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A Review of Issues Related to Copper Etchant

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inferredcites →https://doi.org/10.1007/978-1-4612-2610-9_14openalex-snapshot

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inferred← citeshttps://doi.org/10.2139/ssrn.3960524openalex-extracted

Decomplexation & Neutralization & Precipitation by NH 3∙H 2O Coupling with Oxidation by O 2 for the Improved Removal of Cu(II) and Cu(I) from Acidic Copper Etching Wastewater: Efficiency and Mechanisms

inferred← citeshttps://doi.org/10.1016/j.jiec.2017.03.004openalex-snapshot

Thin-film UV–vis spectroscopy as a chemically-sensitive monitoring tool for copper etching bath

inferred← citeshttps://doi.org/10.1016/j.seppur.2021.120348openalex-snapshot

Removal of Cu(II) and Cu(I) from acidic copper etching wastewater by NH3·H2O decomplexation coupling with O2 oxidation

inferred← citeshttps://doi.org/10.1080/00202967.2025.2485551openalex-snapshot

Effects of 2-aminothiazoline and benzotriazole on copper foil etching

inferred← citeshttps://doi.org/10.1177/25165984241306630openalex-snapshot

Experimental study of parameters in micro-photochemical machining using maskless digital projection on flat surfaces of 100Cr6 steel

inferred← citeshttps://doi.org/10.12794/metadc1011880openalex-snapshot

Application of UV-Vis Spectroscopy to the Monitoring, Characterization and Analysis of Chemical Equilibria of Copper Etching Baths

inferred← citeshttps://doi.org/10.4071/2380-4505-2018.1.000640openalex-snapshot

Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects

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