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The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature
Copper film prepared from copper fine particle paste by laser sintering at room temperature: Influences of sintering atmosphere on the morphology and resistivity
Maskless Fabrication of Highly Robust, Flexible Transparent Cu Conductor by Random Crack Network Assisted Cu Nanoparticle Patterning and Laser Sintering
Strategy for achieving high sintering and mechanical response performance of nano-Cu/two-dimensional material composite via nanoscale surface-defect-induced longitudinal diffusion
Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability
Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu 2+ -alkanolamine metallacycle compounds for electrically conductive layer formation
Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
2. Formation and Production of Powder and Particles 2.2 Particle Synthesis in Liquid Phase 2.2.4 Solution Synthesis of Metal Nanoparticles Using Chemical Reduction Method
(Bi)metallic nanoparticles in glycerol : synthesis, characterization and catalytic aplications
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