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Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis

https://doi.org/10.1007/s11664-014-2977-9
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Outgoing claims: the papers this work cites, builds on, or argues with.

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In search of new lead-free electronic solders
inferredcites →https://doi.org/10.1007/bf02655488openalex-snapshot
Tensile behavior of pb-sn solder/cu joints
inferredcites →https://doi.org/10.1007/s11664-003-0109-zopenalex-snapshot
Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder
inferredcites →https://doi.org/10.1007/s11664-003-0185-0openalex-snapshot
Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder
inferredcites →https://doi.org/10.1007/s11664-004-0103-0openalex-snapshot
Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
inferredcites →https://doi.org/10.1007/s11664-004-0111-0openalex-snapshot
The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump
inferredcites →https://doi.org/10.1016/0001-6160(73)90190-9openalex-snapshot
Interdiffusion and reaction in bimetallic Cu-Sn thin films
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Measuring the elastic properties of anisotropic materials by means of indentation experiments
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Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation
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Three-dimensional investigation of the texture and microstructure below a nanoindent in a Cu single crystal using 3D EBSD and crystal plasticity finite element simulations
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Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
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Investigation of the indentation size effect through the measurement of the geometrically necessary dislocations beneath small indents of different depths using EBSD tomography
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Rate-dependent behavior of Sn alloy–Cu couples: Effects of microstructure and composition on mechanical shock resistance
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Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
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The dependence of phase selection in peritectic solidification of Bi–Te40 on cooling rates and liquid states
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Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint
inferredcites →https://doi.org/10.1016/j.jallcom.2012.04.068openalex-snapshot
IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms
inferredcites →https://doi.org/10.1016/j.matdes.2012.04.047openalex-snapshot
Structural and magnetic properties of nanostructured (Fe70Co30)100−xCux alloy prepared by high energy ball milling
inferredcites →https://doi.org/10.1016/j.matlet.2009.09.041openalex-snapshot
Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface
inferredcites →https://doi.org/10.1016/j.matlet.2012.07.018openalex-snapshot
Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5
inferredcites →https://doi.org/10.1016/j.msea.2007.07.093openalex-snapshot
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
inferredcites →https://doi.org/10.1016/j.msea.2011.11.037openalex-snapshot
Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects
inferredcites →https://doi.org/10.1016/j.msea.2012.12.057openalex-snapshot
Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes
inferredcites →https://doi.org/10.1016/j.mser.2005.03.001openalex-snapshot
Interfacial reactions between lead-free solders and common base materials
inferredcites →https://doi.org/10.1016/s0257-8972(01)01340-8openalex-snapshot
Investigation of creep behaviour under load during indentation experiments and its influence on hardness and modulus results
inferredcites →https://doi.org/10.1016/s0927-796x(01)00029-8openalex-snapshot
Tin–lead (SnPb) solder reaction in flip chip technology
inferredcites →https://doi.org/10.1016/s1359-6454(01)00295-6openalex-snapshot
Computational modeling of the forward and reverse problems in instrumented sharp indentation
inferredcites →https://doi.org/10.1016/s1359-6462(99)00011-1openalex-snapshot
Determination of elastoplastic properties by instrumented sharp indentation
inferredcites →https://doi.org/10.1107/s0108768194004052openalex-snapshot
The superstructure of domain-twinned η'-Cu6Sn5
inferredcites →https://doi.org/10.1109/tadvp.2006.884805openalex-snapshot
Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle Parameters
inferredcites →https://doi.org/10.1109/tcapt.2006.877765openalex-snapshot
IEEE Components, Packaging, and Manufacturing Technology Society Information
inferredcites →https://doi.org/10.1115/1.4023846openalex-snapshot
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
inferredcites →https://doi.org/10.1146/annurev-matsci-070909-104456openalex-snapshot
The Indentation Size Effect: A Critical Examination of Experimental Observations and Mechanistic Interpretations
inferredcites →https://doi.org/10.1179/174328009x461069openalex-snapshot
Thermomechanical behaviour of environmentally benign Pb-free solders
inferredcites →https://doi.org/10.1557/jmr.1998.0146openalex-snapshot
Influences of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques
inferredcites →https://doi.org/10.1557/jmr.2003.0314openalex-snapshot
Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints
inferredcites →https://doi.org/10.1557/jmr.2004.19.1.3openalex-snapshot
Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology
inferredcites →https://doi.org/10.1557/jmr.2005.0371openalex-snapshot
Phase Stability, Phase Transformations, and Elastic Properties of Cu6Sn5: Ab initio Calculations and Experimental Results
inferredcites →https://doi.org/10.1557/jmr.2010.0081openalex-snapshot
Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
inferredcites →https://doi.org/10.2320/matertrans.45.765openalex-snapshot
Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys
inferredcites →https://doi.org/10.2320/matertrans1960.13.93openalex-snapshot
Elastic Moduli of Some Complicated Binary Alloy Systems
inferredcites →https://doi.org/10.3139/146.017946openalex-snapshot
Bifurcation of the Kirkendall plane and patterning in reactive diffusion
inferredcites →https://doi.org/10.3139/146.018032openalex-snapshot
Contents

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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inferred← citeshttps://doi.org/10.1007/s10854-024-13079-1openalex-snapshot
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inferred← citeshttps://doi.org/10.1007/s11661-014-2696-0openalex-snapshot
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inferred← citeshttps://doi.org/10.1007/s11661-018-4664-6openalex-snapshot
A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves
inferred← citeshttps://doi.org/10.1007/s11664-016-4541-2openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.actamat.2022.117828openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.apsusc.2018.06.241openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.jajp.2025.100356openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.04.184openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.jallcom.2017.01.292openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.matlet.2020.127327openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.msea.2023.145398openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.mtcomm.2024.108330openalex-snapshot
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Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing
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Ultrahigh Aspect Ratio TiB Nanowhisker-Reinforced Titanium Matrix Composites as Lightweight and Low-Cost Replacements for Superalloys
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Research on the Effect of Ultrasonic on the Interfacial Reliability of Micro Copper Pillar Solder Joints
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Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
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Crystal Structure of the Intermetallic Thin-Film Cu–Sn Condensate
inferred← citeshttps://doi.org/10.14258/izvasu(2017)1-04openalex-snapshot
Oriented Columnar Structure of a Thin Intermetallic Film Cu6Sn5
inferred← citeshttps://doi.org/10.2139/ssrn.6830348openalex-snapshot
Influence of Sb/Bi Alloying on the Crystallographic Orientation and Mechanical Stability of Cu-Sn Intermetallic Compounds
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