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Immersion interferometer for microscopic moiré interferometry
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1007/bf02321371openalex-snapshot
The magic of carrier fringes in moiré interferometry
inferredcites →https://doi.org/10.1111/j.1747-1567.1985.tb02042.xopenalex-snapshot
Handbook on Experimental Mechanics
inferredcites →https://doi.org/10.1111/j.1747-1567.1989.tb01038.xopenalex-snapshot
HANDBOOK ON EXPERIMENTAL MECHANICS
inferredcites →https://doi.org/10.1364/ao.18.004163openalex-snapshot
Moiré interferometry with white light
inferredcites →https://doi.org/10.1364/ao.21.001621openalex-snapshot
Moire interferometry near the theoretical limit
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
inferred← citeshttps://doi.org/10.1007/0-387-32989-7_14openalex-snapshot
Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods
inferred← citeshttps://doi.org/10.1007/3-540-48800-6_5openalex-snapshot
Moiré Methods for Engineering and Science — Moiré Interferometry and Shadow Moiré
inferred← citeshttps://doi.org/10.1007/978-1-4419-5760-3openalex-snapshot
Reliability of Microtechnology: Interconnects, Devices and Systems
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Experimental Tools for Reliability Analysis
inferred← citeshttps://doi.org/10.1007/978-1-4612-4334-2_5openalex-snapshot
Microscopic Moiré Interferometry: Very High Sensitivity
inferred← citeshttps://doi.org/10.1007/978-3-7091-2586-1_3openalex-snapshot
Automated In-Plane Moiré Techniques and Grating Interferometry
inferred← citeshttps://doi.org/10.1007/bf00723943openalex-snapshot
Electronic speckle pattern interferometry on a microscopic scale
inferred← citeshttps://doi.org/10.1007/bf02323193openalex-snapshot
Advances in scanning electron microscope moiré
inferred← citeshttps://doi.org/10.1007/bf02326480openalex-snapshot
A moiré microscope for finite deformation micro-mechanical studies
inferred← citeshttps://doi.org/10.1007/bf02327553openalex-snapshot
High-magnification moiré interferometer for crack tip analysis of steels
inferred← citeshttps://doi.org/10.1007/bf02328707openalex-snapshot
Micromechanical deformation analysis of beta alloy titanium in elastic and elastic/plastic tension
inferred← citeshttps://doi.org/10.1007/bf02328715openalex-snapshot
A simple method for measuring surface strains around cracks
inferred← citeshttps://doi.org/10.1007/s00170-004-2245-xopenalex-snapshot
Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique
inferred← citeshttps://doi.org/10.1007/s11340-008-9127-3openalex-snapshot
Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution
inferred← citeshttps://doi.org/10.1007/s11340-010-9404-9openalex-snapshot
Recent Applications of Moiré Interferometry
inferred← citeshttps://doi.org/10.1016/0143-8166(95)00064-xopenalex-snapshot
Experimental investigation of micromechanical behavior of advanced materials by moiré interferometry
inferred← citeshttps://doi.org/10.1016/0143-8166(95)00101-8openalex-snapshot
Micromechanical thermal deformation analysis of unidirectional boron/aluminum metal-matrix composite
inferred← citeshttps://doi.org/10.1016/0956-7151(94)90452-9openalex-snapshot
Experimental characterization of the local strain field in a heterogeneous elastoplastic material
inferred← citeshttps://doi.org/10.1016/j.ndteint.2005.05.001openalex-snapshot
Measurements of deformations and strains of a Si-epoxy-FR4 structure during thermal testing
inferred← citeshttps://doi.org/10.1016/j.optlaseng.2021.106853openalex-snapshot
Mechanical properties measurement of materials and devices at micro- and nano-scale by optical methods: A review
inferred← citeshttps://doi.org/10.1017/cbo9780511550508.003openalex-snapshot
Applications of electronic composites
inferred← citeshttps://doi.org/10.1017/cbo9780511550508.005openalex-snapshot
Models for electronic composites based on effective medium theory
inferred← citeshttps://doi.org/10.1017/cbo9780511550508.006openalex-snapshot
Resistor network model for electrical and thermal conduction problems
inferred← citeshttps://doi.org/10.1017/cbo9780511550508.011openalex-snapshot
Physical constants and properties of materials
inferred← citeshttps://doi.org/10.1023/b:inet.0000043887.48600.0bopenalex-snapshot
An Optical Interferometry System for Measuring Three-Dimensional Displacements
inferred← citeshttps://doi.org/10.1080/713855954openalex-snapshot
THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS
inferred← citeshttps://doi.org/10.1098/rsta.2001.0975openalex-snapshot
Construction of a high-resolution moiré interferometer for investigating microstructural displacement fields in materials
inferred← citeshttps://doi.org/10.1108/09540910310505107openalex-snapshot
Thermal strain analysis of an electronics package using the SEM Moiré technique
inferred← citeshttps://doi.org/10.1108/13565360410549693openalex-snapshot
Thermal strain analysis of IC packages using various Moiré methods
inferred← citeshttps://doi.org/10.1109/ectc.1998.678919openalex-snapshot
Resolving displacement field of solder ball in flip-chip package by both phase shifting moire interferometry and FEM modeling
inferred← citeshttps://doi.org/10.1109/ectc.2002.1008271openalex-snapshot
Modeling methodology for predicting the thermo-mechanical reliability of electronic packaging
inferred← citeshttps://doi.org/10.1109/eptc.2003.1271497openalex-snapshot
Strain analysis of IC packages using a scanning Moire method
inferred← citeshttps://doi.org/10.1109/tepm.2004.830516openalex-snapshot
Interfacial behavior of a flip-chip structure under thermal testing
inferred← citeshttps://doi.org/10.1111/j.1747-1567.2004.tb00178.xopenalex-snapshot
Technical Application Series. AN OPTICAL INTERFEROMETRIC SYSTEM FOR 3-D DISPLACEMENT MEASUREMENT
inferred← citeshttps://doi.org/10.1115/1.1290000openalex-snapshot
Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study
inferred← citeshttps://doi.org/10.1115/1.2792090openalex-snapshot
Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
inferred← citeshttps://doi.org/10.1115/1.2912183openalex-snapshot
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
inferred← citeshttps://doi.org/10.1115/1.4024984openalex-snapshot
Computer Vision-Based, Noncontacting Deformation Measurements in Mechanics: A Generational Transformation
inferred← citeshttps://doi.org/10.1117/12.57681openalex-snapshot
Higher sensitivity moire interferometry for micromechanics studies
inferred← citeshttps://doi.org/10.1163/156856108x320555openalex-snapshot
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
inferred← citeshttps://doi.org/10.1177/002199839202601304openalex-snapshot
Thick Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties
inferred← citeshttps://doi.org/10.1201/9781420034219.ch2openalex-snapshot
Strain Measurements At The Limit - The Moir´e Microscope
inferred← citeshttps://doi.org/10.1243/0309324011512568openalex-snapshot
Moiré interferometry for engineering mechanics: Current practices and future developments
inferred← citeshttps://doi.org/10.1243/0309324981512878openalex-snapshot
Moiré strain analysis: An introduction, review and critique, including related techniques and future potential
inferred← citeshttps://doi.org/10.1364/ao.34.007291openalex-snapshot
Optical fringe multiplication in moiré interferometry
inferred← citeshttps://doi.org/10.6028/nist.tn.1500-5openalex-snapshot
Electron-beam moir'e technique :
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