector for lithium-ion batteries
inferredcites →https://doi.org/10.1016/j.msea.2026.149782openalex-snapshot
Influence of LaB6 concentration gradient on the microstructure and properties of direct current electrodeposited copper foils
inferredcites →https://doi.org/10.1016/j.mseb.2025.118393openalex-snapshot
Effect of roughening current density on the structure and performance of RTF copper foil
inferredcites →https://doi.org/10.1039/d4ra06688jopenalex-snapshot
Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives
inferredcites →https://doi.org/10.1039/d5ra06657copenalex-snapshot
Quantifying synergistic interactions of ternary additives for microstructural control in ultrathin Li-ion battery copper foils
inferredcites →https://doi.org/10.1126/science.1167641openalex-snapshot
Revealing the Maximum Strength in Nanotwinned Copper
inferredcites →https://doi.org/10.1126/science.1255940openalex-snapshot
Making strong nanomaterials ductile with gradients
inferredcites →https://doi.org/10.1126/science.aar6941openalex-snapshot
Enhanced thermal stability of nanograined metals below a critical grain size
inferredcites →https://doi.org/10.1126/science.abe1267openalex-snapshot
Constrained minimal-interface structures in polycrystalline copper with extremely fine grains
inferredcites →https://doi.org/10.1149/1.1651530openalex-snapshot
Electrodeposition of Copper in the SPS-PEG-Cl Additive System
inferredcites →https://doi.org/10.1149/1.2139952openalex-snapshot
Vibrational Spectroscopic and Mass Spectrometric Studies of the Interaction of Bis(3-sulfopropyl)-disulfide with Cu Surfaces
inferredcites →https://doi.org/10.1149/1.2431320openalex-snapshot
SPS Adsorption and Desorption during Copper Electrodeposition and Its Impact on PEG Adsorption
inferredcites →https://doi.org/10.3740/mrsk.2025.35.5.182openalex-snapshot
Main Effects of Additives on Copper Electroplating at High Current Density
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