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Reaction-induced coordination switching enables latent curing-agent activation and in situ reinforcement in sequentially cured dual networks
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Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1002/adfm.202214368openalex-snapshot
3D Printing Thermally Stable High‐Performance Polymers Based on a Dual Curing Mechanism
inferredcites →https://doi.org/10.1002/adma.202408674openalex-snapshot
All‐In‐One Epoxy/MXene Nanocomposites with Bead‐Type Polymeric Imidazole Latent Curing Agent for Enhancing Storage Stability and Flame Retardancy
inferredcites →https://doi.org/10.1002/pola.28146openalex-snapshot
Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins
inferredcites →https://doi.org/10.1002/pssb.201451362openalex-snapshot
Modification of titanium and titanium dioxide surfaces by ion implantation: Combined XPS and DFT study
inferredcites →https://doi.org/10.1016/j.addma.2021.102159openalex-snapshot
Compositional effects on cure kinetics, mechanical properties and printability of dual-cure epoxy/acrylate resins for DIW additive manufacturing
inferredcites →https://doi.org/10.1016/j.compositesb.2023.111179openalex-snapshot
Core-shell structured tow-pregs enabled additive manufacturing of continuously reinforced thermoset composites
inferredcites →https://doi.org/10.1016/j.compstruct.2018.08.041openalex-snapshot
Integrative hinge based on shape memory polymer composites: Material, design, properties and application
inferredcites →https://doi.org/10.1016/j.eurpolymj.2018.12.048openalex-snapshot
Characterization of sequential dual-curing of thiol-acrylate-epoxy systems with controlled thermal properties
inferredcites →https://doi.org/10.1016/j.jallcom.2017.12.262openalex-snapshot
A theoretical and experimental investigation of Eu-doped ZnO nanorods and its application on dye sensitized solar cells
inferredcites →https://doi.org/10.1016/j.matlet.2015.08.141openalex-snapshot
Imidazole derivatives as latent curing agents for epoxy thermosetting resins
inferredcites →https://doi.org/10.1016/j.polymer.2019.121586openalex-snapshot
A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins
inferredcites →https://doi.org/10.1016/j.polymer.2021.124073openalex-snapshot
Sequential photo-thermal curing of (meth)acrylate-epoxy thiol formulations
inferredcites →https://doi.org/10.1016/j.tca.2021.178963openalex-snapshot
Curing kinetics of dually-processed acrylate-epoxy 3D printing resins
inferredcites →https://doi.org/10.1021/acs.macromol.5c02046openalex-snapshot
Synthesis and Properties of an Imidazole Urea-Coordination Dual-Dynamic Cross-Linked Latent Accelerator and Its Recyclable One-Component Epoxy Resin
inferredcites →https://doi.org/10.1021/acsami.5c04496openalex-snapshot
3D-Printed Shape-Memory Polymer-Based Variable-Stiffness Origami Actuator for Multimodal Soft Continuum Robots
inferredcites →https://doi.org/10.1021/acsapm.2c00138openalex-snapshot
Green and Facile Synthesis of Bio-Based, Flame-Retardant, Latent Imidazole Curing Agent for Single-Component Epoxy Resin
inferredcites →https://doi.org/10.1021/acsapm.2c00916openalex-snapshot
Thermally Responsive Imidazole-Based Diels–Alder Microbeads as a Latent Curing Agent for Epoxy Resins
inferredcites →https://doi.org/10.1021/acsmacrolett.3c00400openalex-snapshot
Robust Vanillin-Derived Poly(thioether imidazoles) as Both a Latent Curing and Toughening Agent for One-Component Epoxy Resins
inferredcites →https://doi.org/10.1021/acsmacrolett.5b00601openalex-snapshot
Imidazole Derivatives with an Intramolecular Hydrogen Bond as Thermal Latent Curing Agents for Thermosetting Resins
inferredcites →https://doi.org/10.1021/jacsau.2c00120openalex-snapshot
Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications
inferredcites →https://doi.org/10.1038/nature14543openalex-snapshot
Design, fabrication and control of soft robots
inferredcites →https://doi.org/10.1039/c5ra20640eopenalex-snapshot
A biocompatible poly(N-vinylimidazole)-dot with both strong luminescence and good catalytic activity
inferredcites →https://doi.org/10.1039/c5ra22055fopenalex-snapshot
Preparation of click thiol-ene/thiol-epoxy thermosets by controlled photo/thermal dual curing sequence
inferredcites →https://doi.org/10.1039/d5py01170aopenalex-snapshot
Zinc-based coordination exchange in epoxy networks cured via frontal polymerization
inferredcites →https://doi.org/10.1039/jm9940400379openalex-snapshot
Preparation and characterization of imidazole–metal complexes and evaluation of cured epoxy networks
inferredcites →https://doi.org/10.1080/15583724.2024.2405684openalex-snapshot
Dual-Curing Epoxy Thermosets: Design, Curing, Properties and Applications
inferredcites →https://doi.org/10.1295/polymj.37.833openalex-snapshot
Mechanism and Kinetics of Epoxy-Imidazole Cure Studied with Two Kinetic Methods
inferredcites →https://doi.org/10.3390/polym10020178openalex-snapshot
State of the Art in Dual-Curing Acrylate Systems
inferredcites →https://doi.org/10.3390/polym11060997openalex-snapshot
Rheological and Mechanical Characterization of Dual-Curing Thiol-Acrylate-Epoxy Thermosets for Advanced Applications
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