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Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
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Inkjet printed, conductive, 25 μm wide silver tracks on unstructured polyimide
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3D printing based on imaging data: review of medical applications
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Evaluation of 3D Printing and Its Potential Impact on Biotechnology and the Chemical Sciences
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Geometric control of inkjet printed features using a gelating polymer
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Fostering Mainstream Adoption of Industrial 3D Printing: Understanding the Benefits and Promoting Organizational Readiness
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3D printing technique applied to rapid casting
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RF Interconnections for Paper Electronics
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Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages
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Inkjet printing of passive microwave circuitry
inferredcites →https://doi.org/10.1109/mwsym.2014.6848597openalex-snapshot
High resolution aerosol jet printing of D- band printed transmission lines on flexible LCP substrate
inferredcites →https://doi.org/10.1109/mwsym.2015.7167016openalex-snapshot
3D printed multilayer microstrip line structure with vertical transition toward integrated systems
inferredcites →https://doi.org/10.1109/tap.2007.891855openalex-snapshot
Design of 3-D Monolithic MMW Antennas Using Ceramic Stereolithography
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inferredcites →https://doi.org/10.1109/temc.2015.2418255openalex-snapshot
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CPW-TO-STRIPLINE VERTICAL VIA TRANSITIONS FOR 60GHZ LTCC SOP APPLICATIONS
What points at this work
Incoming claims: where this work appears in other papers’ reference lists and arguments.
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Technologie aérosol appliquée à l'intégration 3D et aux composants hyperfréquences
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