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Investigation of silicon wafering by wire EDM
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1007/bf01148805openalex-snapshot
EDM machinability of SiCw/Alcomposites
inferredcites →https://doi.org/10.1016/0043-1648(78)90262-4openalex-snapshot
Roughness and wear characteristics of spark-eroded surfaces
inferredcites →https://doi.org/10.1016/s0007-8506(07)61026-9openalex-snapshot
Surface Topography Investigations by Fractal Analysis of Spark-Eroded, Electrically Conductive Ceramics
inferredcites →https://doi.org/10.1016/s0007-8506(07)62999-0openalex-snapshot
Abrasive Machining of Silicon
inferredcites →https://doi.org/10.1049/ip-i-1.1982.0001openalex-snapshot
Metal-semiconductor contacts
inferredcites →https://doi.org/10.1149/1.2129904openalex-snapshot
Effect of Lubricant Environments on Saw Damage in Si Wafers
inferredcites →https://doi.org/10.1149/1.2412121openalex-snapshot
ID-Diamond-Sawing Damage to Germanium and Silicon
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
inferred← citeshttps://doi.org/10.1007/978-981-13-3074-2_11openalex-snapshot
Near Net Shape Machining by Micro-EDM and Micro-WEDM
inferred← citeshttps://doi.org/10.1007/978-981-19-5395-8_26openalex-snapshot
Analysis of Machining Parameters of Wire Electric Discharge Machining Process on Polysilicon Material
inferred← citeshttps://doi.org/10.1007/978-981-19-7150-1_18openalex-snapshot
Multi-objective Parametric Optimization During WEDM of Silicon Through MOGWO
inferred← citeshttps://doi.org/10.1007/978-981-32-9425-7_29openalex-snapshot
Experimental Investigations into Wire Electrical Discharge Machining Process for the Machining of Ti-6Al-4V
inferred← citeshttps://doi.org/10.1007/978-981-33-4320-7_72openalex-snapshot
Preliminary Investigation of Wire Cut EDM on Polycrystalline Silicon Ingot
inferred← citeshttps://doi.org/10.1007/s00170-011-3302-xopenalex-snapshot
An experimental investigation into the micro-electrodischarge machining behavior of p-type silicon
inferred← citeshttps://doi.org/10.1007/s00170-013-4995-9openalex-snapshot
Study on surface characteristics using phosphorous dielectric on wire electrical discharge machining of polycrystalline silicon
inferred← citeshttps://doi.org/10.1007/s00170-014-6732-4openalex-snapshot
Experimental study on improving μ-WEDM and μ-EDM of doped silicon by temporary metallic coating
inferred← citeshttps://doi.org/10.1007/s00170-016-9718-6openalex-snapshot
Mechanism of material removal in abrasive electrochemical multi-wire sawing of multi-crystalline silicon ingots into wafers
inferred← citeshttps://doi.org/10.1007/s00170-018-2692-4openalex-snapshot
Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
inferred← citeshttps://doi.org/10.1007/s00170-020-06306-6openalex-snapshot
Research on the machining characteristics of composite pulse power supply for the electrical discharge machining of semiconductor silicon crystal
inferred← citeshttps://doi.org/10.1007/s00170-021-06734-yopenalex-snapshot
Heat-assisted μ-electrical discharge machining of silicon
inferred← citeshttps://doi.org/10.1007/s00170-021-08240-7openalex-snapshot
Research on improving the discharge cutting efficiency of N-type high-resistance silicon based on electroless plating
inferred← citeshttps://doi.org/10.1007/s00170-022-09365-zopenalex-snapshot
Non-traditional machining techniques for silicon wafers
inferred← citeshttps://doi.org/10.1007/s00542-009-0792-7openalex-snapshot
Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining
inferred← citeshttps://doi.org/10.1007/s10043-014-0117-7openalex-snapshot
Three-dimensional image reconstruction of V-grooves for damage analysis
inferred← citeshttps://doi.org/10.1007/s40042-022-00648-yopenalex-snapshot
Multiwire-electrical discharge machining process for silicon wafering for photovoltaics
inferred← citeshttps://doi.org/10.1007/s40042-023-00815-9openalex-snapshot
Wire-electrical discharge machining on single crystalline Si brick as a new wafering process for photovoltaic applications
inferred← citeshttps://doi.org/10.1007/s40430-019-1827-3openalex-snapshot
Thin-wall micromachining of Ti–6Al–4V using micro-wire electrical discharge machining process
inferred← citeshttps://doi.org/10.1016/b978-0-12-820049-0.00010-4openalex-snapshot
Microelectrical discharge machining of silicon wafers
inferred← citeshttps://doi.org/10.1016/j.cirp.2011.03.069openalex-snapshot
Abrasive electrochemical multi-wire slicing of solar silicon ingots into wafers
inferred← citeshttps://doi.org/10.1016/j.ijmachtools.2004.04.017openalex-snapshot
State of the art in wire electrical discharge machining (WEDM)
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2007.06.038openalex-snapshot
Experimental investigation of wire electrical discharge machining of gallium-doped germanium
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2008.07.029openalex-snapshot
High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2008.08.027openalex-snapshot
Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2012.12.008openalex-snapshot
Effect of metal coating on machinability of high purity germanium using wire electrical discharge machining
inferred← citeshttps://doi.org/10.1016/j.jmrt.2023.06.202openalex-snapshot
Electrical discharge machining of semiconductor materials: A review
inferred← citeshttps://doi.org/10.1016/j.jmrt.2024.11.208openalex-snapshot
Study on the mechanism and machining characteristics of single-crystal silicon cutting by micro-discharge abrasive cutting
inferred← citeshttps://doi.org/10.1016/j.matdes.2017.03.059openalex-snapshot
Ultra thin silicon wafer slicing using wire-EDM for solar cell application
inferred← citeshttps://doi.org/10.1016/j.matpr.2017.12.053openalex-snapshot
Modeling and Analysis of Wire EDM in a Gear Cutting Process for a 2D Model
inferred← citeshttps://doi.org/10.1016/j.matpr.2020.10.547openalex-snapshot
Parametric optimization of silicon slicing using wire electro discharge machining
inferred← citeshttps://doi.org/10.1016/j.mseb.2024.117389openalex-snapshot
Research on N-type silicon crystal processing by liquid-immersion wire electrical discharge machining
inferred← citeshttps://doi.org/10.1016/j.mssp.2014.07.042openalex-snapshot
Discharge cutting technology for specific crystallographic planes of monocrystalline silicon
inferred← citeshttps://doi.org/10.1016/j.mssp.2014.12.061openalex-snapshot
Study of the mechanism of multi-channel discharge in semiconductor processing by WEDM
inferred← citeshttps://doi.org/10.1016/j.mssp.2015.06.050openalex-snapshot
Multi-objective optimization for silicon wafer slicing using wire-EDM process
inferred← citeshttps://doi.org/10.1016/j.mssp.2021.106339openalex-snapshot
Experimental study on improving silicon crystal discharge cutting efficiency based on laser irradiation method
inferred← citeshttps://doi.org/10.1016/j.precisioneng.2025.01.008openalex-snapshot
Parametric and theoretical study of hole quality in conventional micro-machining and rotary ultrasonic micro-machining of silicon
inferred← citeshttps://doi.org/10.1016/j.proeng.2017.04.082openalex-snapshot
An Experimental Investigation on the Effect of Nanopowder for Micro-Wire Electro Discharge Machining of Gold Coated Silicon
inferred← citeshttps://doi.org/10.1016/j.seppur.2013.07.011openalex-snapshot
Recovery of silicon powder from silicon wiresawing slurries by tuning the particle surface potential combined with centrifugation
inferred← citeshttps://doi.org/10.1016/s0924-0136(03)00718-0openalex-snapshot
Study of electrical discharge machining technology for slicing silicon ingots
inferred← citeshttps://doi.org/10.1016/s0924-0136(96)00019-2openalex-snapshot
The dependence of interspace discharge transitivity upon the gap debris in precision electrodischarge machining
inferred← citeshttps://doi.org/10.1016/s0924-0136(99)00107-7openalex-snapshot
Rupture failure and mechanical strength of the electrode wire used in wire EDM
inferred← citeshttps://doi.org/10.1016/s0924-4247(97)01359-9openalex-snapshot
Microstructuring of silicon by electro-discharge machining (EDM) — part I: theory
inferred← citeshttps://doi.org/10.1016/s0924-4247(97)80293-2openalex-snapshot
Microstructing of silicon by electro-discharge machining (EDM) — part II: applications
inferred← citeshttps://doi.org/10.1039/b927181copenalex-snapshot
Fabrication of nanocluster silicon surface with electric discharge and the application in desorption/ionization on silicon-mass spectrometry
inferred← citeshttps://doi.org/10.1080/10426910902769285openalex-snapshot
Machining Performance and Optimizing Machining Parameters of Al2O3–TiC Ceramics Using EDM Based on the Taguchi Method
inferred← citeshttps://doi.org/10.1080/10426914.2010.544808openalex-snapshot
Machining Characteristics of Polycrystalline Silicon by Wire Electrical Discharge Machining
inferred← citeshttps://doi.org/10.1080/10426914.2014.973594openalex-snapshot
Experimental Investigation and Optimization of Micro-EDMing Process for Silicon Substrates
inferred← citeshttps://doi.org/10.1080/10910344.2012.731952openalex-snapshot
RESPONSE SURFACE ANALYSIS OF SLICING OF SILICON INGOTS WITH FOCUS ON PHOTOVOLTAIC APPLICATION
inferred← citeshttps://doi.org/10.1088/2631-8695/ac852aopenalex-snapshot
Experimental investigation and prediction modelling of slicing speed and surface roughness during wafer slicing using WEDM
inferred← citeshttps://doi.org/10.1108/wje-05-2022-0201openalex-snapshot
Modelling and prediction of WEDM parameters for sustainable machining of titanium grade-2 alloy
inferred← citeshttps://doi.org/10.1109/3516.662865openalex-snapshot
A mechatronic approach to microsystem design
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Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics
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Three-dimensional silicon micromechanical parts manufactured by electro-discharge machining
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Efficient dicing of silicon ingots for photovoltaic applications
inferred← citeshttps://doi.org/10.1109/pvsc43889.2021.9518640openalex-snapshot
Fast, Low Kerf-loss Wafering of Silicon Ingots for Low-cost Solar
inferred← citeshttps://doi.org/10.1109/sensor.2009.5285874openalex-snapshot
Fabrication of 3-dimensional silicon microelectrode arrays using micro electro discharge machining for neural applications
inferred← citeshttps://doi.org/10.1115/1.4044374openalex-snapshot
Surface Quality and Contamination on Si Wafer Surfaces Sliced Using Wire-Electrical Discharge Machining
inferred← citeshttps://doi.org/10.1115/1.4049362openalex-snapshot
Multi-Objective Optimization of Wire-Electric Discharge Machined Ultrathin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications
inferred← citeshttps://doi.org/10.1115/msec2020-8489openalex-snapshot
Multi-Objective Optimization of Wire Electrical Discharge Machined Ultra-Thin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications
inferred← citeshttps://doi.org/10.1117/1.3280262openalex-snapshot
Wear-ratio-based tool wear compensation for microelectrodischarge-machining of silicon through process simulation
inferred← citeshttps://doi.org/10.1177/0954405413491241openalex-snapshot
Modeling of silicon ingot slicing process by wire–electrical discharge machining
inferred← citeshttps://doi.org/10.1243/0954405011518746openalex-snapshot
Investigation of electrodischarge micromachining controllable factors on machined silicon surface quality
inferred← citeshttps://doi.org/10.1504/ijmtm.2008.016773openalex-snapshot
Study of WEDM parameter phenomena for microfabrication
inferred← citeshttps://doi.org/10.1515/jmbm-2022-0291openalex-snapshot
Investigation of machining characterization of solar material on WEDM process through response surface methodology
inferred← citeshttps://doi.org/10.32657/10356/43562openalex-snapshot
Advancing the micro-EDM technique with powder-mixed dielectric and process modelling
inferred← citeshttps://doi.org/10.4028/www.scientific.net/amr.800.191openalex-snapshot
Research Progress of Slicing Method for Solar Silicon Wafer
inferred← citeshttps://doi.org/10.4028/www.scientific.net/amr.845.950openalex-snapshot
Investigation of Process Performances and Cut Surface Characteristics in the Wire-EDMing of Silicon
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