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A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique

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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

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inferred← citeshttps://doi.org/10.1039/c7ra12738copenalex-snapshot

Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates

inferred← citeshttps://doi.org/10.1039/c8tc01849aopenalex-snapshot

A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics

inferred← citeshttps://doi.org/10.1039/d1sc06322gopenalex-snapshot

Banana split: biomass splitting with flash light irradiation

inferred← citeshttps://doi.org/10.1039/d3se01319gopenalex-snapshot

Hydrogen production by waste tire recycling by photo-pyrolysis

inferred← citeshttps://doi.org/10.1039/d4tc02694bopenalex-snapshot

Formation mechanism of micro-sized Cu plates using Br ions as basal plane-specific adsorbent and their application in the preparation of highly conductive and flexible Cu films

inferred← citeshttps://doi.org/10.1039/d5ce00785bopenalex-snapshot

Solution-processed Cu@Au nanowires for transparent conductive films and electromagnetic shielding

inferred← citeshttps://doi.org/10.1039/d5nh00175gopenalex-snapshot

Tattoo electrodes in bioelectronics: a pathway to next-generation wearable systems

inferred← citeshttps://doi.org/10.1049/iet-cim.2018.0015openalex-snapshot

Effect of processing parameters on laser sintering of silver MOD inks for inkjet printing

inferred← citeshttps://doi.org/10.1063/1.4941182openalex-snapshot

Effect of synthesis temperature on the morphology and electrical properties of solution-grown copper nanowires (CuNWs)

inferred← citeshttps://doi.org/10.1080/10426914.2025.2559616openalex-snapshot

Advances and challenges in conductive ink 3D printing for sustainable PCB fabrication: a comprehensive review aligned toward industry 5.0

inferred← citeshttps://doi.org/10.1088/1361-6528/28/3/035203openalex-snapshot

Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate

inferred← citeshttps://doi.org/10.1088/1361-6528/aa6cdaopenalex-snapshot

Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes

inferred← citeshttps://doi.org/10.1088/1361-6528/acbd1fopenalex-snapshot

Highly conductive copper films prepared by multilayer sintering of nanoparticles synthesized via arc discharge

inferred← citeshttps://doi.org/10.1088/1361-6528/ad660eopenalex-snapshot

Wavelength-influenced electrical performance of laser-written flexible copper-based structures

inferred← citeshttps://doi.org/10.1088/2053-1591/3/8/085014openalex-snapshot

Construction of a 3D porous network of copper film via a template-free deposition method with superior mechanical and electrical properties for micro-energy devices

inferred← citeshttps://doi.org/10.1109/pvsc43889.2021.9519105openalex-snapshot

Copper Electrode on Flexible Substrate by Intense Pulsed Light Sintering of Microsized Copper Particles

inferred← citeshttps://doi.org/10.1109/tcpmt.2020.2985649openalex-snapshot

Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test

inferred← citeshttps://doi.org/10.1109/tcpmt.2020.3047055openalex-snapshot

UV Flash Sintering of Aerosol Jet Printed Silver Conductors for Microwave Circuit Applications

inferred← citeshttps://doi.org/10.1115/msec2016-8693openalex-snapshot

The Coupling Between Densification and Optical Heating in Intense Pulsed Light Sintering of Silver Nanoparticles

inferred← citeshttps://doi.org/10.1117/12.3043767openalex-snapshot

Modeling the selective laser sintering of printed silver nanoparticle ink on a flexible substrate

inferred← citeshttps://doi.org/10.1134/s1061933x25600435openalex-snapshot

Metal-Based Inks for Printed Electronics. Comparison of the Main Approaches to Production

inferred← citeshttps://doi.org/10.1134/s1070363222030100openalex-snapshot

Synthesis of One-Dimensional Nanostructures by Reduction of Nickel Alkyl Carboxylates with Different Hydrocarbon Chain Lengths

inferred← citeshttps://doi.org/10.1177/0021998316656394openalex-snapshot

Reinforcement of Cu nanoink sintered film with extended carbon nanofibers for large deformation of printed electronics

inferred← citeshttps://doi.org/10.1186/s11671-019-3011-1openalex-snapshot

Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics

inferred← citeshttps://doi.org/10.1246/bcsj.20210011openalex-snapshot

Room-Temperature Coalescence of Tri-n-Octylphosphine-Oxide-Capped Cu-Ag Core-Shell Nanoparticles: Effect of Sintering Agent and/or Reducing Agent

inferred← citeshttps://doi.org/10.2320/matertrans.mt-n2021004openalex-snapshot

Copper Materials for Low Temperature Sintering

inferred← citeshttps://doi.org/10.3390/app8112101openalex-snapshot

Electrical and Mechanical Properties of Ink Printed Composite Electrodes on Plastic Substrates

inferred← citeshttps://doi.org/10.3390/jmmp5030089openalex-snapshot

A Review on Printed Electronics: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts

inferred← citeshttps://doi.org/10.3390/ma13163587openalex-snapshot

Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics

inferred← citeshttps://doi.org/10.3390/mi13122209openalex-snapshot

Flexible Heater Fabrication Using Amino Acid-Based Ink and Laser-Direct Writing

inferred← citeshttps://doi.org/10.3390/nano10091689openalex-snapshot

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

inferred← citeshttps://doi.org/10.3390/nano12111908openalex-snapshot

Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink

inferred← citeshttps://doi.org/10.3390/nano8080617openalex-snapshot

Suitability of Copper Nitride as a Wiring Ink Sintered by Low-Energy Intense Pulsed Light Irradiation

inferred← citeshttps://doi.org/10.4071/2016-nor-sipilaopenalex-snapshot

Reliability of Passive UHF RFID Copper Tags on Plywood Substrate in High Humidity Conditions

inferred← citeshttps://doi.org/10.4236/msa.2019.104026openalex-snapshot

Formation of Copper Nickel Bimetallic Nanoalloy Film Using Precursor Inks

inferred← citeshttps://doi.org/10.46670/jsst.2022.31.4.187openalex-snapshot

Nanocatalyst Decorated Metal Oxides on Highly Selective Chemical Sensors

inferred← citeshttps://doi.org/10.7567/1347-4065/aaf05aopenalex-snapshot

Three-dimensional interconnect layers inkjet printed on plastic substrates using continuous-wave xenon light sintering

Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.