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Laser-processed wickless vapor chambers harness phase change enabling forced-air cooling of high-heat-flux electronics

https://doi.org/10.2139/ssrn.6153660
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Phase change cooling in data centers: A review
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Wick-free paradigm for high-performance vapor-chamber heat spreaders
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Key design and operating parameters for enhancing dropwise condensation through wettability patterning
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Review of jet impingement cooling of electronic devices: Emerging role of surface engineering
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A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance
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A critical review of traditional and emerging techniques and fluids for electronics cooling
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Economic analysis of data center cooling strategies
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Patterning Wettability for Open-Surface Fluidic Manipulation: Fundamentals and Applications
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Scaling Laws in Directional Spreading of Droplets on Wettability-Confined Diverging Tracks
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A Scalable Methodology for Reinstating the Superhydrophilicity of Ambient-Contaminant Compromised Surfaces
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How to stop data centres from gobbling up the world’s electricity
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Bioinspired thermally conducting packaging for heat management of high performance electronic chips
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Thermal interface materials for power electronics applications
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Cooling a Microprocessor Chip
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Thermal Challenges in Next-Generation Electronic Systems
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Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
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Thermal management of LEDs: package to system
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Influence of freestream values on k-omega turbulence model predictions
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Two-equation eddy-viscosity turbulence models for engineering applications
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Experimental Investigation of Thin PCM Packages and Thermal Spreader for Thermal Management of Portable Electronic Devices
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