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Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

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Inkjet Printing of Narrow Conductive Tracks on Untreated Polymeric Substrates
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A Low Curing Temperature Silver Ink for Use in Ink‐Jet Printing and Subsequent Production of Conductive Tracks
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Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature
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Ink‐Jet Printing of Metallic Nanoparticles and Microemulsions
inferredcites →https://doi.org/10.1007/s11664-005-0202-6openalex-snapshot
Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
inferredcites →https://doi.org/10.1007/s11664-005-0229-8openalex-snapshot
Thermal behavior of silver nanoparticles for low-temperature interconnect applications
inferredcites →https://doi.org/10.1007/s11664-007-0230-5openalex-snapshot
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
inferredcites →https://doi.org/10.1007/s11664-008-0516-2openalex-snapshot
Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste
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Metal–metal bonding process using Ag metallo-organic nanoparticles
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Thermal cure effects on electrical performance of nanoparticle silver inks
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Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives
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Special assembly of laminated nanocomposite that mimics nacre
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Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
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Infrared and Raman spectroscopic study of terephthalic acid adsorbed on silver surfaces
inferredcites →https://doi.org/10.1021/cm0101632openalex-snapshot
Inkjet Printing for Materials and Devices
inferredcites →https://doi.org/10.1021/cm0527773openalex-snapshot
Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites
inferredcites →https://doi.org/10.1021/j150651a010openalex-snapshot
The geometry of several molecular ions adsorbed on the surface of colloidal silver
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Printed Silver Ohmic Contacts for High-Mobility Organic Thin-Film Transistors
inferredcites →https://doi.org/10.1021/jp061134nopenalex-snapshot
Preparation and Study of Polyacryamide-Stabilized Silver Nanoparticles through a One-Pot Process
inferredcites →https://doi.org/10.1021/jp711616vopenalex-snapshot
Effect of Surfactants and Polymers on Stability and Antibacterial Activity of Silver Nanoparticles (NPs)
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Size-Controlled Synthesis of Monodispersed Silver Nanoparticles Capped by Long-Chain Alkyl Carboxylates from Silver Carboxylate and Tertiary Amine
inferredcites →https://doi.org/10.1023/a:1015635921255openalex-snapshot
Flame synthesis of nanopowders via combustion chemical vapor deposition
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The thermal decomposition of silver (I, III) oxide: A combined XRD, FT-IR and Raman spectroscopic study
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Flame synthesis of nanocrystalline ceria–zirconia: effect of carrier liquid
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Novel preparation of monodispersed silver nanoparticles via amine adducts derived from insoluble silver myristate in tertiary alkylamine
inferredcites →https://doi.org/10.1039/b616446copenalex-snapshot
Nitrocellulose-stabilized silver nanoparticles as low conversion temperature precursors useful for inkjet printed electronics
inferredcites →https://doi.org/10.1039/b705253gopenalex-snapshot
Synthesis of silver nanoplates at high yields by slowing down the polyol reduction of silver nitrate with polyacrylamide
inferredcites →https://doi.org/10.1039/b720032copenalex-snapshot
Inkjet-printed silver tracks: low temperature curing and thermal stability investigation
inferredcites →https://doi.org/10.1039/b823329bopenalex-snapshot
Argon plasma sintering of inkjet printed silver tracks on polymer substrates
inferredcites →https://doi.org/10.1039/b900691eopenalex-snapshot
One-step synthesis of uniform silver nanoparticles capped by saturated decanoate: direct spray printing ink to form metallic silver films
inferredcites →https://doi.org/10.1039/jm9960600573openalex-snapshot
Preparation of colloidal silver dispersions by the polyol process. Part 1—Synthesis and characterization
inferredcites →https://doi.org/10.1063/1.110362openalex-snapshot
Combustion chemical vapor deposition: A novel thin-film deposition technique
inferredcites →https://doi.org/10.1063/1.1667003openalex-snapshot
Thermal decomposition of a thin AgOx layer generating optical near-field
inferredcites →https://doi.org/10.1088/0957-4484/18/18/185701openalex-snapshot
Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing
inferredcites →https://doi.org/10.1109/6104.816098openalex-snapshot
Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
inferredcites →https://doi.org/10.1109/95.558539openalex-snapshot
Study of isotropically conductive bondings filled with aggregates of nano-sited Ag-particles
inferredcites →https://doi.org/10.1109/tcapt.2005.853167openalex-snapshot
Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material
inferredcites →https://doi.org/10.1109/tcapt.2006.885940openalex-snapshot
Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes
inferredcites →https://doi.org/10.1126/science.1110168openalex-snapshot
Electronics Without Lead
inferredcites →https://doi.org/10.1143/jjap.19.1039openalex-snapshot
Sintering of Ultrafine Metal Powders. I. Coalescence Growth Stage of Au and Ag
inferredcites →https://doi.org/10.1557/jmr.2006.0065openalex-snapshot
Preparation and characterization of Ag/AgO nanoshells on carboxylated polystyrene latex particles
inferredcites →https://doi.org/10.1557/jmr.2007.0440openalex-snapshot
Control of nanosilver sintering attained through organic binder burnout
inferredcites →https://doi.org/10.2320/matertrans.mf200805openalex-snapshot
Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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Processing and characterization of silver-filled conductive polysulfide sealants for aerospace applications
inferred← citeshttps://doi.org/10.1063/1.4716179openalex-snapshot
High thermal conductivity epoxy-silver composites based on self-constructed nanostructured metallic networks
inferred← citeshttps://doi.org/10.1063/1.4755878openalex-snapshot
Top-gate staggered poly(3,3″′-dialkyl-quarterthiophene) organic thin-film transistors with reverse-offset-printed silver source/drain electrodes
inferred← citeshttps://doi.org/10.1063/1.5002250openalex-snapshot
Volume effect of non-polar solvent towards the synthesis of hydrophilic polymer nanoparticles prepares via inverse miniemulsion polymerization
inferred← citeshttps://doi.org/10.1063/1.5010547openalex-snapshot
A study on thermoforming process of stretchable circuit and its performance in manufacturing of automotive lighting
inferred← citeshttps://doi.org/10.1080/00218464.2025.2529526openalex-snapshot
Preparation of high strength silicone-based electrically conductive adhesives with excellent electrical conductivity at low content of Ag fillers
inferred← citeshttps://doi.org/10.1080/00222348.2026.2736075openalex-snapshot
Synthesis and Electrical Response of Paraffin Wax/Polyethylene/Silver Nanoparticle Composites: An Exploratory Composition-Series Study
inferred← citeshttps://doi.org/10.1080/01694243.2014.967829openalex-snapshot
Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes
inferred← citeshttps://doi.org/10.1080/01694243.2020.1714138openalex-snapshot
Silver nanoparticles decorated α-alumina as a hybrid filler to fabricate epoxy-based thermal conductive hybrid composite for electronics packaging application
inferred← citeshttps://doi.org/10.1080/25740881.2019.1625382openalex-snapshot
Tuning crystallization and hydrolytic degradation behaviors of poly(lactic acid) by using silver phosphate, zinc oxide and their nano-hybrids
inferred← citeshttps://doi.org/10.1088/0031-8949/92/1/013001openalex-snapshot
Dissolvable tattoo sensors: from science fiction to a viable technology
inferred← citeshttps://doi.org/10.1088/0960-1317/22/7/075013openalex-snapshot
Analysis of a metal filling and liner formation mechanism of the blind via with nano-Ag particles for TSV (through silicon via) interconnection
inferred← citeshttps://doi.org/10.1088/1361-6528/aa9d22openalex-snapshot
A facile single-step synthesis of polyvinylpyrrolidone−silver nanocomposites using a conventional spray dryer
inferred← citeshttps://doi.org/10.1088/1361-6528/aae0e0openalex-snapshot
On the sintering of solution-based silver nanoparticle thin-films for sprayed and flexible antennas
inferred← citeshttps://doi.org/10.1088/1757-899x/61/1/012012openalex-snapshot
Microstructure of interface between Si chip and tape-type Ag nanoparticle sheet
inferred← citeshttps://doi.org/10.1088/2053-1591/abbafaopenalex-snapshot
Study on the mechanism of forming silver nanoparticles on micron-scale flake silver powder
inferred← citeshttps://doi.org/10.1088/2053-1591/ad3f7copenalex-snapshot
High electrical conductivity and bending resistance of Ag NPs/Ag flakes composite silver paste are achieved by sintering Ag NPs
inferred← citeshttps://doi.org/10.1088/2632-959x/abe13fopenalex-snapshot
Effect of nanofiller morphology on the electrical conductivity of polymer nanocomposites
inferred← citeshttps://doi.org/10.1109/3dic.2015.7334614openalex-snapshot
Copper micro and nano particles mixture for 3D interconnections application
inferred← citeshttps://doi.org/10.1109/ectc.2010.5490742openalex-snapshot
Deconstructing the myth of percolation in electrically conductive adhesives and its implications
inferred← citeshttps://doi.org/10.1109/ectc.2011.5898581openalex-snapshot
Investigations of the water-borne isotropically conductive adhesives
inferred← citeshttps://doi.org/10.1109/ectc.2012.6248862openalex-snapshot
Highly conductive, flexible, bio-compatible poly-urethane based isotropic conductive adhesives for flexible electronics
inferred← citeshttps://doi.org/10.1109/ectc.2016.54openalex-snapshot
Highly Conductive Polyurethane/Polyaniline-Based Composites for Wearable Electronic Applications
inferred← citeshttps://doi.org/10.1109/ectc.2017.149openalex-snapshot
Stretchable and Electrically Conductive Composites Fabricated from Polyurethane and Silver Nano/Microstructures
inferred← citeshttps://doi.org/10.1109/ectc.2018.00009openalex-snapshot
Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas
inferred← citeshttps://doi.org/10.1109/eptc.2010.5702728openalex-snapshot
Recent advances on Electrically Conductive Adhesives
inferred← citeshttps://doi.org/10.1109/eptc.2010.5702731openalex-snapshot
Low cost copper-based electrically conductive adhesives
inferred← citeshttps://doi.org/10.1109/estc.2012.6542146openalex-snapshot
Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
inferred← citeshttps://doi.org/10.1109/icept-hdp.2012.6474600openalex-snapshot
Fabrication of interconnected silver flakes for conductive adhesives through dopamine-induced surface functionalization
inferred← citeshttps://doi.org/10.1109/icept-hdp.2012.6474646openalex-snapshot
Silver-based thermal interface materials with low thermal resistance
inferred← citeshttps://doi.org/10.1109/icept.2013.6756470openalex-snapshot
Scalable synthesis of the mono-dispersed silver micro-dendrites and their applications in the ultralow cost printed electrically conductive adhesives
inferred← citeshttps://doi.org/10.1109/icept.2013.6756473openalex-snapshot
Electrically conductive adhesives filled with surface modified copper particles
inferred← citeshttps://doi.org/10.1109/icept.2014.6922628openalex-snapshot
Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging
inferred← citeshttps://doi.org/10.1109/icept.2015.7236592openalex-snapshot
Facile synthesis of elliptical Cu-Ag nanoplates for electrically conductive adhesives
inferred← citeshttps://doi.org/10.1109/icept.2016.7583263openalex-snapshot
Study of interconnection between Ni nano-array and nano-Ag solder
inferred← citeshttps://doi.org/10.1109/icept.2017.8046511openalex-snapshot
Low-temperature sintering of bimodal Ag nanoparticles for power electronics applications
inferred← citeshttps://doi.org/10.1109/icept.2017.8046671openalex-snapshot
Scalable synthesis of monodispersed branched submicron silver particles as the printed electrically conductive adhesives fillers
inferred← citeshttps://doi.org/10.1109/icept.2018.8480763openalex-snapshot
Study of the Fast Sintering of Silver Nanoparticle Ink Induced by Sodium chloride solution at Room Temperature
inferred← citeshttps://doi.org/10.1109/icept47577.2019.245788openalex-snapshot
Effect of pressure on nano copper sintering in interconnections of power device
inferred← citeshttps://doi.org/10.1109/icept56209.2022.9873358openalex-snapshot
Effects of Sintering Parameters on Silver Joints Prepared with Micron Silver Paste for Power Electronics
inferred← citeshttps://doi.org/10.1109/icept67137.2025.11157109openalex-snapshot
A Study on Low-melting-point-alloy incorporated Epoxy-based Conductive Polymer Composites for Direct-write Printing Technology
inferred← citeshttps://doi.org/10.1109/icsj.2013.6756122openalex-snapshot
Microstructural control of electrically conductive adhesives with Ag micro-fillers by binder chemistry
inferred← citeshttps://doi.org/10.1109/tcpmt.2010.2101870openalex-snapshot
Highly Reliable Copper-Based Conductive Adhesives Using an Amine Curing Agent for in Situ Oxidation/Corrosion Prevention
inferred← citeshttps://doi.org/10.1109/tcpmt.2011.2143412openalex-snapshot
Optimization of the Soldering Process With ECAs in Electronic Equipment: Characterization Measurement and Experimental Design
inferred← citeshttps://doi.org/10.1109/tcpmt.2018.2884032openalex-snapshot
Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module
inferred← citeshttps://doi.org/10.1115/1.4023910openalex-snapshot
Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures
inferred← citeshttps://doi.org/10.1115/1.4048591openalex-snapshot
Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate
inferred← citeshttps://doi.org/10.1163/016942410x549924openalex-snapshot
The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires
inferred← citeshttps://doi.org/10.12677/japc.2023.124024openalex-snapshot
Controllable Synthesis of Silver Nanowires and Its Applications
inferred← citeshttps://doi.org/10.1515/msp-2015-0032openalex-snapshot
Synthesis and electrical properties of silver nanoplates for electronic applications
inferred← citeshttps://doi.org/10.1557/opl.2012.1321openalex-snapshot
Highly Flexible, Transparent and Electrically Conducting Silver Nanoparticles Films Enabled by Controlled Sedimentation
inferred← citeshttps://doi.org/10.15826/chimtech.2022.9.3.09openalex-snapshot
Glucose-assisted polyol synthesis of silver nanoplates and nanoprisms in the presence of oxyethylated carboxylic acid
inferred← citeshttps://doi.org/10.2147/nsa.s68080openalex-snapshot
Silver nanoparticle ink technology: state of the art
inferred← citeshttps://doi.org/10.2207/jjws.79.550openalex-snapshot
Corductive Filler for Technical Advantages of Conductive Adhesives
inferred← citeshttps://doi.org/10.2207/jjws.81.45openalex-snapshot
Development of Lead-free Solder and Emerging Trend of New Joining Material
inferred← citeshttps://doi.org/10.2320/matertrans.md201511openalex-snapshot
Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder
inferred← citeshttps://doi.org/10.2351/1.5062360openalex-snapshot
Drawing electronic circuits – The production of electronic components with embedded direct written circuits using holographic beam manipulation
inferred← citeshttps://doi.org/10.29137/umagd.371119openalex-snapshot
Influence of Nano-CaCO3 Particles on Shear Strength of Epoxy Resin Adhesives
inferred← citeshttps://doi.org/10.3126/ijasbt.v9i3.39069openalex-snapshot
Antibacterial and Antioxidant Studies of Green Synthesized Silver Nanoparticles using Azadirachta indica (Neem) Leaf Extract
inferred← citeshttps://doi.org/10.3389/fnano.2026.1940496openalex-snapshot
Flexible paper-based self-sensing biomechanical ergonomics monitoring system for early warning of carpal tunnel syndrome risks
inferred← citeshttps://doi.org/10.3390/books978-3-03842-293-8openalex-snapshot
Nano- and Microcomposites for Electrical Engineering Applications
inferred← citeshttps://doi.org/10.3390/electronics13081492openalex-snapshot
Infrared Radiation-Assisted Non-Pressure Sintering of Micron-Sized Silver for Power Electronic Packaging
inferred← citeshttps://doi.org/10.3390/ma11102028openalex-snapshot
Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive
inferred← citeshttps://doi.org/10.3390/nano10122463openalex-snapshot
Effects of Curing Temperature on Bending Durability of Inkjet-Printed Flexible Silver Electrode
inferred← citeshttps://doi.org/10.3390/nano12111908openalex-snapshot
Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink
inferred← citeshttps://doi.org/10.3390/nano9111542openalex-snapshot
Easily Synthesized Polyaniline@Cellulose Nanowhiskers Better Tune Network Structures in Ag-Based Adhesives: Examining the Improvements in Conductivity, Stability, and Flexibility
inferred← citeshttps://doi.org/10.3390/polym8040157openalex-snapshot
The Effects of in Situ-Formed Silver Nanoparticles on the Electrical Properties of Epoxy Resin Filled with Silver Nanowires
inferred← citeshttps://doi.org/10.37819/nanofab.007.190openalex-snapshot
Electrochemical determination of hydrazine by using MoS2 nanostructure modified gold electrode
inferred← citeshttps://doi.org/10.4028/www.scientific.net/amr.832.21openalex-snapshot
Investigation on the Morphology of Sintered Silver Nanomaterial for Electronic Packaging Application
inferred← citeshttps://doi.org/10.4236/wjnse.2016.61003openalex-snapshot
Preparation and Characterization of Silver Nanoparticles and Their Use in Catalytic Reduction of 4-Nitrophenol
inferred← citeshttps://doi.org/10.5104/jiep.27.448openalex-snapshot
Variation in Sintered Structure and Interconnection Properties of Silver Micro-Fillers with Metal Electrodes Using Binder Chemistry
inferred← citeshttps://doi.org/10.5281/zenodo.166152openalex-snapshot
Figure 36 In A Description Of Two New Species Of The Genus Erenna (Siphonophora: Physonectae: Erennidae), With Notes On Recently Collected Specimens Of Other Erenna Species
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