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Rheological Behaviors and Their Correlation with Printing Performance of Silver Paste for LTCC Tape

https://doi.org/10.5772/35004
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/b101196openalex-snapshot
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
inferredcites →https://doi.org/10.1007/s10832-008-9462-xopenalex-snapshot
Sintering behavior of silver conductive thick film with frit in information display
inferredcites →https://doi.org/10.1007/s11814-008-0223-yopenalex-snapshot
Screen printing of silver nanoparticle suspension for metal interconnects
inferredcites →https://doi.org/10.1007/s12046-009-0046-5openalex-snapshot
Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives
inferredcites →https://doi.org/10.1016/0026-2714(74)90320-5openalex-snapshot
Screens for screen printing of electronic circuits
inferredcites →https://doi.org/10.1016/0026-2714(75)90151-1openalex-snapshot
The squeegee in printing of electronic circuits
inferredcites →https://doi.org/10.1016/0254-0584(96)80091-5openalex-snapshot
Effects of surfactant treatment of silver powder on the rheology of its thick-film paste
inferredcites →https://doi.org/10.1016/j.apsusc.2010.07.057openalex-snapshot
Dispersion and rheology of surfactant-mediated silver nanoparticle suspensions
inferredcites →https://doi.org/10.1016/j.colsurfa.2010.09.038openalex-snapshot
Preparation and characterization of high-temperature silver thick film and its application in multilayer chip inductances
inferredcites →https://doi.org/10.1016/j.jeurceramsoc.2003.11.011openalex-snapshot
Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications
inferredcites →https://doi.org/10.1016/j.jmatprotec.2007.06.067openalex-snapshot
The rheological behaviors of screen-printing pastes
inferredcites →https://doi.org/10.1016/j.jpowsour.2009.07.008openalex-snapshot
Evaluation of silver as a miniature direct methanol full cell electrode
inferredcites →https://doi.org/10.1016/j.matchemphys.2007.11.042openalex-snapshot
Preparation and rheological behavior of lead free silver conducting paste
inferredcites →https://doi.org/10.1016/j.matdes.2009.01.028openalex-snapshot
Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes
inferredcites →https://doi.org/10.1016/j.matdes.2011.02.045openalex-snapshot
Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
inferredcites →https://doi.org/10.1016/j.mee.2009.06.012openalex-snapshot
Characterization of direct patterned Ag circuits for RF application
inferredcites →https://doi.org/10.1016/j.solidstatesciences.2010.12.024openalex-snapshot
Behaviors of ZnO-doped silver thick film and silver grain growth mechanism
inferredcites →https://doi.org/10.1016/j.tsf.2009.05.019openalex-snapshot
Performance characterization of screen printed radio frequency identification antennas with silver nanopaste
inferredcites →https://doi.org/10.1016/s0167-577x(03)00003-xopenalex-snapshot
Influence of surfactants treatment on silver powder and its thick films
inferredcites →https://doi.org/10.1016/s0921-5107(02)00073-9openalex-snapshot
Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging
inferredcites →https://doi.org/10.1016/s0955-2219(03)00155-9openalex-snapshot
Design aspects of microwave components with LTCC technique
inferredcites →https://doi.org/10.1023/a:1008904220118openalex-snapshot
Modeling the effects of temperature on the rheology of solder pastes and flux system
inferredcites →https://doi.org/10.1023/a:1008989601919openalex-snapshot
Deposition and characterization of screen-printed porous multi-layer thick film structures from semiconducting and conducting nanomaterials for use in photovoltaic devices
inferredcites →https://doi.org/10.1023/b:jmse.0000005385.21127.acopenalex-snapshot
Effect of inorganic binders on the properties of silver thick films
inferredcites →https://doi.org/10.1023/b:jmse.0000038923.62923.1eopenalex-snapshot
Thixotropy flow behaviour of solder and conductive adhesive pastes
inferredcites →https://doi.org/10.1080/02604027.1990.9972176openalex-snapshot
© Gordon and Breach, Science Publishers, Inc.
inferredcites →https://doi.org/10.1109/2944.979337openalex-snapshot
Screen printing for the fabrication of organic light-emitting devices
inferredcites →https://doi.org/10.1109/33.83933openalex-snapshot
SPC and setup analysis for screen printed thick films
inferredcites →https://doi.org/10.1109/eptc.2009.5416423openalex-snapshot
Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance
inferredcites →https://doi.org/10.1109/eptc.2010.5702612openalex-snapshot
Fine line screen printed electrodes for polymer microfluidics
inferredcites →https://doi.org/10.1109/icept.2006.359881openalex-snapshot
Optimization of Screen Printing Process
inferredcites →https://doi.org/10.1109/iemt.2002.1032759openalex-snapshot
Characterisation of lead-free solder pastes for low cost flip-chip bumping
inferredcites →https://doi.org/10.1109/ijcnn.2003.1223834openalex-snapshot
Application of neural network on LTCC fine line screen printing process
inferredcites →https://doi.org/10.1109/ijcnn.2005.1556089openalex-snapshot
A combined SVM and LDA approach for classification
inferredcites →https://doi.org/10.1109/pvsc.2008.4922793openalex-snapshot
Screen-printing simulation study on solar cell front side AG paste
inferredcites →https://doi.org/10.1109/tchmt.1979.1135447openalex-snapshot
A Method for the Rheological Characterization of Thick-Film Pastes
inferredcites →https://doi.org/10.1109/tchmt.1987.1134770openalex-snapshot
Rheology of Silver- Filled Glass Die Attach Adhesive for High-Speed Automatic Processing
inferredcites →https://doi.org/10.1109/tmft.1975.1135857openalex-snapshot
Fine Line Screen Printing Yields as a Function of Physical Design Parameters
inferredcites →https://doi.org/10.1111/j.1151-2916.1994.tb04549.xopenalex-snapshot
Silver‐Palladium Thick‐Film Conductors
inferredcites →https://doi.org/10.1111/j.1151-2916.2001.tb01036.xopenalex-snapshot
Direct‐Write Fabrication of Pb(Nb,Zr,Ti)O 3 Devices: Influence of Paste Rheology on Print Morphology and Component Properties
inferredcites →https://doi.org/10.1111/j.1551-2916.2004.00187.xopenalex-snapshot
Constrained Sintering of Silver Circuit Paste
inferredcites →https://doi.org/10.1111/j.1551-2916.2005.00625.xopenalex-snapshot
A Study of Screen Printed Yttria‐Stabilized Zirconia Layers for Solid Oxide Fuel Cells
inferredcites →https://doi.org/10.1155/apec.9.67openalex-snapshot
Advances in Low Cost Silver‐Containing Thick Film Conductors
inferredcites →https://doi.org/10.1201/9781420018967openalex-snapshot
Ceramic Interconnect Technology Handbook
inferredcites →https://doi.org/10.4071/1551-4897-6.1.13openalex-snapshot
Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics
inferredcites →https://doi.org/10.4229/23rdeupvsec2008-2cv.5.57openalex-snapshot
Temperature Dependency of Silver Paste With Regards to Print Quality and Electrical Performance of Screen-Printed Solar Cells

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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inferred← citeshttps://doi.org/10.1007/s10854-025-15559-4openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/bs.ache.2021.05.001openalex-snapshot
Advances in printing technologies for soft robotics devices applications
inferred← citeshttps://doi.org/10.1016/j.ceramint.2022.05.043openalex-snapshot
Eco-friendly, cost-effective electroless Ag plating based on a novel Ni–P activation process on magnesium titanate ceramic
inferred← citeshttps://doi.org/10.1016/j.electacta.2024.144161openalex-snapshot
A new generation of fully-printed electrochemical sensors based on biochar/ethylcellulose-modified carbon electrodes: Fabrication, characterization and practical applications
inferred← citeshttps://doi.org/10.1016/j.jeurceramsoc.2019.03.024openalex-snapshot
Additive manufacturing of barium titanate based ceramic heaters with positive temperature coefficient of resistance (PTCR)
inferred← citeshttps://doi.org/10.1016/j.jmapro.2026.06.010openalex-snapshot
Programmable line-morphologies of material-extrusion 3D printed self-leveling inks with various apparent viscosity
inferred← citeshttps://doi.org/10.1016/j.matchemphys.2020.123594openalex-snapshot
Binder-solvent effects on low temperature-processed carbon-based, hole-transport layer free perovskite solar cells
inferred← citeshttps://doi.org/10.1016/j.mee.2018.06.002openalex-snapshot
Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials
inferred← citeshttps://doi.org/10.1021/acs.iecr.6b00871openalex-snapshot
Formulation of Sol–Gel Derived Bismuth Silicate Dielectric Ink for Flexible Electronics Applications
inferred← citeshttps://doi.org/10.1021/acsabm.0c00401openalex-snapshot
Soft Printable Electrode Coating for Neural Interfaces
inferred← citeshttps://doi.org/10.1021/acsomega.8b03313openalex-snapshot
Silica-Based Organic–Inorganic Hybrid Fluorescent Ink for Security Applications
inferred← citeshttps://doi.org/10.1038/srep31367openalex-snapshot
Highly conductive, printable pastes from capillary suspensions
inferred← citeshttps://doi.org/10.1080/17436753.2018.1526435openalex-snapshot
Factors influencing rheological characteristics of silver thick film paste and its correlation to multilayer ceramic processing
inferred← citeshttps://doi.org/10.1108/cw-10-2015-0046openalex-snapshot
Printed HF antennas for RFID on-metal transponders
inferred← citeshttps://doi.org/10.1109/isse54558.2022.9812829openalex-snapshot
Low-Cost Strain Gauge Integration in Ceramics for Force Sensor Applications
inferred← citeshttps://doi.org/10.1533/9780857098825.3.587openalex-snapshot
Multilayer glass–ceramic composites for microelectronics: processing and properties
inferred← citeshttps://doi.org/10.20868/upm.thesis.43937openalex-snapshot
Desarrollo de procesos para formación de contactos con láser para módulos thin film CIGS para aplicaciones fotovoltaicas
inferred← citeshttps://doi.org/10.21935/tls.v1i2.104openalex-snapshot
Additive manufacturing of capacitive humidity sensors by screen printing for condition monitoring of FRP composites
inferred← citeshttps://doi.org/10.23889/suthesis.58697openalex-snapshot
Processing of nano-micro copper materials for the production of conductive circuits
inferred← citeshttps://doi.org/10.23919/empc.2017.8346831openalex-snapshot
The importance of shear thinning, thixotropic and viscoelastic properties of thick film pastes to predict effects on printing performance
inferred← citeshttps://doi.org/10.25027/agj2017.28.v29i3.165openalex-snapshot
Correlation of ink viscosity and printability in offset lithography process on paperboard used in packaging
inferred← citeshttps://doi.org/10.3384/lic.diva-106006openalex-snapshot
Screen Printed Thermoelectric Devices
inferred← citeshttps://doi.org/10.3390/jmmp4020050openalex-snapshot
Green Ceramic Machining: Influence of the Cutting Speed and the Binder Percentage on the Y-TZP Behavior
inferred← citeshttps://doi.org/10.3390/ma15051953openalex-snapshot
Effects of Organic Vehicle on the Rheological and Screen-Printing Characteristics of Silver Paste for LTCC Thick Film Electrodes
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