On the public citation graph
Thermally and structurally robust design of through-glass via arrays via multi-objective optimization and machine learning-based geometry prediction
0 signed · 36 inferred · view as graph
Inferred edges come from two machine sources: sweeps of open repository metadata (mostly SSRN and Zenodo), and a bulk OpenAlex citation snapshot. Every row below is labelled with the one it came from. Neither is a complete citation index — absence here is not evidence of absence.
Is this your work? Sign in with ORCID and put your name on the
claims that are yours.
Reference health. See whether every reference in this work resolves to a
known work and none has been retracted — and get a dated CiteStamped
badge you can embed.
What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
inferredcites →https://doi.org/10.1007/978-0-387-84858-7openalex-snapshot
The Elements of Statistical Learning: Data Mining, Inference, and Prediction
inferredcites →https://doi.org/10.1007/978-1-4612-4380-9_35openalex-snapshot
Robust Estimation of a Location Parameter
inferredcites →https://doi.org/10.1007/978-3-642-35289-8_25openalex-snapshot
Stochastic Gradient Descent Tricks
inferredcites →https://doi.org/10.1007/s00339-022-05404-4openalex-snapshot
Rapid formation of high aspect ratio through holes in thin glass substrates using an engineered, QCW laser approach
inferredcites →https://doi.org/10.1007/s12540-011-0214-0openalex-snapshot
Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration
inferredcites →https://doi.org/10.1016/j.compfluid.2022.105351openalex-snapshot
Effects of cell quality in grid boundary layer on the simulated flow around a square cylinder
inferredcites →https://doi.org/10.1016/j.mee.2015.11.012openalex-snapshot
Analytical and finite element modeling of through glass via thermal stress
inferredcites →https://doi.org/10.1016/j.microrel.2017.02.001openalex-snapshot
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
inferredcites →https://doi.org/10.1016/j.optlaseng.2025.109106openalex-snapshot
Fabrication and analysis of through-glass vias for glass-based electronic packaging using an ultrashort pulsed laser
inferredcites →https://doi.org/10.1016/j.scriptamat.2022.114900openalex-snapshot
Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature
inferredcites →https://doi.org/10.1016/j.tsep.2022.101618openalex-snapshot
A finite volume numerical approach for predicting heat transfer in presence of thermal contact resistance
inferredcites →https://doi.org/10.1016/j.tsf.2004.08.136openalex-snapshot
Precision glass machining, drilling and profile cutting by short pulse lasers
inferredcites →https://doi.org/10.1016/s0924-4247(98)00310-0openalex-snapshot
Wafer bonding for microsystems technologies
inferredcites →https://doi.org/10.1080/00401706.1970.10488634openalex-snapshot
Ridge Regression: Biased Estimation for Nonorthogonal Problems
inferredcites →https://doi.org/10.1109/ectc.2010.5490887openalex-snapshot
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
inferredcites →https://doi.org/10.1109/ectc32696.2021.00076openalex-snapshot
Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration
inferredcites →https://doi.org/10.1109/edtm.2018.8421453openalex-snapshot
An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor
inferredcites →https://doi.org/10.1109/edtm.2019.8731186openalex-snapshot
The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking
inferredcites →https://doi.org/10.1109/jproc.2008.2007463openalex-snapshot
High-Density Through Silicon Vias for 3-D LSIs
inferredcites →https://doi.org/10.1109/tit.1967.1053964openalex-snapshot
Nearest neighbor pattern classification
inferredcites →https://doi.org/10.1109/tvlsi.2009.2038165openalex-snapshot
Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies
inferredcites →https://doi.org/10.1111/j.1467-9868.2005.00503.xopenalex-snapshot
Regularization and Variable Selection Via the Elastic Net
inferredcites →https://doi.org/10.1111/j.2517-6161.1996.tb02080.xopenalex-snapshot
Regression Shrinkage and Selection Via the Lasso
inferredcites →https://doi.org/10.1116/6.0000026openalex-snapshot
Tutorial on forming through-silicon vias
inferredcites →https://doi.org/10.1126/sciadv.adv4436openalex-snapshot
Ultrahigh-speed laser drilling of transparent materials via transient electronic excitation
inferredcites →https://doi.org/10.1149/07509.0117ecstopenalex-snapshot
Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding
inferredcites →https://doi.org/10.1201/9781315139470openalex-snapshot
Classification And Regression Trees
inferredcites →https://doi.org/10.1364/oe.18.023488openalex-snapshot
Very large spot size effect in nanosecond laser drilling efficiency of silicon
inferredcites →https://doi.org/10.1364/oe.549850openalex-snapshot
Optimizing laser-induced deep etching technique for micromachining of NXT glass
inferredcites →https://doi.org/10.1364/ome.467696openalex-snapshot
Enhanced throughput and clean laser drilling with a sacrificial polymer layer
inferredcites →https://doi.org/10.4028/www.scientific.net/amr.482-484.2381openalex-snapshot
Low Temperature Wafer Direct Bonding Using Wet Chemical Treatment
inferredcites →https://doi.org/10.4071/1551-4897-7.1.35openalex-snapshot
Critical Issues of TSV and 3D IC Integration
inferredcites →https://doi.org/10.6117/kmeps.2014.21.2.053openalex-snapshot
Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging
Editorial review for independent work. ICSAC — the Institute for Complexity
Science and Advanced Computing — runs a structured editorial panel for researchers
publishing outside journals, and publishes on CiteStamp rails. Submission is free
and goes through ORCID: icsacinstitute.org/submit.