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Moore’s Law for Packaging to Replace Moore’s Law for ICS

https://doi.org/10.23919/panpacific.2019.8696409
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

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History of Flip Chip and Area Array Technology
inferredcites →https://doi.org/10.1007/978-1-4615-1389-6_7openalex-snapshot
Laminate/HDI Die Carriers
inferredcites →https://doi.org/10.1038/s41928-017-0005-9openalex-snapshot
Science and research policy at the end of Moore’s law
inferredcites →https://doi.org/10.1088/0034-4885/68/12/r01openalex-snapshot
Physical limits of silicon transistors and circuits
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Physical limits for scaling of integrated circuits
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Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
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Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration
inferredcites →https://doi.org/10.1109/ectc.2016.201openalex-snapshot
Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
inferredcites →https://doi.org/10.1109/ectc.2016.246openalex-snapshot
3D SiP with Organic Interposer for ASIC and Memory Integration
inferredcites →https://doi.org/10.1109/ectc.2016.348openalex-snapshot
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
inferredcites →https://doi.org/10.1109/eptc.2008.4763559openalex-snapshot
Embedded Wafer Level Ball Grid Array (eWLB)
inferredcites →https://doi.org/10.1109/estc.2006.280072openalex-snapshot
Fabrication of Smallest Vias in LTCC Tape
inferredcites →https://doi.org/10.1109/iedm.2012.6479039openalex-snapshot
High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration
inferredcites →https://doi.org/10.1111/j.1151-2916.1991.tb04320.xopenalex-snapshot
Ceramic and Glass‐Ceramic Packaging in the 1990s
inferredcites →https://doi.org/10.1111/j.1551-2916.2008.02732.xopenalex-snapshot
Calcium Zinc Borosilicate Glass with High Thermal Expansion Coefficient for LTCC Applications
inferredcites →https://doi.org/10.1111/j.1744-7402.2008.02316.xopenalex-snapshot
Design of LTCC with High Thermal Expansion
inferredcites →https://doi.org/10.1126/science.285.5436.2079openalex-snapshot
Pushing the Limits
inferredcites →https://doi.org/10.7551/mitpress/12274.003.0027openalex-snapshot
Cramming More Components onto Integrated Circuits (1965)

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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