On the public citation graph

Thermal interface materials for power electronics applications

https://doi.org/10.1109/itherm.2008.4544297
0 signed · 188 inferred · view as graph

Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.

Is this your work? Sign in with ORCID and put your name on the claims that are yours.
Claim with ORCID
Reference health. See whether every reference in this work resolves to a known work and none has been retracted — and get a dated CiteStamped badge you can embed.
See reference health

What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/978-1-4612-3978-9openalex-snapshot
Thermal Contact Conductance
inferredcites →https://doi.org/10.1007/978-3-319-01276-6openalex-snapshot
Thermal Contact Conductance
inferredcites →https://doi.org/10.1063/1.2510998openalex-snapshot
Photoacoustic characterization of carbon nanotube array thermal interfaces
inferredcites →https://doi.org/10.1109/jproc.2006.879796openalex-snapshot
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
inferredcites →https://doi.org/10.1109/stherm.1999.762433openalex-snapshot
Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method
inferredcites →https://doi.org/10.1109/vppc.2007.4544110openalex-snapshot
A Comparison of Hybrid Electric Vehicle Power Electronics Cooling Options
inferredcites →https://doi.org/10.2172/890029openalex-snapshot
Evaluation of 2004 Toyota Prius Hybrid Electric Drive System
inferredcites →https://doi.org/10.2172/947571openalex-snapshot
Evaluation of 2004 Toyota Prius Hybrid Electric Drive System

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4002335openalex-extracted
Machine Learning Enhanced Performance Optimization of a Photovoltaic-Thermoelectric System
inferred← citeshttps://doi.org/10.2139/ssrn.4059089openalex-extracted
Additively Manufactured Flow Manifolds Enable High Performance Direct Cooling for High Density Power Electronics
inferred← citeshttps://doi.org/10.1002/adfm.202600063openalex-snapshot
A Phase‐Change‐Enabled Thermal Interface Material With the Competitive Thermal Resistance of 0.03°C·cm 2 ·W −1 for Electronic Devices Thermal Management in AI Era
inferred← citeshttps://doi.org/10.1002/smll.73824openalex-snapshot
A Generalized Automated Framework for Thermal Characterization: From Bulk Materials to Complex Heterostructures
inferred← citeshttps://doi.org/10.1007/978-3-319-45098-8_17openalex-snapshot
LED Die Bonding
inferred← citeshttps://doi.org/10.1007/978-981-15-3548-2_2openalex-snapshot
Solid-State RF Power Generators
inferred← citeshttps://doi.org/10.1007/978-981-16-8926-0_18openalex-snapshot
Calculation of Thermal Processes in the Contact Zones of Elements in Various Technological Processes
inferred← citeshttps://doi.org/10.1007/978-981-32-9441-7_51openalex-snapshot
Experimental Study on a Novel Indium-Based Alloy Thermal Interface Material with Low Contact Thermal Resistance
inferred← citeshttps://doi.org/10.1007/s00231-017-2045-0openalex-snapshot
Smoothing effect of the thermal interface material on the temperature distribution in a stepwise varying width microchannel cooling device
inferred← citeshttps://doi.org/10.1007/s11664-012-2066-xopenalex-snapshot
A Novel Application of Thermoelectric Modules in an HVAC System Under Cold Climate Operation
inferred← citeshttps://doi.org/10.1007/s11664-020-08015-yopenalex-snapshot
Influence of Temperature and Aging on the Thermal Contact Resistance in Thermoelectric Devices
inferred← citeshttps://doi.org/10.1007/s40195-017-0592-5openalex-snapshot
Performance of Chemical Vapor Deposited Boron-Doped AlN Thin Film as Thermal Interface Materials for 3-W LED: Thermal and Optical Analysis
inferred← citeshttps://doi.org/10.1007/s40964-026-01528-8openalex-snapshot
Wafer-scale PBF-LB/M additive manufacturing of SnAg3 as thermal interface materials for advanced high-power electronics cooling
inferred← citeshttps://doi.org/10.1007/s41605-019-0133-zopenalex-snapshot
Indirect cooling experiment for magnetic alloy-loaded cavity
inferred← citeshttps://doi.org/10.1007/s41939-019-00064-zopenalex-snapshot
Fundamental and innovative approaches for filler design of thermal interface materials based on epoxy resin for high power density electronics application: a retrospective
inferred← citeshttps://doi.org/10.1016/j.applthermaleng.2018.04.132openalex-snapshot
A review on thermal management methods for robots
inferred← citeshttps://doi.org/10.1016/j.applthermaleng.2019.114535openalex-snapshot
Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems
inferred← citeshttps://doi.org/10.1016/j.applthermaleng.2022.119503openalex-snapshot
Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
inferred← citeshttps://doi.org/10.1016/j.applthermaleng.2026.130942openalex-snapshot
Spatial variation of thermal properties in thermal interface materials using a frequency domain thermoreflectance method
inferred← citeshttps://doi.org/10.1016/j.carbon.2016.05.017openalex-snapshot
Highly deformable thermal interface materials enabled by covalently-bonded carbon nanotubes
inferred← citeshttps://doi.org/10.1016/j.coco.2020.100621openalex-snapshot
Rational design of high-performance thermal interface materials based on gold-nanocap-modified vertically aligned graphene architecture
inferred← citeshttps://doi.org/10.1016/j.compositesa.2022.107216openalex-snapshot
Liquid metal (LM) and its composites in thermal management
inferred← citeshttps://doi.org/10.1016/j.egyr.2023.05.195openalex-snapshot
A thermal network model considering thermal coupling effect and TIM degradation in IGBT modules
inferred← citeshttps://doi.org/10.1016/j.enbuild.2017.03.012openalex-snapshot
Interface resistance in thermal insulation materials with rough surfaces
inferred← citeshttps://doi.org/10.1016/j.energy.2025.136068openalex-snapshot
Analysis of air-bridge thermophotovoltaic devices and systems
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2014.08.054openalex-snapshot
Resonance-induced condensate shedding for high-efficiency heat transfer
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2015.10.016openalex-snapshot
General multilayer heat transfer model for optical-based thermal characterization techniques
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2018.07.081openalex-snapshot
High-throughput transient thermal interface testing method using time-domain thermal response
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2018.09.051openalex-snapshot
Experimental characterization and modeling of thermal resistance of electric machine lamination stacks
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099openalex-snapshot
Steady-state measurements of thermal transport across highly conductive interfaces
inferred← citeshttps://doi.org/10.1016/j.ijheatmasstransfer.2019.118918openalex-snapshot
Water immersion cooling of high power density electronics
inferred← citeshttps://doi.org/10.1016/j.ijrefrig.2015.06.028openalex-snapshot
Influence of thermal conductivity on the dynamic response of magnetocaloric materials
inferred← citeshttps://doi.org/10.1016/j.jestch.2023.101363openalex-snapshot
RETRACTED: A prediction model for the performance of solar photovoltaic-thermoelectric systems utilizing various semiconductors via optimal surrogate machine learning methods
inferred← citeshttps://doi.org/10.1016/j.microrel.2011.05.001openalex-snapshot
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges
inferred← citeshttps://doi.org/10.1016/j.microrel.2011.07.066openalex-snapshot
Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications
inferred← citeshttps://doi.org/10.1016/j.microrel.2013.05.011openalex-snapshot
Degradation of thermal interface materials for high-temperature power electronics applications
inferred← citeshttps://doi.org/10.1016/j.microrel.2020.113816openalex-snapshot
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
inferred← citeshttps://doi.org/10.1016/j.polymertesting.2025.108780openalex-snapshot
Investigation of thermal transport across volume-controlled thermal interface materials
inferred← citeshttps://doi.org/10.1016/j.progpolymsci.2016.03.001openalex-snapshot
Thermal conductivity of polymer-based composites: Fundamentals and applications
inferred← citeshttps://doi.org/10.1016/j.rinp.2019.102608openalex-snapshot
Directional dependence of electrical and thermal properties in graphene-nanoplatelet-based composite materials
inferred← citeshttps://doi.org/10.1016/j.rser.2017.04.096openalex-snapshot
Changes and challenges of photovoltaic inverter with silicon carbide device
inferred← citeshttps://doi.org/10.1016/j.tsep.2026.104738openalex-snapshot
Thermal interface materials for high-power LED packaging: advances, reliability and design guidelines
inferred← citeshttps://doi.org/10.1021/acs.energyfuels.0c03943openalex-snapshot
Modeling of Thermal Integration of a Catalytic Microcombustor with a Thermoelectric for Power Generation Applications
inferred← citeshttps://doi.org/10.1021/acs.nanolett.8b00692openalex-snapshot
Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder
inferred← citeshttps://doi.org/10.1021/acsaelm.4c00691openalex-snapshot
Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance
inferred← citeshttps://doi.org/10.1021/acsanm.2c03903openalex-snapshot
Ag Nanoparticle-Based Aerogel-like Films for Interfacial Thermal Management
inferred← citeshttps://doi.org/10.1038/s41598-023-31567-yopenalex-snapshot
A time fractional model of a Maxwell nanofluid through a channel flow with applications in grease
inferred← citeshttps://doi.org/10.1038/srep01710openalex-snapshot
Anisotropic Thermal and Electrical Properties of Thin Thermal Interface Layers of Graphite Nanoplatelet-Based Composites
inferred← citeshttps://doi.org/10.1039/c6ra00057fopenalex-snapshot
Copper–graphite–copper sandwich: superior heat spreader with excellent heat-dissipation ability and good weldability
inferred← citeshttps://doi.org/10.1063/1.5001835openalex-snapshot
High resolution steady-state measurements of thermal contact resistance across thermal interface material junctions
inferred← citeshttps://doi.org/10.1063/5.0304273openalex-snapshot
Thermal impedance in pulsed energy storage systems with phase change materials
inferred← citeshttps://doi.org/10.1063/5.0317543openalex-snapshot
A comparative study of experimental findings with and without TIMs for efficient cooling in electronics devices
inferred← citeshttps://doi.org/10.1080/01457632.2018.1426265openalex-snapshot
Brief Historical Perspective in Thermal Management and the Shift Toward Management at the Nanoscale
inferred← citeshttps://doi.org/10.1080/01457632.2019.1707404openalex-snapshot
Comparison of Experimental and Computational Heat Transfer Characterization of Water Jet Impingement Array with Interspersed Fluid Extraction
inferred← citeshttps://doi.org/10.1080/08916152.2024.2352105openalex-snapshot
Comparative analysis of thermal interface materials for effective thermal management of electronic devices
inferred← citeshttps://doi.org/10.1080/09506608.2017.1301014openalex-snapshot
Novel nanostructured thermal interface materials: a review
inferred← citeshttps://doi.org/10.1088/0957-0233/23/6/065601openalex-snapshot
Applying different heat flux intensities to simultaneously estimate the thermal properties of metallic materials
inferred← citeshttps://doi.org/10.1108/mi-06-2022-0108openalex-snapshot
Influence of Ag particle shape on mechanical and thermal properties of TIM joints
inferred← citeshttps://doi.org/10.1109/access.2026.3660730openalex-snapshot
Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling
inferred← citeshttps://doi.org/10.1109/apec.2018.8341414openalex-snapshot
Modular heat sink for chip-scale GaN transistors in multilevel converters
inferred← citeshttps://doi.org/10.1109/apec42165.2021.9487427openalex-snapshot
Packaging A Top-cooled 650 V/150 A GaN Power Modules with Insulated Thermal Pads and Gate-Drive Circuit
inferred← citeshttps://doi.org/10.1109/codit70676.2026.11630975openalex-snapshot
A Comparative Analysis of Cooling Techniques for IGBT power modules in electric vehicles
inferred← citeshttps://doi.org/10.1109/cpmtsympj.2010.5680285openalex-snapshot
Study on the application of thermal interface materials for integration of HP-LEDs
inferred← citeshttps://doi.org/10.1109/ecce-europe62795.2025.11238575openalex-snapshot
Optimising Power Semiconductor Thermal Simulation via Finite Element Modeling
inferred← citeshttps://doi.org/10.1109/ecce.2017.8096646openalex-snapshot
Bonding of large substrates by silver sintering and characterization of the interface thermal resistance
inferred← citeshttps://doi.org/10.1109/ecce.2017.8096699openalex-snapshot
Design of a novel, high-density, high-speed 10 kV SiC MOSFET module
inferred← citeshttps://doi.org/10.1109/ecce50734.2022.9948096openalex-snapshot
Design and Testing of an Automotive Compliant 800V 550 kVA SiC Traction Inverter with Full-Ceramic DC-Link and EMI Filter
inferred← citeshttps://doi.org/10.1109/ectc.2018.00091openalex-snapshot
High Performance Metal-Based Nanocomposite Thermal Interface Materials Toward Enhanced Cooling Efficiency in Electronic Applications
inferred← citeshttps://doi.org/10.1109/ectc51687.2025.00128openalex-snapshot
Thermal-Mechanical Modeling of Package Reflow for Cooling of Future CPU and GPU Devices
inferred← citeshttps://doi.org/10.1109/edaps.2013.6724415openalex-snapshot
Thermal analysis of three-dimensional ICs, investigating the effect of through-silicon vias and fabrication parameters
inferred← citeshttps://doi.org/10.1109/eurosime.2015.7103080openalex-snapshot
Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE
inferred← citeshttps://doi.org/10.1109/icecet63943.2025.11472224openalex-snapshot
Optimize Power Module Sintering Methodology for High Thermal Conductivity and Reliability
inferred← citeshttps://doi.org/10.1109/icept-hdp.2012.6474646openalex-snapshot
Silver-based thermal interface materials with low thermal resistance
inferred← citeshttps://doi.org/10.1109/icept.2017.8046680openalex-snapshot
Study on temperature distribution of IGBT module
inferred← citeshttps://doi.org/10.1109/icept.2018.8480614openalex-snapshot
Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
inferred← citeshttps://doi.org/10.1109/icept56209.2022.9873378openalex-snapshot
Investigation on Reliability of Power Devices by Finite Element Analysis
inferred← citeshttps://doi.org/10.1109/icma.2014.6885913openalex-snapshot
Computer control for IGBT based heat load system with rapid response and large heat flux
inferred← citeshttps://doi.org/10.1109/iecon55916.2024.10905802openalex-snapshot
Experimental Estimation of Parasitic Capacitance of Thermal Interface Material Using Double Pulse Test Circuit under Realistic Operating Conditions
inferred← citeshttps://doi.org/10.1109/impact67645.2025.11281699openalex-snapshot
The interfacial properties of Indium thermal interface materials
inferred← citeshttps://doi.org/10.1109/itherm.2014.6892310openalex-snapshot
Thermal performance and reliability characterization of bonded interface materials (BIMs)
inferred← citeshttps://doi.org/10.1109/itherm.2014.6892398openalex-snapshot
Novel power electronics three-dimensional heat exchanger
inferred← citeshttps://doi.org/10.1109/itherm.2014.6892401openalex-snapshot
Thermal management of an IGBT module using two-phase cooling
inferred← citeshttps://doi.org/10.1109/itherm.2014.6892430openalex-snapshot
Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique
inferred← citeshttps://doi.org/10.1109/itherm.2017.7992476openalex-snapshot
Design considerations for a miniaturized TIM tester with extremely high measurement resolution
inferred← citeshttps://doi.org/10.1109/itherm.2017.7992491openalex-snapshot
Experimental-theoretical thermal and electrical analyses of insulated gate bipolar transistors (IGBT) power module
inferred← citeshttps://doi.org/10.1109/itherm.2017.7992501openalex-snapshot
Degradation characterization of thermal interface greases
inferred← citeshttps://doi.org/10.1109/itherm.2017.7992502openalex-snapshot
Metallic nanocomposites as next-generation thermal interface materials
inferred← citeshttps://doi.org/10.1109/itherm.2017.7992514openalex-snapshot
Microgap cooling of via-enhanced glass interposers
inferred← citeshttps://doi.org/10.1109/itherm.2017.7992518openalex-snapshot
Vapor chamber with thermal diode and switch functions
inferred← citeshttps://doi.org/10.1109/itherm.2018.8419592openalex-snapshot
Design Architectures for Compliant High Temperature Thermal Interface Materials
inferred← citeshttps://doi.org/10.1109/itherm.2019.8757402openalex-snapshot
Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages
inferred← citeshttps://doi.org/10.1109/itherm54085.2022.9899581openalex-snapshot
Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface Materials
inferred← citeshttps://doi.org/10.1109/itherm55368.2023.10177644openalex-snapshot
Measuring the Surface Flatness of Heaters and Cold plates and Estimating its Effect on Heat Transfer
inferred← citeshttps://doi.org/10.1109/itherm55368.2023.10177659openalex-snapshot
Squeeze Flow and Thermal Resistance Characterization of Thermal Interface Materials
inferred← citeshttps://doi.org/10.1109/itherm55376.2025.11235778openalex-snapshot
Multiphysics Topology Optimization of Metal-Polymer Composite Thermal Interface Materials
inferred← citeshttps://doi.org/10.1109/iwipp.2015.7295991openalex-snapshot
Thermal interface material evaluation for IGBT modules under realistic power cycling conditions
inferred← citeshttps://doi.org/10.1109/jqe.2015.2412458openalex-snapshot
The Thermal Resistance of High-Power Semiconductor Disk Lasers
inferred← citeshttps://doi.org/10.1109/mwent47943.2020.9067484openalex-snapshot
The Method of Modeling Thermal Process for High Reliability On-Board Radio-Electronic Systems
inferred← citeshttps://doi.org/10.1109/nano.2016.7751383openalex-snapshot
Review of current progress of thermal interface materials for electronics thermal management applications
inferred← citeshttps://doi.org/10.1109/peds.2015.7203496openalex-snapshot
A systematic comparison of various thermal interface materials for applications with surface-mounted (DirectFETTM) MOSFETs
inferred← citeshttps://doi.org/10.1109/pimrc62392.2025.11275319openalex-snapshot
Embedded AI for WiFi Sensing of Surface Hotness
inferred← citeshttps://doi.org/10.1109/ppc.2009.5386368openalex-snapshot
Modeling transient thermal response of pulsed power electronic packages
inferred← citeshttps://doi.org/10.1109/rtucon48111.2019.8982267openalex-snapshot
Thermally conducting composites for power electronics
inferred← citeshttps://doi.org/10.1109/semi-therm.2013.6526828openalex-snapshot
Measurement of thermal conductivity of nanofluids and thermal interface materials using the laser-based transient thermoreflectance method
inferred← citeshttps://doi.org/10.1109/semi-therm.2014.6892218openalex-snapshot
Extracting TIM properties with localized transient pulses
inferred← citeshttps://doi.org/10.1109/semi-therm.2018.8357373openalex-snapshot
Investigation of pressure dependence of interface thermal resistance in thermal greases by transient thermoreflectance
inferred← citeshttps://doi.org/10.1109/stee63704.2026.11663992openalex-snapshot
Analysis of Thermal Stability of Power Electronic Modules in Cold Start Mode
inferred← citeshttps://doi.org/10.1109/stherm.2011.5767171openalex-snapshot
Study of thermal interfaces aging for power electronics applications
inferred← citeshttps://doi.org/10.1109/tcpmt.2012.2227056openalex-snapshot
Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices
inferred← citeshttps://doi.org/10.1109/tcpmt.2015.2499767openalex-snapshot
Reliability of Emerging Bonded Interface Materials for Large-Area Attachments
inferred← citeshttps://doi.org/10.1109/tcpmt.2016.2646385openalex-snapshot
Rheology of Thermal Interface Materials Composed of Silicone Gels
inferred← citeshttps://doi.org/10.1109/tcpmt.2017.2773100openalex-snapshot
Low-Pressure-Assisted Large-Area (>800 mm 2 ) Sintered-Silver Bonding for High-Power Electronic Packaging
inferred← citeshttps://doi.org/10.1109/tcpmt.2017.2786542openalex-snapshot
Design Considerations for Miniaturized Steady-State Thermal Characterization Instruments
inferred← citeshttps://doi.org/10.1109/tcpmt.2018.2863791openalex-snapshot
Covalent Anchoring of Carbon Nanotube-Based Thermal Interface Materials Using Epoxy-Silane Monolayers
inferred← citeshttps://doi.org/10.1109/tcpmt.2021.3082771openalex-snapshot
A Vertically Enhanced Manifold Microchannel System for Thermal Management of Power Electronics
inferred← citeshttps://doi.org/10.1109/tcpmt.2021.3105003openalex-snapshot
Thermal Design, Optimization, and Packaging of Planar Magnetic Components
inferred← citeshttps://doi.org/10.1109/tcpmt.2025.3558669openalex-snapshot
Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling
inferred← citeshttps://doi.org/10.1109/therminic.2014.6972521openalex-snapshot
A comparison study on thermal characterization of high power leds with different ceramic attach adhesives for automotive lighting applications
inferred← citeshttps://doi.org/10.1109/therminic.2016.7749041openalex-snapshot
Characterization of thermal interface materials for IGBT inverter applications
inferred← citeshttps://doi.org/10.1109/therminic60375.2023.10325884openalex-snapshot
Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste
inferred← citeshttps://doi.org/10.1109/tia.2018.2879957openalex-snapshot
Bonding of Large Substrates by Silver Sintering and Characterization of the Interface Thermal Resistance
inferred← citeshttps://doi.org/10.1109/tie.2020.2984997openalex-snapshot
Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement
inferred← citeshttps://doi.org/10.1109/tnano.2022.3186102openalex-snapshot
Heat Conduction Enhancement of a Thermal Interface Material for Heat Sink Applications Using Carbon Nanomaterials
inferred← citeshttps://doi.org/10.1109/tpel.2017.2720963openalex-snapshot
Direct Single Impinging Jet Cooling of a mosfet Power Electronic Module
inferred← citeshttps://doi.org/10.1109/tpel.2021.3059558openalex-snapshot
Jet Impingement Cooling in Power Electronics for Electrified Automotive Transportation: Current Status and Future Trends
inferred← citeshttps://doi.org/10.1109/tpel.2021.3129846openalex-snapshot
Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material
inferred← citeshttps://doi.org/10.1109/tte.2022.3147976openalex-snapshot
Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions
inferred← citeshttps://doi.org/10.1109/tte.2023.3274554openalex-snapshot
Effectiveness of Thermal Interface Materials on Electrical Machines Thermal Performance With Heat Pipes
inferred← citeshttps://doi.org/10.1109/vppc.2009.5289791openalex-snapshot
Rapid modeling of power electronics thermal management technologies
inferred← citeshttps://doi.org/10.1109/vppc60535.2023.10403330openalex-snapshot
Technical Assessment of Thermal Management Techniques for GaN Power Transistors: Heat Spreaders
inferred← citeshttps://doi.org/10.1115/1.4005201openalex-snapshot
Influence of Nanomaterials in Polymer Composites on Thermal Conductivity
inferred← citeshttps://doi.org/10.1115/1.4023215openalex-snapshot
Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
inferred← citeshttps://doi.org/10.1115/1.4025116openalex-snapshot
A Stepped-Bar Apparatus for Thermal Resistance Measurements
inferred← citeshttps://doi.org/10.1115/1.4026616openalex-snapshot
Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
inferred← citeshttps://doi.org/10.1115/1.4028243openalex-snapshot
Optimal Time-Varying Heat Transfer in Multilayered Packages With Arbitrary Heat Generations and Contact Resistance
inferred← citeshttps://doi.org/10.1115/1.4032172openalex-snapshot
Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy
inferred← citeshttps://doi.org/10.1115/1.4035178openalex-snapshot
Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
inferred← citeshttps://doi.org/10.1115/1.4035972openalex-snapshot
Anisotropic Thermal Response of Packed Copper Wire
inferred← citeshttps://doi.org/10.1115/1.4039459openalex-snapshot
Experimental Characterization and Modeling of Thermal Contact Resistance of Electric Machine Stator-to-Cooling Jacket Interface Under Interference Fit Loading
inferred← citeshttps://doi.org/10.1115/1.4040828openalex-snapshot
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
inferred← citeshttps://doi.org/10.1115/1.4041440openalex-snapshot
Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications
inferred← citeshttps://doi.org/10.1115/1.4046972openalex-snapshot
Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams
inferred← citeshttps://doi.org/10.1115/1.4049293openalex-snapshot
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
inferred← citeshttps://doi.org/10.1115/ipack2013-73143openalex-snapshot
Reliability of Bonded Interfaces for Automotive Power Electronics
inferred← citeshttps://doi.org/10.1115/ipack2015-48568openalex-snapshot
Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed
inferred← citeshttps://doi.org/10.1117/12.2269291openalex-snapshot
Effect analysis of material properties of picosecond laser ablation for ABS/PVC
inferred← citeshttps://doi.org/10.1149/2.0271906jssopenalex-snapshot
High Thermal Conductivity Silicone Elastomer Doped with Graphene Nanoplatelets and Eutectic GaIn Liquid Metal Alloy
inferred← citeshttps://doi.org/10.1149/2.0391712jssopenalex-snapshot
Peltier Supercooling with Isosceles Current Pulses: Cooling an Object with Internal Heat Generation
inferred← citeshttps://doi.org/10.1155/2023/1990593openalex-snapshot
Machine Learning Performance Prediction of a Solar Photovoltaic-Thermoelectric System with Various Crystalline Silicon Cell Types
inferred← citeshttps://doi.org/10.1155/2023/6927245openalex-snapshot
Smart Optimization of Semiconductors in Photovoltaic-Thermoelectric Systems Using Recurrent Neural Networks
inferred← citeshttps://doi.org/10.1177/09544062221115297openalex-snapshot
Advances in thermal contact resistance studies
inferred← citeshttps://doi.org/10.1299/transjsme.21-00023openalex-snapshot
Reduction of interface thermal resistance between TIM and metal surface by tuning wettability
inferred← citeshttps://doi.org/10.1557/proc-1158-f03-03openalex-snapshot
Comparison of Carbon-based Nanostructures with Commercial Products as Thermal Interface Materials
inferred← citeshttps://doi.org/10.1615/tfec2025.hpu.056368openalex-snapshot
Immersion Cooling in Data Centers: A Comprehensive Review of Benefits, Challenges, and Future Directions
inferred← citeshttps://doi.org/10.17073/1609-3577-2020-1-57-70openalex-snapshot
Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators
inferred← citeshttps://doi.org/10.17485/ijst/2016/v9i28/98452openalex-snapshot
Power Electronics Component Location and Heat Sink Length Optimization – Hybrid Electrical Vehicle (HEV)
inferred← citeshttps://doi.org/10.2139/ssrn.6153660openalex-snapshot
Laser-processed wickless vapor chambers harness phase change enabling forced-air cooling of high-heat-flux electronics
inferred← citeshttps://doi.org/10.2172/1215166openalex-snapshot
Characterization of Contact and Bulk Thermal Resistance of Laminations for Electric Machines
inferred← citeshttps://doi.org/10.2172/1220540openalex-snapshot
FY 2013 Annual Progress Report for the Advanced Power Electronics and Electric Motors Program
inferred← citeshttps://doi.org/10.2172/1220546openalex-snapshot
FY2014 Electric Drive Technologies Annual Progress Report
inferred← citeshttps://doi.org/10.23919/icep-iaac64884.2025.11002889openalex-snapshot
A Fundamental Study on Interfacial Properties of Indium Thermal Interface Materials
inferred← citeshttps://doi.org/10.23919/mixdes62605.2024.10613973openalex-snapshot
Influence of Parasitic Capacitances and Inductances in a Power Electronic Converter on Junction Temperature of Power GaN HEMTs
inferred← citeshttps://doi.org/10.3390/app12031348openalex-snapshot
Improvement of Heat Transfer Properties through TiO2 Nanosphere Monolayer Embedded Polymers as Thermal Interface Materials
inferred← citeshttps://doi.org/10.3390/biom11020132openalex-snapshot
Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
inferred← citeshttps://doi.org/10.3390/c6020026openalex-snapshot
Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials
inferred← citeshttps://doi.org/10.3390/coatings13020238openalex-snapshot
Cu Metallization of Al2O3 Ceramic by Coating Deposition from Cooled- and Hot-Target Magnetrons
inferred← citeshttps://doi.org/10.3390/electronics13010154openalex-snapshot
A Datasheet-Driven Electrothermal Averaged Model of a Diode–MOSFET Switch for Fast Simulations of DC–DC Converters
inferred← citeshttps://doi.org/10.3390/mi17050527openalex-snapshot
Synthesis of Alumina Nanoparticles Using Plasma-Induced Microbubbles
inferred← citeshttps://doi.org/10.3390/nano11071699openalex-snapshot
Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance
inferred← citeshttps://doi.org/10.37099/mtu.dc.etdr/34openalex-snapshot
TRANSIENT THERMOELECTRIC SUPERCOOLING: ISOSCELES CURRENT PULSES FROM A RESPONSE SURFACE PERSPECTIVE AND THE PERFORMANCE EFFECTS OF PULSE COOLING A HEAT GENERATING MASS
inferred← citeshttps://doi.org/10.3897/j.moem.4.2.33391openalex-snapshot
Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators
inferred← citeshttps://doi.org/10.4071/001c.74612openalex-snapshot
Silicone Migration Risks and Mitigation in Thermal Materials
inferred← citeshttps://doi.org/10.4271/2011-01-0344openalex-snapshot
Development of Integrated Modular Motor Drive for Traction Applications
inferred← citeshttps://doi.org/10.4271/2014-01-0797openalex-snapshot
Transient Liquid Phase Sintering (TLPS) Conductive Adhesives for High Temperature Automotive Applications
inferred← citeshttps://doi.org/10.4271/2022-28-0446openalex-snapshot
A Review on Immersion Cooling for Power Electronics
inferred← citeshttps://doi.org/10.48550/arxiv.2106.02180openalex-snapshot
Noncured Graphene Thermal Interface Materials: Minimizing the Thermal Contact Resistance
inferred← citeshttps://doi.org/10.6113/jpe.2016.16.5.1843openalex-snapshot
Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding
inferred← citeshttps://doi.org/10.6117/kmeps.2014.21.3.007openalex-snapshot
Heat Dissipation Technology of IGBT Module Package
inferred← citeshttps://doi.org/10.70675/23ca0c02z9332z449aza2a6za8758e0c5634openalex-snapshot
Refroidissement liquide diélectrique pour les futurs modules de puissance 20 kV
inferred← citeshttps://doi.org/10.70675/b0578c64z8528z4096z8793za6db1f29cc01openalex-snapshot
Fatigue thermomécanique des connexions dans les modules de puissance à semi-conducteurs.
Editorial review for independent work. ICSAC — the Institute for Complexity Science and Advanced Computing — runs a structured editorial panel for researchers publishing outside journals, and publishes on CiteStamp rails. Submission is free and goes through ORCID: icsacinstitute.org/submit.