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Influence of Sb/Bi Alloying on the Crystallographic Orientation and Mechanical Stability of Cu-Sn Intermetallic Compounds

https://doi.org/10.2139/ssrn.6830348
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Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/s10853-017-0952-6openalex-snapshot
Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation
inferredcites →https://doi.org/10.1007/s10854-011-0291-3openalex-snapshot
Recent advances on Sn–Cu solders with alloying elements: review
inferredcites →https://doi.org/10.1007/s10854-018-0302-8openalex-snapshot
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
inferredcites →https://doi.org/10.1007/s11664-014-2977-9openalex-snapshot
Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis
inferredcites →https://doi.org/10.1007/s11664-025-12505-2openalex-snapshot
Exploration of Alloy Element (Sb,Bi) Doped η′-Cu6Sn5: Structure, Elastic Anisotropy, Electronic Structure, and Fracture Toughness
inferredcites →https://doi.org/10.1016/j.msea.2007.07.093openalex-snapshot
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
inferredcites →https://doi.org/10.1016/j.msea.2014.06.048openalex-snapshot
Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation
inferredcites →https://doi.org/10.1016/j.scriptamat.2018.08.020openalex-snapshot
Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound
inferredcites →https://doi.org/10.1016/j.tsf.2005.09.056openalex-snapshot
Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging
inferredcites →https://doi.org/10.1109/tcpmt.2021.3093562openalex-snapshot
Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures
inferredcites →https://doi.org/10.1115/1.4070515openalex-snapshot
Effect of Bismuth Addition to SAC305 on the Microstructure and Mechanical Properties of Solder Joints
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