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Usability of Ink‐Jet Printing Technology and Nanomaterials in Electrical Interconnections, Electronic Packaging, and System Integration for Microelectronics Applications
Hydrophilic Sparse Ionic Monolayer‐Protected Metal Nanoparticles: Highly Concentrated Nano‐Au and Nano‐Ag “Inks” that can be Sintered to Near‐Bulk Conductivity at 150 °C
Preparation of styrene-γ-methacryloxypropyltrimethoxysilane/Pd nanoparticles as ink for ink-jet printing technology and electroless nickel plating on glass
Thermal and laser sintering of a highly stable inkjet ink consisting of silver nanoparticles stabilized by a combination of a short chain carboxylic acid and a polymeric dispersant
Preparation of poly (hydroxymethyl EDOT)/nano-silver composite films by oxidative polymerization with low-baking temperature, low resistance and good adhesion on PET substrate
Fast Preparation of Printable Highly Conductive Polymer Nanocomposites by Thermal Decomposition of Silver Carboxylate and Sintering of Silver Nanoparticles
Direct Printing Synthesis of Self-Organized Copper Oxide Hollow Spheres on a Substrate Using Copper(II) Complex Ink: Gas Sensing and Photoelectrochemical Properties
Flexible and ultra-thin silver films with superior electromagnetic interference shielding performance via spin-coating silver metal–organic decomposition inks
Silver oxide-mediated synergistic enhancement of conductivity and adhesion in low-temperature cured silver pastes
showing the first 200 of 318
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