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Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder

https://doi.org/10.2139/ssrn.4686083
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High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds
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EBSD characterisation of grain size distribution and grain sub-structures for ferritic steel weld metals
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Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient
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Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
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Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering
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Large tensile plasticity in Zr-based metallic glass/stainless steel interpenetrating-phase composites prepared by high pressure die casting
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Interfacial Structures and Mechanical Properties of Cu/Sn/Cu Containing Sic Nanowires Under Transient Liquid Phase Bonding
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Study on the interfacial evolution and mechanical properties of Cu/SAC105/Cu solder joint modified by Si3N4 nanowires
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Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
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Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam
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Formation of intermetallic compounds in reaction between Cu–Ni alloys and solid Sn – a new look at the prominent effect of Ni
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Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
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Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles
inferredcites →https://doi.org/10.1016/j.jmrt.2023.04.228openalex-extracted
Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints
inferredcites →https://doi.org/10.1016/j.jmrt.2023.06.193openalex-extracted
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
inferredcites →https://doi.org/10.1016/j.matchar.2020.110287openalex-extracted
Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
inferredcites →https://doi.org/10.1016/j.matchar.2023.112972openalex-extracted
Study on the metallurgical reaction law and mechanism of the Ni-xCu alloys/pure Sn solid-liquid interface
inferredcites →https://doi.org/10.1016/j.matchar.2023.113133openalex-extracted
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
inferredcites →https://doi.org/10.1016/j.matdes.2016.04.068openalex-extracted
Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
inferredcites →https://doi.org/10.1016/j.matdes.2016.06.099openalex-extracted
Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures
inferredcites →https://doi.org/10.1016/j.matdes.2018.09.017openalex-extracted
Bonding through novel solder-metallic mesh composite design
inferredcites →https://doi.org/10.1016/j.matdes.2022.111204openalex-extracted
Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging
inferredcites →https://doi.org/10.1016/j.msea.2013.10.094openalex-extracted
Influence of grain size distribution on the Hall–Petch relationship of welded structural steel
inferredcites →https://doi.org/10.1016/j.msea.2016.12.058openalex-extracted
Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
inferredcites →https://doi.org/10.1016/j.msea.2020.139691openalex-extracted
Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil
inferredcites →https://doi.org/10.1016/j.mtcomm.2022.104623openalex-extracted
Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite
inferredcites →https://doi.org/10.1016/j.mtcomm.2023.105730openalex-extracted
Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
inferredcites →https://doi.org/10.1016/j.pmatsci.2023.101131openalex-extracted
Seventy years of Hall-Petch, ninety years of superplasticity and a generalized approach to the effect of grain size on flow stress
inferredcites →https://doi.org/10.1016/j.scriptamat.2004.06.002openalex-extracted
Hall–Petch relation and boundary strengthening
inferredcites →https://doi.org/10.1016/j.ultsonch.2022.106244openalex-extracted
Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder
inferredcites →https://doi.org/10.1038/s41598-018-35708-6openalex-extracted
Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging
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Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
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