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The magic of carrier fringes in moiré interferometry

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/bf02318089openalex-snapshot
Shear strains in a graphite/PEEK beam by moiré interferometry with carrier fringes
inferredcites →https://doi.org/10.1007/bf02324290openalex-snapshot
Moiré methods of strain analysis
inferredcites →https://doi.org/10.1111/j.1747-1567.1985.tb02042.xopenalex-snapshot
Handbook on Experimental Mechanics
inferredcites →https://doi.org/10.1117/12.7972930openalex-snapshot
Developments In Moire Interferometry
inferredcites →https://doi.org/10.1177/002199838902300304openalex-snapshot
Interlaminar Shear Moduli of Cross-Ply Laminates: An Experimental Analysis
inferredcites →https://doi.org/10.1364/ao.21.002558openalex-snapshot
Displacement fields (U,W) obtained simultaneously by moiré interferometry

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.1007/978-0-387-30877-7_22openalex-snapshot
Moiré Interferometry
inferred← citeshttps://doi.org/10.1007/978-1-4612-4334-2_9openalex-snapshot
Textile Composites
inferred← citeshttps://doi.org/10.1007/978-1-4684-7767-2_8openalex-snapshot
Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry
inferred← citeshttps://doi.org/10.1007/978-94-009-1129-1_12openalex-snapshot
Moire Interferometry for Composites
inferred← citeshttps://doi.org/10.1007/978-94-011-3658-7_3openalex-snapshot
Moire Interferometry for Composites
inferred← citeshttps://doi.org/10.1007/bf02317983openalex-snapshot
Immersion interferometer for microscopic moiré interferometry
inferred← citeshttps://doi.org/10.1007/bf02321415openalex-snapshot
Determination of thermal strains by moiré interferometry
inferred← citeshttps://doi.org/10.1007/bf02325144openalex-snapshot
Moiré analysis of thick composites with embedded optical fibers
inferred← citeshttps://doi.org/10.1007/bf02326072openalex-snapshot
Moiré interferometry: Advances and applications
inferred← citeshttps://doi.org/10.1007/bf02328439openalex-snapshot
Residual surface stresses in laminated cross-ply fiber-epoxy composite materials
inferred← citeshttps://doi.org/10.1007/bf02328443openalex-snapshot
Residual-stress determination by single-axis holographic interferometry and hole drilling—Part I: Theory
inferred← citeshttps://doi.org/10.1007/s11340-007-9114-0openalex-snapshot
Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times
inferred← citeshttps://doi.org/10.1016/0143-8166(90)90011-wopenalex-snapshot
An interpretation of Moiré interferometry from wavefront interference theory
inferred← citeshttps://doi.org/10.1016/0143-8166(94)00037-bopenalex-snapshot
A compact, robust and versatile moiré interferometer
inferred← citeshttps://doi.org/10.1016/b0-08-043749-4/08049-6openalex-snapshot
Nano-moiré Method and Nanoscopic Crack-tip Deformation
inferred← citeshttps://doi.org/10.1016/b978-0-12-822944-6.00158-4openalex-snapshot
Nano-moiré Method and Nanoscopic Crack-tip Deformation
inferred← citeshttps://doi.org/10.1016/j.microrel.2004.01.007openalex-snapshot
Reliability issues for flip-chip packages
inferred← citeshttps://doi.org/10.1109/emap.2000.904180openalex-snapshot
A study on the thermal deformation of ACF assemblies using moire interferometry and FEM
inferred← citeshttps://doi.org/10.1109/iemt.1997.626939openalex-snapshot
Thermo-mechanical deformation of underfilled flip-chip packaging
inferred← citeshttps://doi.org/10.1111/j.1747-1567.1989.tb01032.xopenalex-snapshot
METAL-FORMING STUDIES BY MOIRÉ INTERFEROMETRY
inferred← citeshttps://doi.org/10.1111/j.1747-1567.1989.tb01461.xopenalex-snapshot
THE TILTED-PLATE METHOD FOR INTRODUCING CARRIER FRINGES OF EXTENSION IN MOIRÉ INTERFEROMETRY
inferred← citeshttps://doi.org/10.1115/1.2791919openalex-snapshot
Study of Residual Stress Distribution by a Combined Method of Moire´ Interferometry and Incremental Hole Drilling, Part I: Theory
inferred← citeshttps://doi.org/10.1115/1.2806813openalex-snapshot
Strain Measurement in the Wavy-Ply Region of an Externally Pressurized Cross-Ply Composite Ring
inferred← citeshttps://doi.org/10.1115/1.2905683openalex-snapshot
Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain
inferred← citeshttps://doi.org/10.1117/12.173578openalex-snapshot
Carrier pattern analysis of moire interferometry using the Fourier transform moire method
inferred← citeshttps://doi.org/10.1117/12.57681openalex-snapshot
Higher sensitivity moire interferometry for micromechanics studies
inferred← citeshttps://doi.org/10.11395/jjsem2001.3.3openalex-snapshot
Moire Interferometry-A Powerful Technique For Solid Mechanics.
inferred← citeshttps://doi.org/10.1177/002199838902300304openalex-snapshot
Interlaminar Shear Moduli of Cross-Ply Laminates: An Experimental Analysis
inferred← citeshttps://doi.org/10.1177/002199839202601304openalex-snapshot
Thick Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties
inferred← citeshttps://doi.org/10.1177/1045389x9300400216openalex-snapshot
The Role of Local Interaction Mechanics in Fiber Optic Smart Structures
inferred← citeshttps://doi.org/10.1201/9781420034219.ch5openalex-snapshot
Complex Shapes
inferred← citeshttps://doi.org/10.1201/9781420034219.ch8openalex-snapshot
Residual Stresses
inferred← citeshttps://doi.org/10.1557/proc-445-167openalex-snapshot
In‐Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip‐Chip Packaging Using Moiré Interferometry
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