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Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1002/smll.201500896openalex-snapshot
Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections
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Solder Joint Technology: Materials, Properties, and Reliability
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Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates
inferredcites →https://doi.org/10.1007/s10853-015-9352-yopenalex-snapshot
Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties
inferredcites →https://doi.org/10.1007/s11664-000-0004-9openalex-snapshot
Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys
inferredcites →https://doi.org/10.1007/s11664-013-2718-5openalex-snapshot
SiC Die Attach for High-Temperature Applications
inferredcites →https://doi.org/10.1016/j.actamat.2010.02.018openalex-snapshot
Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process
inferredcites →https://doi.org/10.1016/j.jallcom.2009.10.108openalex-snapshot
Development of Au–Ge based candidate alloys as an alternative to high-lead content solders
inferredcites →https://doi.org/10.1016/j.jallcom.2014.08.082openalex-snapshot
Early stage growth characteristics of Ag 3 Sn intermetallic compounds during solid–solid and solid–liquid reactions in the Ag–Sn interlayer system: Experiments and simulations
inferredcites →https://doi.org/10.1016/j.jallcom.2016.06.132openalex-snapshot
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
inferredcites →https://doi.org/10.1016/j.jallcom.2016.08.263openalex-snapshot
Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering
inferredcites →https://doi.org/10.1016/j.matdes.2010.05.035openalex-snapshot
Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system
inferredcites →https://doi.org/10.1016/j.matdes.2015.02.016openalex-snapshot
Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn–Al/Cu joints
inferredcites →https://doi.org/10.1016/j.matdes.2016.06.099openalex-snapshot
Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures
inferredcites →https://doi.org/10.1016/j.matdes.2016.07.006openalex-snapshot
Effect of permanent magnet stirring on solidification of Sn-Pb alloy
inferredcites →https://doi.org/10.1016/j.matdes.2016.07.027openalex-snapshot
Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
inferredcites →https://doi.org/10.1016/j.matdes.2016.09.013openalex-snapshot
Ultrasonic powder consolidation of Sn/In nanosolder particles and their application to low temperature Cu-Cu joining
inferredcites →https://doi.org/10.1016/j.msea.2016.02.082openalex-snapshot
Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature
inferredcites →https://doi.org/10.1016/j.msea.2016.10.092openalex-snapshot
Microstructure characterization and mechanical behavior for Ag3Sn joint produced by foil-based TLP bonding in air atmosphere
inferredcites →https://doi.org/10.1016/j.scriptamat.2015.08.011openalex-snapshot
Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device
inferredcites →https://doi.org/10.1016/s0927-796x(01)00029-8openalex-snapshot
Tin–lead (SnPb) solder reaction in flip chip technology
inferredcites →https://doi.org/10.1016/s0966-9795(99)00147-8openalex-snapshot
Microstructure and shear strength of a Au–In microjoint
inferredcites →https://doi.org/10.1021/acsami.5b02134openalex-snapshot
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
inferredcites →https://doi.org/10.1023/a:1026111420323openalex-snapshot
Thermal Expansion of Simulated Spent PWR Fuel and Simulated DUPIC Fuel
inferredcites →https://doi.org/10.1063/1.1728417openalex-snapshot
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
inferredcites →https://doi.org/10.1063/1.351487openalex-snapshot
Thermal and electrical properties of copper-tin and nickel-tin intermetallics
inferredcites →https://doi.org/10.1109/ted.2014.2358206openalex-snapshot
SiC Power Device Die Attach for Extreme Environments
inferredcites →https://doi.org/10.1109/tpel.2013.2279607openalex-snapshot
Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications
inferredcites →https://doi.org/10.1109/tpel.2014.2312335openalex-snapshot
Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter
inferredcites →https://doi.org/10.1109/tpel.2016.2535365openalex-snapshot
Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding
inferredcites →https://doi.org/10.1361/105994902770343872openalex-snapshot
Morphology and Growth Kinetics of Ag3Sn During Soldering Reaction Between Liquid Sn and an Ag Substrate
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
inferred← citeshttps://doi.org/10.1007/s10854-018-00637-7openalex-snapshot
Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices
inferred← citeshttps://doi.org/10.1007/s10854-021-05890-xopenalex-snapshot
Facile preparation of Cu foam/Sn composite preforms for low-temperature interconnection of high-power devices
inferred← citeshttps://doi.org/10.1007/s10854-021-06026-xopenalex-snapshot
Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments
inferred← citeshttps://doi.org/10.1007/s11664-019-07130-9openalex-snapshot
Reliability and Temperature Resistance of Solder–Metallic Mesh Composite Joints
inferred← citeshttps://doi.org/10.1007/s11837-019-03544-2openalex-snapshot
Rapid Formation of Full Intermetallic Bondlines for Die Attachment in High-Temperature Power Devices Based on Micro-sized Sn-Coated Ag Particles
inferred← citeshttps://doi.org/10.1016/j.jmrt.2022.06.116openalex-snapshot
Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging
inferred← citeshttps://doi.org/10.1016/j.jtice.2024.105584openalex-snapshot
Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging
inferred← citeshttps://doi.org/10.1016/j.matchar.2023.113099openalex-snapshot
The study of Ni-Sn transient liquid phase bonded joints under high temperatures
inferred← citeshttps://doi.org/10.1016/j.matdes.2018.09.017openalex-snapshot
Bonding through novel solder-metallic mesh composite design
inferred← citeshttps://doi.org/10.1088/1361-6528/ab5fedopenalex-snapshot
Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics
inferred← citeshttps://doi.org/10.1088/1361-6528/ab92cdopenalex-snapshot
Ag-Sn bimetallic nanoparticles paste for high temperature service in power devices
inferred← citeshttps://doi.org/10.1088/1361-6528/ac659copenalex-snapshot
In situ investigation on melting characteristics of 1D SnCu alloy nanosolder
inferred← citeshttps://doi.org/10.1109/ectc32862.2020.00124openalex-snapshot
Facile Preparation of Cu-Ag Micro-Nano Composite Paste for High Power Device Packaging
inferred← citeshttps://doi.org/10.1109/icept47577.2019.245804openalex-snapshot
Oxidation-resistant Cu-Ag Core-shell Nanoparticle Paste for High Temperature Electronic Packaging
inferred← citeshttps://doi.org/10.1109/icept50128.2020.9202493openalex-snapshot
Sn-coated Cu Microparticle Paste for High Power Device Packaging
inferred← citeshttps://doi.org/10.1109/icept52650.2021.9568006openalex-snapshot
A novel Cu@Sn@Ag core-shell particles for die attachment in power device packaging
inferred← citeshttps://doi.org/10.1109/icept52650.2021.9568144openalex-snapshot
Microstructure and mechanical characteristics of a novel Cu/Cu3Sn joint with Cu/Sn preform
inferred← citeshttps://doi.org/10.1109/tcpmt.2022.3163175openalex-snapshot
Low-Temperature Cu-Cu Bonding by Using Cu₂O Nanoparticle Coated Hierarchical Structure
inferred← citeshttps://doi.org/10.1109/ted.2021.3133514openalex-snapshot
High Strength and Low Thermal Resistance of Die-Bonding Structure for High-Power Light-Emitting Diodes
inferred← citeshttps://doi.org/10.1149/2162-8777/abfd4aopenalex-snapshot
Enhancement and Mechanism of Copper Nanoparticle Sintering in Activated Formic Acid Atmosphere at Low Temperature
inferred← citeshttps://doi.org/10.1186/s40580-025-00503-3openalex-snapshot
Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste
inferred← citeshttps://doi.org/10.3365/kjmm.2023.61.9.679openalex-snapshot
A Review of Recent Research Trends of Forming of Metallic Bondlines Using Core-Shell Particles and Bonding Properties According to Particle Type
inferred← citeshttps://doi.org/10.3390/ma14040834openalex-snapshot
Electrochemical Processing and Thermal Properties of Functional Core/Multi-Shell ZnAl/Ni/NiP Microparticles
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