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Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

https://doi.org/10.3390/polym13071129
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1002/app.40672openalex-snapshot
Epoxy compositions cured with aluminosilsesquioxanes: Thermomechanical properties
inferredcites →https://doi.org/10.1002/app.46639openalex-snapshot
Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis
inferredcites →https://doi.org/10.1002/app.47110openalex-snapshot
Probing toughness of polycarbonate (PC: ductile and brittle)/polypropylene (PP) blends and talc‐triggered PC/PP brittle composites with diverse impact fracture parameters
inferredcites →https://doi.org/10.1002/app.47684openalex-snapshot
Compatibilizing effects for semicrystalline polymer‐infiltrated amorphous polymer matrix: Mechanical (toughness), thermal, and morphological behavior of compatibilized polypropylene/polycarbonate blends
inferredcites →https://doi.org/10.1002/pi.5631openalex-snapshot
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
inferredcites →https://doi.org/10.1007/s11664-008-0544-yopenalex-snapshot
Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders
inferredcites →https://doi.org/10.1016/j.coco.2020.03.011openalex-snapshot
Recent advances in polymer-based electronic packaging materials
inferredcites →https://doi.org/10.1016/j.compositesa.2018.12.019openalex-snapshot
High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
inferredcites →https://doi.org/10.1016/j.jallcom.2007.08.007openalex-snapshot
Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions
inferredcites →https://doi.org/10.1016/j.jallcom.2010.08.006openalex-snapshot
Wettability and interfacial reactions between the molten Sn–3.0 wt%Ag–0.5 wt%Cu solder (SAC305) and Ni–Co alloys
inferredcites →https://doi.org/10.1016/j.mee.2008.05.038openalex-snapshot
Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder
inferredcites →https://doi.org/10.1016/j.microrel.2011.07.093openalex-snapshot
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
inferredcites →https://doi.org/10.1016/j.microrel.2020.113657openalex-snapshot
Defect inspection of flip chip solder joints based on non-destructive methods: A review
inferredcites →https://doi.org/10.1016/j.polymer.2018.09.063openalex-snapshot
Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications
inferredcites →https://doi.org/10.1016/j.surfcoat.2020.125703openalex-snapshot
Perhydropolysilazane derived SiON interfacial layer for Cu/epoxy molding compound composite
inferredcites →https://doi.org/10.1021/acs.iecr.8b01142openalex-snapshot
Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection
inferredcites →https://doi.org/10.1021/ma9617330openalex-snapshot
Effect of Shear History on the Morphology of Immiscible Polymer Blends
inferredcites →https://doi.org/10.1039/c2gc35154dopenalex-snapshot
Thermosetting resin based on epoxidised linseed oil and bio-derived crosslinker
inferredcites →https://doi.org/10.1063/1.1445283openalex-snapshot
Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow
inferredcites →https://doi.org/10.1109/6144.774718openalex-snapshot
Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
inferredcites →https://doi.org/10.1109/tcapt.2002.807590openalex-snapshot
An investigation into the effects of flux residues on properties of underfill materials for flip chip packages
inferredcites →https://doi.org/10.1116/1.572173openalex-snapshot
Surface oxidation of molten soft solder: An Auger study
inferredcites →https://doi.org/10.1520/stp1249-ebopenalex-snapshot
Assignment of the Glass Transition
inferredcites →https://doi.org/10.3390/polym11111797openalex-snapshot
Influence of Filler Content and Filler Size on the Curing Kinetics of an Epoxy Resin
inferredcites →https://doi.org/10.3390/polym13010147openalex-snapshot
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials
inferredcites →https://doi.org/10.4218/etrij.10.0109.0400openalex-snapshot
Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
inferredcites →https://doi.org/10.4218/etrij.14.0113.0570openalex-snapshot
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4758157openalex-extracted
Fabrication and Applications of Pentaerythritol Tetrakis(3-Mercaptopropionate) Addition to N-Phenylacrylamide Based on Thiol-Ene Click Reaction
inferred← citeshttps://doi.org/10.1016/j.hazadv.2026.101568openalex-snapshot
Influence of flexibilizer on pyrolysis and sound insulation properties of noise reduction panels based on experimental and molecular dynamics studies
inferred← citeshttps://doi.org/10.1016/j.jiec.2021.05.024openalex-snapshot
REMOVED: Crystallinity-tailorable solvent-free hybrid adhesive films composed of epoxy, diacid, and poly(ethylene glycol) with curable and deoxidizing capabilities
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2022.103178openalex-snapshot
REMOVED: Catalysis of reduced tin oxide in various epoxy resins
inferred← citeshttps://doi.org/10.1021/acsomega.3c04245openalex-snapshot
Copper Sintering Pastes with Various Polar Solvents and Acidic Activators
inferred← citeshttps://doi.org/10.3390/polym13203561openalex-snapshot
Structural Adhesives Tapes Based on a Solid Epoxy Resin and Multifunctional Acrylic Telomers
inferred← citeshttps://doi.org/10.3390/polym15244680openalex-snapshot
Investigation of Crystallization, Morphology, and Mechanical Properties of Polypropylene/Polypropylene-Polyethylene Block Copolymer Blends
inferred← citeshttps://doi.org/10.3390/polym16030398openalex-snapshot
Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering
inferred← citeshttps://doi.org/10.3390/polym16030439openalex-snapshot
Catalysis of Silver and Bismuth in Various Epoxy Resins
inferred← citeshttps://doi.org/10.3390/polym17162250openalex-snapshot
Effect of Surface-Modified Mica in Hybrid Filler Systems on the Curing and Mechanical Behavior of Ethylene–Propylene–Diene Monomer (EPDM)/Butadiene Rubber (BR) Blend
inferred← citeshttps://doi.org/10.3390/polym17192675openalex-snapshot
Influence of Mineral Fillers on the Curing Process and Thermal Degradation of Polyethylene Glycol Maleate–Acrylic Acid-Based Systems
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