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Mechanical properties of nano-silver joints as die attach materials
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Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)
inferred← citeshttps://doi.org/10.1007/s11664-016-5106-0openalex-snapshot
Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles
inferred← citeshttps://doi.org/10.1007/s11664-016-5200-3openalex-snapshot
Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
inferred← citeshttps://doi.org/10.1007/s11664-017-5683-6openalex-snapshot
Structural Understanding of Direct-Sintered Al2O3-to-Cu Joints Through Damage Modeling
inferred← citeshttps://doi.org/10.1007/s11664-017-5792-2openalex-snapshot
Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications
inferred← citeshttps://doi.org/10.1007/s11664-020-08399-xopenalex-snapshot
Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
inferred← citeshttps://doi.org/10.1007/s11664-020-08410-5openalex-snapshot
Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature
inferred← citeshttps://doi.org/10.1007/s11664-023-10656-8openalex-snapshot
Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging
inferred← citeshttps://doi.org/10.1007/s11664-023-10677-3openalex-snapshot
Will Better Sintering Quality of Ag Nanoparticles Lead to More Reliable Ag Bonding Interfaces?
inferred← citeshttps://doi.org/10.1007/s11664-023-10870-4openalex-snapshot
Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling
inferred← citeshttps://doi.org/10.1007/s11665-022-07655-xopenalex-snapshot
Determining the Constitutive Properties of Sintered Nano Silver via Reverse Analysis and Nanoindentation
inferred← citeshttps://doi.org/10.1007/s11706-025-0733-0openalex-snapshot
Overcoming the trade-off between curing temperature and conductivity for high-performance conductive silver pastes
inferred← citeshttps://doi.org/10.1007/s11837-019-03461-4openalex-snapshot
Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material
inferred← citeshttps://doi.org/10.1007/s11837-019-03517-5openalex-snapshot
Facile Preparation of Self-Reducible Cu Nanoparticle Paste for Low Temperature Cu-Cu Bonding
inferred← citeshttps://doi.org/10.1007/s11837-023-05981-6openalex-snapshot
A Study of the Creep Properties and Constitutive Model of Sintered Nano-silver: Role of Loading Condition and Temperature
inferred← citeshttps://doi.org/10.1007/s12540-019-00293-4openalex-snapshot
Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn–58Bi Nanoparticles
inferred← citeshttps://doi.org/10.1007/s12540-019-00394-0openalex-snapshot
Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material
inferred← citeshttps://doi.org/10.1007/s13391-013-3148-5openalex-snapshot
Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles
inferred← citeshttps://doi.org/10.1007/s13391-014-4357-2openalex-snapshot
Electrical conductivity of porous silver made from sintered nanoparticles
inferred← citeshttps://doi.org/10.1007/s40194-016-0381-1openalex-snapshot
Low temperature joining of copper by Ag nanopaste: correlation of mechanical properties and process parameters
inferred← citeshttps://doi.org/10.1007/s40194-018-0630-6openalex-snapshot
Joining of copper at low temperatures using silver(I) carboxylates
inferred← citeshttps://doi.org/10.1007/s40194-024-01699-4openalex-snapshot
Composition design for modified nickel nanopastes containing a low-melting element as additive for pressureless nanojoining
inferred← citeshttps://doi.org/10.1007/s40195-020-01083-3openalex-snapshot
High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications
inferred← citeshttps://doi.org/10.1007/s40799-023-00664-yopenalex-snapshot
Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism
inferred← citeshttps://doi.org/10.1016/j.actamat.2015.06.040openalex-snapshot
Deformation behavior of sintered nanocrystalline silver layers
inferred← citeshttps://doi.org/10.1016/j.actamat.2017.02.065openalex-snapshot
Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
inferred← citeshttps://doi.org/10.1016/j.actamat.2017.04.021openalex-snapshot
Deformation behavior of nanoporous polycrystalline silver. Part I: Microstructure and mechanical properties
inferred← citeshttps://doi.org/10.1016/j.apsusc.2019.04.228openalex-snapshot
Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size
inferred← citeshttps://doi.org/10.1016/j.apsusc.2019.06.105openalex-snapshot
An explanation of sintered silver bonding formation on bare copper substrate in air
inferred← citeshttps://doi.org/10.1016/j.apsusc.2019.07.229openalex-snapshot
Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages
inferred← citeshttps://doi.org/10.1016/j.apsusc.2020.146060openalex-snapshot
Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications
inferred← citeshttps://doi.org/10.1016/j.ceramint.2014.09.128openalex-snapshot
Development of composite silver/nickel nanopastes for low temperature joining of yttria-stabilized zirconia to stainless steels
inferred← citeshttps://doi.org/10.1016/j.ceramint.2018.10.046openalex-snapshot
Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules
inferred← citeshttps://doi.org/10.1016/j.ces.2019.115210openalex-snapshot
Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with d-glucose and PVP
inferred← citeshttps://doi.org/10.1016/j.engfracmech.2019.106741openalex-snapshot
Damage and viscoplastic behavior of sintered nano-silver joints under shear loading
inferred← citeshttps://doi.org/10.1016/j.engfracmech.2024.110753openalex-snapshot
Phase field fracture modeling of mechanical degradation and crack propagation in random porous sintered nano-silver with thermal and strain-rate effects
inferred← citeshttps://doi.org/10.1016/j.est.2026.122816openalex-snapshot
Physics-informed neural network for strength prediction of pressure-free sintered Ag on bare Cu substrates towards reliable power packaging in energy storage systems
inferred← citeshttps://doi.org/10.1016/j.ica.2018.04.022openalex-snapshot
The synthesis, chemical and physical properties of silver(I) carboxylates and their use for joining of copper
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2018.06.083openalex-snapshot
Silver nanopaste: Synthesis, reinforcements and application
inferred← citeshttps://doi.org/10.1016/j.jallcom.2013.05.044openalex-snapshot
Morphology controllable synthesis of silver nanoparticles: Optical properties study and SERS application
inferred← citeshttps://doi.org/10.1016/j.jallcom.2013.08.042openalex-snapshot
X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase
inferred← citeshttps://doi.org/10.1016/j.jallcom.2013.10.204openalex-snapshot
Transient liquid phase Ag-based solder technology for high-temperature packaging applications
inferred← citeshttps://doi.org/10.1016/j.jallcom.2014.08.062openalex-snapshot
Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
inferred← citeshttps://doi.org/10.1016/j.jallcom.2014.12.224openalex-snapshot
Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles
inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.04.215openalex-snapshot
Influence of the contact interface on the electrical characteristics of a ZnO microwire with silver paste electrodes
inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.06.132openalex-snapshot
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.08.060openalex-snapshot
Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering
inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.08.274openalex-snapshot
Behavior of thin copper oxide on silver as an analogue for copper nanoparticles
inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.11.064openalex-snapshot
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
inferred← citeshttps://doi.org/10.1016/j.jallcom.2016.11.225openalex-snapshot
In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste
inferred← citeshttps://doi.org/10.1016/j.jallcom.2017.06.016openalex-snapshot
Low temperature brazing nickel with Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes
inferred← citeshttps://doi.org/10.1016/j.jallcom.2017.09.279openalex-snapshot
Effect of electroplated Au layer on bonding performance of Ag pastes
inferred← citeshttps://doi.org/10.1016/j.jallcom.2018.05.254openalex-snapshot
Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium
inferred← citeshttps://doi.org/10.1016/j.jallcom.2018.09.254openalex-snapshot
New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction
inferred← citeshttps://doi.org/10.1016/j.jallcom.2018.10.067openalex-snapshot
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
inferred← citeshttps://doi.org/10.1016/j.jallcom.2019.02.249openalex-snapshot
Brass bonding using copper nanoparticles and zinc powder for packaging of power electronic devices
inferred← citeshttps://doi.org/10.1016/j.jallcom.2019.04.270openalex-snapshot
The pressureless sintering of micron silver paste for electrical connections
inferred← citeshttps://doi.org/10.1016/j.jallcom.2020.154397openalex-snapshot
Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
inferred← citeshttps://doi.org/10.1016/j.jallcom.2020.155173openalex-snapshot
Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro
inferred← citeshttps://doi.org/10.1016/j.jallcom.2020.156442openalex-snapshot
Microstructural evolution and degradation mechanism of SiC–Cu chip attachment using sintered nano-Ag paste during high-temperature ageing
inferred← citeshttps://doi.org/10.1016/j.jallcom.2021.158611openalex-snapshot
Size effect on the fracture of sintered porous nano-silver joints: Experiments and Weibull analysis
inferred← citeshttps://doi.org/10.1016/j.jallcom.2021.158783openalex-snapshot
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
inferred← citeshttps://doi.org/10.1016/j.jallcom.2021.159707openalex-snapshot
Effect of SrO content on microstructure of Bi2O3-B2O3-ZnO-BaO-SrO low-melting glass frit and joining performance of sodalime glass substrates
inferred← citeshttps://doi.org/10.1016/j.jallcom.2025.179696openalex-snapshot
Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature
inferred← citeshttps://doi.org/10.1016/j.jmatprotec.2015.03.037openalex-snapshot
Quantitative characterization of porosity and determination of elastic modulus for sintered micro-silver joints
inferred← citeshttps://doi.org/10.1016/j.jmgm.2024.108793openalex-snapshot
Investigating the effect of welding tool length on mechanical strength of welded metallic matrix by molecular dynamics simulation
inferred← citeshttps://doi.org/10.1016/j.jmrt.2023.05.104openalex-snapshot
Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
inferred← citeshttps://doi.org/10.1016/j.jmrt.2023.10.184openalex-snapshot
Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications
inferred← citeshttps://doi.org/10.1016/j.jmrt.2023.12.167openalex-snapshot
A novel coupling method for ultrasonic transducer based on pressureless sintering of nano-Ag
inferred← citeshttps://doi.org/10.1016/j.jmrt.2024.11.241openalex-snapshot
Atomic insights into the sintering behaviour of Ag–Cu solid solution nanoparticles on Ag substrate
inferred← citeshttps://doi.org/10.1016/j.jmrt.2025.08.079openalex-snapshot
Sintered metal alloy and composite as bonding materials for electronics applications
inferred← citeshttps://doi.org/10.1016/j.jmst.2017.06.008openalex-snapshot
Flexible carbon nanotube-enriched silver electrode films with high electrical conductivity and reliability prepared by facile screen printing
inferred← citeshttps://doi.org/10.1016/j.joule.2024.101818openalex-snapshot
A universal approach to high-performance thermoelectric module design for power generation
inferred← citeshttps://doi.org/10.1016/j.jsamd.2023.100606openalex-snapshot
Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
inferred← citeshttps://doi.org/10.1016/j.matchar.2014.10.027openalex-snapshot
Low-current resistance spot welding of pure copper using silver oxide paste
inferred← citeshttps://doi.org/10.1016/j.matchar.2018.12.012openalex-snapshot
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling
inferred← citeshttps://doi.org/10.1016/j.matchar.2024.113762openalex-snapshot
A novel Cu@Ag nano paste with low porosity for rapidly sintering in air condition
inferred← citeshttps://doi.org/10.1016/j.matchar.2026.116298openalex-snapshot
Strengthening mechanisms of Cu@Sn composite joints formed via transient liquid phase sintering
inferred← citeshttps://doi.org/10.1016/j.matchar.2026.116737openalex-snapshot
Mechanism of void evolution and strength variation in Cu3Sn soldering joints during high-temperature aging
inferred← citeshttps://doi.org/10.1016/j.matdes.2016.06.099openalex-snapshot
Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures
inferred← citeshttps://doi.org/10.1016/j.matdes.2017.11.054openalex-snapshot
A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
inferred← citeshttps://doi.org/10.1016/j.matdes.2018.11.062openalex-snapshot
Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size
inferred← citeshttps://doi.org/10.1016/j.matdes.2020.109079openalex-snapshot
Characterization and reconstruction for stochastically distributed void morphology in nano‑silver sintered joints
inferred← citeshttps://doi.org/10.1016/j.mee.2018.01.011openalex-snapshot
High-resolution patterning of silver nanopaste containing volatile solvents achieved with gas-permeable mold
inferred← citeshttps://doi.org/10.1016/j.mee.2018.06.009openalex-snapshot
Effect of surface finish metallization on mechanical strength of Ag sintered joint
inferred← citeshttps://doi.org/10.1016/j.microrel.2012.10.007openalex-snapshot
Reliability of sintered Ag80–Al20 die attach nanopaste for high temperature applications on SiC power devices
inferred← citeshttps://doi.org/10.1016/j.microrel.2013.07.042openalex-snapshot
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices
inferred← citeshttps://doi.org/10.1016/j.microrel.2015.04.005openalex-snapshot
Thermal simulation of joints with high thermal conductivities for power electronic devices
inferred← citeshttps://doi.org/10.1016/j.microrel.2015.07.039openalex-snapshot
Thermal cycle reliability of Cu-nanoparticle joint
inferred← citeshttps://doi.org/10.1016/j.microrel.2015.10.017openalex-snapshot
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
inferred← citeshttps://doi.org/10.1016/j.microrel.2016.06.007openalex-snapshot
Microstructural evolution of sintered silver at elevated temperatures
inferred← citeshttps://doi.org/10.1016/j.microrel.2016.06.011openalex-snapshot
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography
inferred← citeshttps://doi.org/10.1016/j.microrel.2016.07.031openalex-snapshot
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion
inferred← citeshttps://doi.org/10.1016/j.microrel.2017.01.010openalex-snapshot
Review of silver nanoparticle based die attach materials for high power/temperature applications
inferred← citeshttps://doi.org/10.1016/j.microrel.2017.06.015openalex-snapshot
Young's modulus of a sintered Cu joint and its influence on thermal stress
inferred← citeshttps://doi.org/10.1016/j.microrel.2017.06.083openalex-snapshot
Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging
inferred← citeshttps://doi.org/10.1016/j.microrel.2017.07.096openalex-snapshot
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
inferred← citeshttps://doi.org/10.1016/j.microrel.2017.12.001openalex-snapshot
Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test
inferred← citeshttps://doi.org/10.1016/j.microrel.2018.06.010openalex-snapshot
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications
inferred← citeshttps://doi.org/10.1016/j.microrel.2018.07.048openalex-snapshot
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver
inferred← citeshttps://doi.org/10.1016/j.microrel.2019.06.032openalex-snapshot
Effect of polyol synthesis on sintering of microsized Ag particles
inferred← citeshttps://doi.org/10.1016/j.microrel.2020.113727openalex-snapshot
Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics
inferred← citeshttps://doi.org/10.1016/j.microrel.2020.113740openalex-snapshot
Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process
inferred← citeshttps://doi.org/10.1016/j.microrel.2021.114241openalex-snapshot
Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
inferred← citeshttps://doi.org/10.1016/j.microrel.2021.114290openalex-snapshot
Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation
inferred← citeshttps://doi.org/10.1016/j.microrel.2022.114681openalex-snapshot
Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer
inferred← citeshttps://doi.org/10.1016/j.microrel.2024.115322openalex-snapshot
Mechanical property changes in sintered silver films by including copper oxide nanoparticles
inferred← citeshttps://doi.org/10.1016/j.microrel.2024.115528openalex-snapshot
The variation in Anand model parameters – How does that affect the bond's response? A comparative study considering sintered Ag bonds
inferred← citeshttps://doi.org/10.1016/j.microrel.2026.116009openalex-snapshot
Local stress distribution in sintered nanoporous silver films under mechanical and thermal loading
inferred← citeshttps://doi.org/10.1016/j.msea.2014.07.002openalex-snapshot
Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid
inferred← citeshttps://doi.org/10.1016/j.msea.2016.05.108openalex-snapshot
Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution
inferred← citeshttps://doi.org/10.1016/j.msea.2016.10.092openalex-snapshot
Microstructure characterization and mechanical behavior for Ag3Sn joint produced by foil-based TLP bonding in air atmosphere
inferred← citeshttps://doi.org/10.1016/j.msea.2024.146843openalex-snapshot
Driving force for enhancing the cold silver sinter joining using time domain-dependent Ag–Au epitaxy and interfacial stress
inferred← citeshttps://doi.org/10.1016/j.mssp.2022.106802openalex-snapshot
Bonding strength enhancement of low temperature sintered SiC power module by femtosecond laser induced micro/nanostructures
inferred← citeshttps://doi.org/10.1016/j.mssp.2024.108878openalex-snapshot
Effect of thermal aging on joint with eutectic SnIn solder by TLP bonding
inferred← citeshttps://doi.org/10.1016/j.mssp.2024.109081openalex-snapshot
Sintering and optimization of copper nanopaste-connected copper array conical microstructures
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2022.104623openalex-snapshot
Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite
inferred← citeshttps://doi.org/10.1016/j.mtcomm.2023.106956openalex-snapshot
Creep behavior of sintered nano-silver at high temperature: Experimental and theoretical analysis
inferred← citeshttps://doi.org/10.1016/j.nexres.2025.100278openalex-snapshot
Prototype of fixtures for pressure sintering using a commercial hot press and die shear test using a small-scale tensile extrusion testing machine
inferred← citeshttps://doi.org/10.1016/j.pedc.2022.100014openalex-snapshot
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C
inferred← citeshttps://doi.org/10.1016/j.powtec.2022.117254openalex-snapshot
Approaching the structure-property relationship of sintered metal nano/microparticles from the perspective of the agglomerate size effect
inferred← citeshttps://doi.org/10.1016/j.scriptamat.2014.08.010openalex-snapshot
Silver nanoporous sheet for solid-state die attach in power device packaging
inferred← citeshttps://doi.org/10.1016/j.scriptamat.2017.11.035openalex-snapshot
Bonding technology based on solid porous Ag for large area chips
inferred← citeshttps://doi.org/10.1016/j.scriptamat.2019.12.040openalex-snapshot
3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste
inferred← citeshttps://doi.org/10.1016/j.scriptamat.2021.113747openalex-snapshot
Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions
inferred← citeshttps://doi.org/10.1016/j.surfin.2024.105329openalex-snapshot
Sputtering of (111) highly-oriented nanotwinned Ag on polycrystalline Si3N4 substrates for high-power electronic packaging
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