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https://doi.org/10.2139/ssrn.4483707

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Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/bf01119742openalex-extracted
Investigation of silicon wafering by wire EDM
inferredcites →https://doi.org/10.1007/s00170-017-1013-7openalex-extracted
Experimental research on semiconductor shaping by abrasive-spark hybrid machining
inferredcites →https://doi.org/10.1007/s001700170185openalex-extracted
Recent Advances in Machining of Silicon Wafers for Semiconductor Applications
inferredcites →https://doi.org/10.1007/s12633-020-00766-xopenalex-extracted
Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface for Solar Applications
inferredcites →https://doi.org/10.1016/j.engfracmech.2014.02.016openalex-extracted
Subsurface nanocracking in monocrystalline Si (001) induced by nanoscratching
inferredcites →https://doi.org/10.1016/j.matdes.2020.108524openalex-extracted
Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon
inferredcites →https://doi.org/10.1016/j.mssp.2014.07.042openalex-extracted
Discharge cutting technology for specific crystallographic planes of monocrystalline silicon
inferredcites →https://doi.org/10.1016/j.precisioneng.2013.05.009openalex-extracted
Study of unidirectional conductivity on the electrical discharge machining of semiconductor crystals
inferredcites →https://doi.org/10.1016/j.solmat.2022.111989openalex-extracted
Adjustment of resistivity for phosphorus-doped n-type multicrystalline silicon
inferredcites →https://doi.org/10.1016/s0007-8506(07)63182-5openalex-extracted
Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Slicing Ingot
inferredcites →https://doi.org/10.1016/s0141-6359(99)00041-0openalex-extracted
Improvement of EDM efficiency of silicon single crystal through ohmic contact
inferredcites →https://doi.org/10.1016/s0167-9317(00)00499-8openalex-extracted
The 300 mm silicon wafer — a cost and technology challenge
inferredcites →https://doi.org/10.1016/s0924-0136(03)00718-0openalex-extracted
Study of electrical discharge machining technology for slicing silicon ingots
inferredcites →https://doi.org/10.1021/acs.chemrev.0c00026openalex-extracted
Advanced Thermoelectric Design: From Materials and Structures to Devices
inferredcites →https://doi.org/10.1080/10426914.2020.1802037openalex-extracted
Developed diamond wire sawing technique with high slicing ability for multicrystalline silicon wafers
inferredcites →https://doi.org/10.1081/amp-120029960openalex-extracted
Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Silicon Carbide Wafers
inferredcites →https://doi.org/10.1088/0960-1317/15/2/001openalex-extracted
Development of a high precision tabletop versatile CNC wire-EDM for making intricate micro parts
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