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Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures

https://doi.org/10.1016/j.matdes.2016.06.099
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/bf02655427openalex-snapshot
Characterization of eutectic Sn-Bi solder joints
inferredcites →https://doi.org/10.1007/s10854-006-9018-2openalex-snapshot
Sn–Zn low temperature solder
inferredcites →https://doi.org/10.1007/s11664-013-2718-5openalex-snapshot
SiC Die Attach for High-Temperature Applications
inferredcites →https://doi.org/10.1007/s11664-014-3202-6openalex-snapshot
Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
inferredcites →https://doi.org/10.1016/0001-6160(82)90201-2openalex-snapshot
Kinetics of interfacial reaction in bimetallic CuSn thin films
inferredcites →https://doi.org/10.1016/j.actamat.2004.02.043openalex-snapshot
Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system
inferredcites →https://doi.org/10.1016/j.actamat.2005.01.013openalex-snapshot
Strength of joints produced by transient liquid phase bonding in the Cu–Sn system
inferredcites →https://doi.org/10.1016/j.actamat.2010.10.053openalex-snapshot
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
inferredcites →https://doi.org/10.1016/j.jallcom.2006.12.142openalex-snapshot
High-temperature creep and hardness of eutectic 80Au/20Sn solder
inferredcites →https://doi.org/10.1016/j.jallcom.2011.10.092openalex-snapshot
Mechanical properties of nano-silver joints as die attach materials
inferredcites →https://doi.org/10.1016/j.scriptamat.2012.01.007openalex-snapshot
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
inferredcites →https://doi.org/10.1063/1.1839637openalex-snapshot
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
inferredcites →https://doi.org/10.1063/1.2714100openalex-snapshot
Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints
inferredcites →https://doi.org/10.1063/1.331028openalex-snapshot
Growth kinetics of planar binary diffusion couples: ’’Thin-film case’’ versus ’’bulk cases’’
inferredcites →https://doi.org/10.1109/ectc.2005.1441298openalex-snapshot
Kirkendall voids at Cu/solder interface and their effects on solder joint reliability
inferredcites →https://doi.org/10.1109/ectc.2013.6575608openalex-snapshot
Transient liquid phase sintered attach for power electronics
inferredcites →https://doi.org/10.1109/pesc.2007.4342356openalex-snapshot
Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules
inferredcites →https://doi.org/10.1109/tdmr.2015.2402294openalex-snapshot
Characterization of Nanosilver Dry Films for High-Temperature Applications
inferredcites →https://doi.org/10.1109/tpel.2010.2046498openalex-snapshot
A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module
inferredcites →https://doi.org/10.1109/tpel.2013.2279607openalex-snapshot
Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

What points at this work

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