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Compact Multilayer Bandpass Filter Using Low-Temperature Additively Manufacturing Solution
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1016/j.addma.2017.10.002openalex-snapshot
3D printing electronic components and circuits with conductive thermoplastic filament
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Direct-write printed broadband inductors
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Design of compact wideband LTCC filter using pentagonal-shaped SIR
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Multi‐material additive manufacturing of embedded low‐profile antennas
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3D-Printed Low-Profile Single-Substrate Multi-Metal Layer Antennas and Array With Bandwidth Enhancement
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High frequency performance of multilayer ceramic capacitors
inferredcites →https://doi.org/10.1109/lawp.2015.2465842openalex-snapshot
A 94-GHz Dual-Polarized Microstrip Mesh Array Antenna in LTCC Technology
inferredcites →https://doi.org/10.1109/led.2017.2739186openalex-snapshot
Compact On-Chip Bandpass Filter With Improved In-Band Flatness and Stopband Attenuation in 0.13- $\mu \text{m}$ (Bi)-CMOS Technology
inferredcites →https://doi.org/10.1109/lmwc.2017.2734771openalex-snapshot
Ultracompact 60-GHz CMOS BPF Employing Broadside-Coupled Open-Loop Resonators
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3-D Printed Circularly Polarized Modified Fresnel Lens Operating at Terahertz Frequencies
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Single-Ended-Fed High-Gain LTCC Planar Aperture Antenna for 60 GHz Antenna-in-Package Applications
inferredcites →https://doi.org/10.1109/tap.2019.2950868openalex-snapshot
A $Ka$ -Band 3-D-Printed Wideband Stepped Waveguide-Fed Magnetoelectric Dipole Antenna Array
inferredcites →https://doi.org/10.1109/tcpmt.2013.2255333openalex-snapshot
Integration of Quadruple Linearly-Polarized Microstrip Grid Array Antennas for 60-GHz Antenna-in-Package Applications
inferredcites →https://doi.org/10.1109/tcpmt.2014.2346240openalex-snapshot
LTCC Bandpass Filter With Wide Stopband Based on Electric and Magnetic Coupling Cancellation
inferredcites →https://doi.org/10.1109/ted.2014.2325491openalex-snapshot
Increased Multilayer Fabrication and RF Characterization of a High-Density Stacked MIM Capacitor Based on Selective Etching
inferredcites →https://doi.org/10.1109/ted.2016.2644728openalex-snapshot
Combination of E-Jet and Inkjet Printing for Additive Fabrication of Multilayer High-Density RDL of Silicon Interposer
inferredcites →https://doi.org/10.1109/ted.2017.2659741openalex-snapshot
Low-Temperature, Solution-Processed, 3-D Complementary Organic FETs on Flexible Substrate
inferredcites →https://doi.org/10.1109/ted.2018.2876324openalex-snapshot
Microwave On-Chip Bandpass Filter Based on Hybrid Coupling Technique
inferredcites →https://doi.org/10.1109/ted.2019.2922424openalex-snapshot
Next-Generation 3D Printed Microfluidic Membraneless Enzymatic Biofuel Cell: Cost-Effective and Rapid Approach
inferredcites →https://doi.org/10.1109/tie.2018.2863219openalex-snapshot
A Compact 16-Way High-Power Combiner Implemented Via 3-D Metal Printing Technique for Advanced Radio-Frequency Electronics System Applications
inferredcites →https://doi.org/10.1109/tmtt.2016.2601907openalex-snapshot
Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies
inferredcites →https://doi.org/10.1109/tmtt.2017.2697855openalex-snapshot
Compact High-Isolation LTCC Diplexer Using Common Stub-Loaded Resonator With Controllable Frequencies and Bandwidths
inferredcites →https://doi.org/10.1109/tmtt.2019.2934456openalex-snapshot
3-D Printed Bandpass Filters With Coupled Vertically Extruded Split Ring Resonators
inferredcites →https://doi.org/10.23919/eumc48046.2021.9338141openalex-snapshot
A Fully Integrated Conductive and Dielectric Additive Manufacturing Technology for Microwave Circuits and Antennas
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
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Compact LTCC filter with wide stopband for 5G applications
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Additive manufacturing of advanced electronic devices: a comprehensive review of materials, processes, and applications
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Multiband, continuously tunable filter in 100–300 GHz range using a two-layer cavity of perforated, all-dielectric metasurfaces
inferred← citeshttps://doi.org/10.1016/j.addma.2023.103856openalex-snapshot
Additive manufacturing of low-temperature co-fired ceramic substrates and surface conductors based on material jetting
inferred← citeshttps://doi.org/10.1016/j.ast.2025.110443openalex-snapshot
3D printed and circularly polarized 28 GHz patch antenna array for small satellite communications
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Additively manufactured conductive and dielectric 3D metasurfaces for independent manipulation of broadband orbital angular momentum
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Monolithic Passive Dual-Resonator Smart Washer Fabricated by Multi-Material Jetting for Near-Field Monitoring
inferred← citeshttps://doi.org/10.1109/apmc52720.2021.9661654openalex-snapshot
Additively Manufactured Multi-Layer Bandpass Filter Based on Vertically Integrated Composite Right and Left Handed Resonator
inferred← citeshttps://doi.org/10.1109/apmc60911.2024.10867284openalex-snapshot
Design of Bandpass Filter on Multilayer Organic Substrate for WiFi Communication
inferred← citeshttps://doi.org/10.1109/edtm53872.2022.9798133openalex-snapshot
Unique multi -level metal layer electronics solutions offered by advanced 3D printing
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Efficient Microwave Rectifier With Minimized Size
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3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications
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A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation
inferred← citeshttps://doi.org/10.1109/mmm.2022.3205718openalex-snapshot
Single- and Multiple-Material Additively Manufactured Electronics: A Further Step From the Microwave-to-Terahertz Regimes
inferred← citeshttps://doi.org/10.1109/mms55062.2022.9825497openalex-snapshot
Preliminary Results on a Compact Duplexer Design for K/Ka-Band SatCom on the Move User Terminals
inferred← citeshttps://doi.org/10.1109/ojap.2025.3562292openalex-snapshot
Additive Manufacturing of Antennas and RF Components for SATCOM: A Review
inferred← citeshttps://doi.org/10.1109/tcpmt.2024.3469638openalex-snapshot
Additively Manufactured Wideband Transition From Microstrip to Empty SIW at Ku-Band
inferred← citeshttps://doi.org/10.1109/tcpmt.2024.3469868openalex-snapshot
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inferred← citeshttps://doi.org/10.1109/ted.2021.3117934openalex-snapshot
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inferred← citeshttps://doi.org/10.1109/tmat.2024.3440889openalex-snapshot
Additive Manufacturing Materials and Processes for Passive Electronics in Wireless Communication
inferred← citeshttps://doi.org/10.1109/tmtt.2023.3331824openalex-snapshot
3-D Printed Vertically Integrated Composite Right/Left-Handed Transmission Line and Its Applications to Microwave Circuits
inferred← citeshttps://doi.org/10.1109/tmtt.2024.3392434openalex-snapshot
Wideband Broadside-Coupled Line Baluns Enabled by Multimaterial Additive Manufacturing
inferred← citeshttps://doi.org/10.1109/tmtt.2025.3541956openalex-snapshot
An Iterative Extremely Accurate Generalized Design Methodology for TSV-Based Hybrid AlScN FBAR and IPD Filtering Chips
inferred← citeshttps://doi.org/10.1109/tmtt.2025.3552214openalex-snapshot
3-D-Printed Ultracompact Butler Matrix for Wideband Millimeter-Wave Beamforming
inferred← citeshttps://doi.org/10.1109/tmtt.2025.3578723openalex-snapshot
Suppression-Enhanced Edge-Coupling Capacitors for Microwave and Millimeter-Wave LTCC On-Chip Single-Ended and Differential Filters
inferred← citeshttps://doi.org/10.1109/wamicon57636.2023.10124923openalex-snapshot
3D-Printed Low-Profile X-Band Tunable Phase Shifter
inferred← citeshttps://doi.org/10.21203/rs.3.rs-8864892/v1openalex-snapshot
Effect of processing conditions on the electromechanical behaviour of inkjet-printed multimaterial electronics under tensile strain
inferred← citeshttps://doi.org/10.23919/eucap53622.2022.9769224openalex-snapshot
3D Printed Millimetre-Wave and Sub-Terahertz Devices: Prospects, Challenges, and Solutions
inferred← citeshttps://doi.org/10.2528/pierc23111903openalex-snapshot
Q-Learning Empowered Cavity Filter Tuning with Epsilon Decay Strategy
inferred← citeshttps://doi.org/10.32362/2500-316x-2023-11-5-34-44openalex-snapshot
Investigation of the profilogram structure of microstrip microwave modules manufactured using additive 3D-printing technology
inferred← citeshttps://doi.org/10.3390/electronics14203992openalex-snapshot
A Novel Multi-Mode Resonator-Based Ultra-Wideband Bandpass Filter Topology
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Miniaturized Frequency Selective Surface for 6G Communication
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Implementation of agile die-level TSV formation and heterogeneous integration with standard multi-project wafer shuttle dies
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